Mingseal Technology will showcase its latest semiconductor process solutions at SEMICON Taiwan 2026, taking place September 2–4, 2026, at the Taipei Nangang Exhibition Center. As one of the Asia–Pacific region’s most influential industry events, this year’s show emphasizes high-efficiency AI compute, 3D/2.5D advanced packaging, and Chiplet technologies, bringing together global supply-chain partners, technical innovators, and OEMs to exchange insights and accelerate industrial collaboration.

With rapid iterations in AI compute chips and ADAS automotive devices, demand is rising for FOPLP and SiP heterogeneous integration and advanced flip-chip bonding capacity expansion. Precision Underfill, chip thermal stability, and high-quality precision materials processing have become critical factors in semiconductor process upgrades. Drawing on its deep knowledge of advanced-process pain points, Mingseal Technology will present its self-developed core equipment and mature, reliable solutions to support the semiconductor industry’s evolving needs.

Underfill and Panel-Level Solutions

• Panel-level Underfill — SS500 Designed for 310 × 310 mm fan-out panel (FoPLP) applications, the SS500 features an independent dual-valve dispensing system and an anti-warp mechanical mechanism. It provides precise temperature control and automatic calibration throughout panel processing, meeting underfill production requirements while ensuring operational safety.
• Panel-level Underfill — SS300 Targeting larger FoPLP panels (515 × 510 mm and 600 × 600 mm), the SS300 integrates automated panel loading/unloading with dispensing capabilities. It supports fully automated panel handling, alignment, preheating, process heating, anti-warp measures, dispensing, and glue-shape AOI inspection.
• Wafer-Level Underfill — SS101 Wafer-level Underfill Supporting 12-inch fan-out wafer-level packaging formats (CoWoS, HDFO, FoPoP, FoWLP, etc.), the
• SS101 provides fine-grained temperature control and automatic correction throughout wafer handling and processing to meet CUF process requirements while protecting product integrity.
• Chip-Level Underfill — GS700SU Large-Format Chip Underfill Built for larger, high-value FCBGA packages, the GS700SU delivers high UPH and full-process inspection capability, suitable for AI/HPC applications and demanding underfill processes.
• GS600SUA Chip Underfill Designed for FCBGA/FCCSP packages, the GS600SUA enforces strict temperature control for products and adhesives, intelligently sequences operations and re-dispensing timing to minimize voids and maximize yield.

Chip Thermal Management Solutions

• SS400 Heatsink Placement For large-package FCBGA heatsink placement, the SS400 supports high-efficiency TIM1/TIM2 thermal solutions and a range of thermal interface materials including thermal grease, indium shims (including no‑flux variants), graphene, diamond and composite diamond materials. Supporting processes include flux dispensing, passive component damming, and filling.
• SS200 Heatspreader Lid Placement The SS200 handles heatspreader/heat-sink lid placement for FCBGA packages, including AD and TIM adhesive application, lid placement, and thermal-pressing operations.

Precision Cutting Solutions

• MLS300 Ultra-Precision Water‑Guided Laser Processing For hard and brittle materials such as ceramics, silicon carbide, and diamond, the MLS300 performs high-precision slotting, micro-drilling, and precision cutting for wafers, ceramic substrates, and diamond heat-spreader plates. Process accuracy can be held within ±10 µm.
• MLS305 Five‑Axis Water‑Guided Laser Processing The MLS305 is intended for complex spatial surfaces—including high‑pressure turbine blades, PCD tools, and aerospace structural parts—providing high-precision slotting, drilling, and cutting at arbitrary angles and complex contours.

Exhibition Details

Dates: September 2–4, 2026
Location: Taipei Nangang Exhibition Center, Taiwan
Booth: N1192 (4F)
Mingseal Technology looks forward to meeting partners and customers on site to discuss the future of precision semiconductor manufacturing.