Changzhou Mingseal Robot Technology Co., Ltd.

Customer scenario A South Korean smartphone camera module manufacturer needed a compact, high-throughput solution to apply dust‑capture adhesive to infrared (IR) filters used in front‑camera assemblies. The customer required simultaneous handling of two process steps on a single platform—reinforcement (structural support) and UV/thermal cure application—without increasing footprint. Challenges included fine-line dispensing inside tight optical cavities, consistent adhesive volume for optical performance, and a desire to raise UPH by running two stations in parallel while keeping maintenance and changeover simple. Solution overview — Mingseal FS200A dual‑head inline dispenser Mingseal deployed the FS200A configured as a dual‑station, dual‑head inline dispensing machine tailored for IR filter dust‑capture adhesive (catch‑and‑hold) and reinforcement/curing operations. The system’s combination of precision motion, syringe cartridge feed with heated sleeve options, piezo valve capability and integrated vision alignment addressed the customer’s demands for speed, accuracy and process flexibility. Key process features Dual independent stations (one machine, two processes): The FS200A’s separated track and dual‑valve architecture allow simultaneous operation of two workstations. One head performs micro‑dot and bead patterns for dust‑capture adhesive around the IR filter edges; the second head applies reinforcement adhesive or a thin pre‑coat designed for later curing and structural bonding. Running both stations in parallel increased UPH without adding additional hardware. Piezo valve adaptability: For micro‑volume, non‑contact dotting, a piezo valve option delivered droplet control down to sub‑nanoliter to nanoliter regimes suitable for narrow optical gaps. Valve pulse tuning minimized stringing and ensured consistent dot geometry during high‑speed operation. For thicker reinforcement adhesive, the second valve option used rapid valve/pump metering to deposit controlled beads with repeatable mass. Precision motion and vision alignment: High‑resolution motion control (≤±10 μm repeatability) combined with integrated cameras enabled fiducial and feature alignment across the 330 × 205 mm work envelope. Fly‑align at production speeds preserved placement accuracy when switching between single and dual‑track modes. Syringe heating and rheology control: Optional heated sleeves and full recipe control preserved adhesive viscosity for consistent flow and wetting. Temperature setpoints were locked per recipe to prevent over‑ or under‑apply that could affect optical clarity or curing behavior. One‑machine two‑use flexibility and easy changeover: The FS200A’s recipe storage and MES/PLC interfaces allowed quick switching between product families (different IR filter sizes or adhesive chemistries). The isolated track design meant one station could be serviced while the other continued production, minimizing line downtime. Production results and benefits UPH improvement: Running dual stations in parallel increased effective throughput by up to ~80% for dust‑capture + reinforcement cycles compared to a single‑station workflow, substantially raising line capacity without expanding floor space. Better optical and functional yield: Consistent micro‑dot volume and precise placement reduced particle entrapment and adhesive overflow, lowering rework rates and improving camera image quality and autofocus performance. Robust curing and mechanical protection: Controlled reinforcement deposits ensured reliable cure and mechanical stability during subsequent assembly steps, protecting delicate IR filter edges and improving long‑term durability. Lower maintenance impact: The separated track design and independent valve systems reduced full‑line stoppages; piezo valve tuning and syringe heating minimized stringing and clogging, lowering consumable waste and maintenance frequency. Conclusion For Korean smartphone camera manufacturers requiring high‑precision dust‑capture adhesive application on IR filters, the FS200A delivers a compact, dual‑use inline solution that raises UPH and product quality. By combining piezo and fast‑meter valves, heated syringe control, vision‑guided placement and a dual‑station layout, Mingseal’s FS200A secures consistent optical performance, faster throughput and lower downtime—supporting scalable production for advanced mobile camera assemblies. Contact Mingseal to pilot the FS200A with your adhesive formulations and IR filter designs.

In the ever-evolving world of electronics manufacturing, precision and efficiency are paramount. Mingseal has revolutionized the production of hearing aid components, specifically focusing on the application of its AC100 fully-automatic mounting and precision dispensing machine. This innovative solution addresses the unique challenges faced in mounting sound membranes and shells for inductive components, transitioning from manual labor to an automated process that significantly enhances operational efficiency while effectively controlling adhesive application issues. The Challenge The production of medical hearing aid components demands exceedingly high precision and cleanliness. Manual handling often introduces the risk of contamination, such as dust or particles, leading to misalignment, optical loss, and costly rework. Traditional methods struggle to achieve the required sub-millimeter placement accuracy, which can result in failures compromising the final product's performance. The Root Cause The primary causes of these issues are inadequate manual handling practices and poorly controlled automated cells. These weaknesses allow particles to infiltrate the cleaning environment, creating small positional errors and resulting in inconsistent adhesive application. Furthermore, with traditional methods, excess glue or misapplied adhesive can lead to performance inefficiencies and costly delays in production. The Solution Mingseal's AC100 machine embeds a solution to these challenges by implementing a closed, clean handling cell equipped with a camera-guided unit and precise multi-axis positioning. By offering features such as automatic substrate loading and unloading, precision adhesive dispensing, and inline glue shape inspection, the AC100 ensures repeatable placement while maintaining a pristine assembly environment. The machine is capable of using epoxy glue with eight to twelve dots, each with a diameter of 0.27mm, applied with precision that promotes reliable optical performance. Moreover, the transition from manual handling to automated processes not only enhances the efficiency of operations but also minimizes human error. The integration of international semiconductor communication protocols and alignment with smart factory MES systems emphasizes the AC100's capability in modern, digitalized manufacturing environments, ensuring that it meets the latest industry standards. Core Modules of the AC100 Dispensing Module: Utilizes a linear motor for high-speed, high-precision dispensing. Mounting Head: Combines linear motors and DD motors for precision position compensation, enabling accurate component placement. Tilting Module: Allows dispensing at angles of ±30°, expanding application versatility. Vision Module: Featuring automatic focusing capabilities for height recognition, accommodating products of varying heights. Successful Implementation in Vietnam Currently, the AC100 has been successfully implemented in several real-world applications in Vietnam, demonstrating its effectiveness in producing high-quality hearing aid components. This application shows a significant upgrade in productivity and quality assurance, fulfilling the stringent demands of the medical device industry. Conclusion Mingseal's AC100 is paving the way for advanced automation in the electronics industry, particularly in the production of hearing aid components. By effectively addressing the issues of manual handling, adhesive application, and component placement accuracy, the AC100 not only enhances operational efficiency but also ensures consistent, high-quality output that meets the rigorous standards of the medical device sector. With proven results in Vietnam, the AC100 stands as a beacon of innovation in an industry that thrives on precision and reliability.

Overview The GS700SU is a high-speed, high-precision dispensing system purpose-built for large-package FCBGA underfill. Designed to meet the thermal and structural demands of AI and high-performance computing (HPC) modules, the GS700SU delivers robust throughput, full inspection and production-grade process control in large-format underfill applications. Customer challenge A Texas manufacturer producing large FCBGA modules required a reliable, automated underfill cell that supports larger package footprints and board boats while maintaining void‑free capillary underfill and traceable process control. The line needed to integrate into cleanroom flow, support multiple track configurations for high UPH, and provide full inspection to protect the high value of finished modules used in AI/HPC systems. Mingseal GS700SU solution The GS700SU was deployed for large‑package FCBGA bottom fill. Key configuration and process capabilities delivered to the Texas customer include: Large boat & flexible track support: The system accepts maximum boat sizes up to 325 × 325 mm in a dual‑track / four‑workstation / dual‑head layout, and supports 325 × 162 mm boats with a four‑track / eight‑workstation / dual‑head configuration. This flexibility allows the customer to process large panels or split workloads for mixed production. Multi‑head, multi‑track throughput: Dual independent dispensing valves combined with a four‑track architecture enable high units‑per‑hour performance. Compared with earlier systems, the GS700SU increases effective throughput by up to 3.7×, matching factory Q‑TIME and high‑mix production demands. Underfill‑specialized dispensing: Proprietary underfill valves, tilt dispensing modules and programmable dispensing patterns support tight KOZ requirements (KOZ < 200 μm) and controlled capillary flow across tall bump geometries. The GS700SU minimizes void formation while ensuring consistent wetting under large die sizes. Full inspection and process control: An independent AOI station, high‑accuracy laser height sensing (±1 μm) and electronic weighing (0.01 mg) verify glue placement, dot mass and complete coverage. Automated glue weight adjustment, nozzle glue detection and unit dispensing trials reduce variance and improve first‑pass yield. Thermal and material management: Multi‑zone temperature control with ±1.5°C heating uniformity maintains adhesive rheology during long production runs. Intelligent sequencing of product handling and glue replenishment reduces the risk of overflow or insufficient flow in large package fills. Performance and production value High stability and yield: Tight process control and inline inspection deliver consistent underfill coverage for PKG >50 × 50 mm, lowering rework and improving downstream reliability for AI/HPC modules. Significant throughput gains: The multi‑track, dual‑head architecture enables up to 3.7× higher effective throughput versus earlier generation systems, reducing capital footprint per unit output. Compatibility with advanced designs: KOZ < 200 μm capability and minimum nozzle diameters down to 30 μm support dense passive placements and modern large die layouts. Traceability and integration: GS700SU supports semiconductor communication protocols and MES integration for full traceability of recipes, images and weight logs—critical for audit and quality control in high‑value packaging. Conclusion  For Texas-based AI/HPC module manufacturers working with large FCBGA packages, the GS700SU provides a proven underfill dispensing solution that combines high UPH, fine process capability and comprehensive inline inspection. By supporting large boat sizes, multi‑track throughput and underfill‑specific dispensing strategies, the GS700SU secures void‑free, repeatable underfill performance—reducing risk, raising yield and accelerating time to volume. Contact Mingseal to arrange a pilot, FAT, and MES integration plan tailored to your large‑format FCBGA production.