The Rising Complexity of 2.5D Packaging

Chip on Wafer on Substrate (CoWoS) has quickly become one of the most important packaging technologies in the semiconductor industry. By stacking logic and memory dies on a silicon interposer and then mounting the whole structure on a substrate, CoWoS enables high bandwidth, reduced latency, and improved power efficiency for next-generation computing devices.

How Temperature Fluctuations Affect Wafer-Level Dispensing

In a 2.5D environment, even slight temperature variations can create capillary flow issues:

Overflow or air gaps if resin viscosity decreases unexpectedly
Voids and bridging caused by uneven underfill flow
Resin cracks or delamination due to thermal stress during curing
Inconsistent fill depths, especially in stacked structures with low stand-off height
This makes temperature compensation systems a key factor in achieving yield and reliability at scale.

 
SS101: Built for Thermal Stability

The SS101 Wafer-Level Dispensing Machine integrates a comprehensive thermal management and compensation system designed for 2.5D and Fan-Out applications.

Key features include:

• Preheating & uniform chuck table heating — ensures resin reaches an optimal flow state before dispensing begins.
• Real-time temperature correction — actively adjusts for environmental and process variations.
• Dedicated underfill valve design — prevents clogging and bubble formation even under thermal shifts.
• Programmable dispensing path — maintains precision across complex wafer layouts with varying fill depths.

By keeping material viscosity and flow consistent, the SS101 reduces defect rates and improves throughput in mass production.

Why Taiwan Needs Advanced Temperature Compensation

Taiwan, as one of the world’s largest semiconductor packaging hubs, faces unique challenges in wafer-level production. The combination of high local humidity and densely packed advanced packaging lines amplifies the risk of thermal variation during dispensing.

With rising demand for HPC chips, AI processors, and consumer electronics, manufacturers in Taiwan require systems like the SS101 that integrate weighing calibration, full-process monitoring, and strict ESD protection while maintaining temperature stability across production shifts.

This ensures that sensitive wafers are protected and yield loss is minimized, directly reducing scrap rates and improving line efficiency.

Toward a Stable Future in 2.5D Packaging

As 2.5D and wafer-level packaging continue to push performance boundaries, temperature compensation technology is emerging as a decisive factor in production quality. Systems like the SS101 not only support fine-pitch, small bump encapsulation but also create a robust framework for future semiconductor packaging innovations.

For Taiwan’s semiconductor ecosystem, investing in temperature-stable dispensing platforms is not just about solving today’s challenges — it is about securing a reliable foundation for the next generation of high-performance computing.