Changzhou Mingseal Robot Technology Co., Ltd.

Customer challenge An Algerian medical device manufacturer scaling production of dynamic blood glucose test strips faced tight cost targets while needing sub-microliter reagent control. Existing manual and slow jetting methods delivered inconsistent reagent volumes, high material waste and reduced enzyme activity from aggressive handling. The line required a compact, easy-to-integrate valve that could deliver repeatable micro-dosing, preserve reagent bioactivity, and stabilize throughput for long production runs. Mingseal solution: KPS2000 piezo jet valve system Mingseal supplied the KPS2000 piezo jet valves and a lightweight controller to meet the customer’s technical and cost constraints. The KPS2000 is a non-contact, high-frequency jet valve optimized for micro-volume reagent coating on sensitive biosensor pads. Key features applied in the Algerian line: Sub-nanoliter precision and high throughput: With jetting up to 1200 Hz and minimum droplet sizes in the nanoliter/sub-nanoliter range, the KPS2000 enables tight shot-to-shot volume control while meeting takt rates—reducing over‑apply and material cost per strip. Broad viscosity compatibility: The fluid path supports viscosities from 1 to 500,000 mPa·s, allowing enzyme suspensions, stabilizers and viscosity modifiers to be processed without frequent hardware changes. Lightweight, compact design: A 430 g valve body and compact controller simplify gantry or robot mounting, maintaining timing fidelity at high speed and easing retrofits on existing lines. Gentle fluid handling: Valve actuation and nozzle geometries are engineered to minimize shear and thermal stress, preserving enzyme structure and activity during dispensing. Process integration and control Implementation focused on reproducible coating recipes and closed‑loop control to guarantee uniform films across long runs: Multi-head synchronized dispensing: Four KPS2000 valves were mounted on a lightweight gantry and run in parallel to coat reagent pads simultaneously. High-frequency synchronization preserved droplet timing and uniformity across heads. Temperature and pressure management: Independent temperature control for syringes and tuned back-pressure settings maintained consistent reagent rheology. Low-energy pulses and controlled nozzle geometry prevented local heating and high shear. Inline metrology and feedback: Optical thickness measurement combined with periodic gravimetric sampling provided real-time verification of dot mass and film uniformity. Dispense parameters were auto-corrected for drift to maintain mass within tolerance. Preventive maintenance and fluid hygiene: Scheduled purge cycles and nozzle-change protocols reduced clogging and downtime, lowering consumable waste and maintaining stable runs. Results and production value Tight micro-volume control and cost savings: Shot-to-shot variance dropped to below 3%, cutting reagent overuse and materially reducing per-strip reagent costs at scale. Uniform sensor response and yield improvement: Consistent film thickness and line-width produced tightly clustered QC results, decreasing lot-to-lot variability and reject rates. Preserved reagent activity: Low-shear, low-temperature dispensing preserved enzyme activity and shelf-life, supporting regulatory consistency for clinical test strips. High throughput with simple integration: The KPS2000’s high-frequency capability and lightweight mounting allowed the plant to meet forecasted takt rates without major equipment redesign. Lower maintenance overhead: Improved fluid-path design and preventive maintenance decreased unscheduled stops and consumable waste, increasing overall equipment effectiveness. Conclusion For Algerian manufacturers producing dynamic blood glucose test strips, the KPS2000 provides an economical, high-precision jetting solution that balances micro-volume accuracy, reagent protection and production stability. By combining sub-nanoliter jetting, wide viscosity tolerance, gentle dispensing and closed-loop metrology, the KPS2000 reduces cost per unit while improving uniformity and preserving bioactivity—making it an effective choice for scalable, regulatory-compliant strip production. Mingseal offers on-site tuning, FAT validation and pilot runs to qualify dispense recipes and validate clinical sensitivity targets.

Customer scenario A leading packaging foundry in Penang, Malaysia, sought a reliable, high-throughput solution for Fan‑Out Wafer Level Package (FOWLP) Underfill production. The fab required a Class 10 clean dispensing machine that could run fully automated underfill, coating, flux spray and Dam & Fill processes for both 8‑inch and 12‑inch wafers. Key constraints included strict particle control for exposed RDL surfaces, micron‑level dispense accuracy, tight thermal management to prevent bump and substrate stress, and effective anti‑warp capability to maintain wafer flatness within ±3 mm during processing. Mingseal SS101 solution — the first domestic FOWLP wafer dispenser for mass production Mingseal deployed the SS101 as the first domestically produced wafer-level dispensing system validated for high-volume FOWLP underfill runs. Built for Class 10 compatibility and full fab integration, the SS101 addressed process control, traceability and throughput needs while minimizing contamination risk for sensitive fan‑out architectures. Key system features implemented Class 10 clean enclosure and automated workflow: The SS101 operates inside a Class 10 cleanroom‑compatible enclosure with automated FOUP/cassette loading, robotic wafer transfer, alignment, code scanning and full process orchestration. Lights‑out operation reduces human contamination and supports continuous high-volume production. Dual dispensing stations with ±10 μm positioning: Two GS600SWA/SWB dispensing heads provide high‑precision application for underfill, coating, flux spray and Dam & Fill. Positioning repeatability and motion control ensure accurate bead placement relative to delicate RDL structures and exposed bumps. Tight anti‑warp control (±3 mm): A mechanical anti‑warp and vacuum chuck system maintains wafer planarity within ±3 mm during preheat, dispense and operation heating stages. This prevents nozzle crashes and ensures consistent dispense height across the wafer for uniform underfill flow and void avoidance. Precise thermal management: Integrated preheating and heat dissipation stations hold wafers at optimized temperatures to stabilize adhesive viscosity and capillary flow. Closed‑loop temperature control minimizes thermal gradients that could stress bumps or alter flow dynamics during underfill and coating operations. Clean fab communication and traceability: SS101 supports SEMI‑compliant open communication protocols, SECS/GEM interfaces and AMHS integration for MES docking, ensuring full process traceability, recipe control and automated material handling in Penang’s smart fab environment. Process controls and quality assurance Real‑time monitoring: In‑cell sensors and cameras monitor dispense quality, bead geometry and wafer handling in real time. AOI and inline metrology detect defects early and trigger corrective actions without interrupting throughput.Recipe and lot traceability: Dispense recipes, temperature logs, images and equipment events are stored and exported to MES for auditability and consistent batch production across multiple shifts. Production outcomes and benefits for the Penang line Higher yield and reduced defects: Accurate underfill deposition, reliable anti‑warp control and tight thermal regulation reduced voiding and bump stress, increasing first‑pass yield for FOWLP assemblies.Scalable, unattended throughput: Dual dispensing stations, FOUP handling and robotic transfer enable scalable production rates with minimal operator intervention—supporting the foundry’s volume and cost targets.Seamless fab integration: SEMI‑compatible interfaces and AMHS readiness simplified deployment into existing lines in Penang, accelerating qualification and time‑to‑volume.Local support and faster ramp: As the first domestic SS101 used for FOWLP underfill mass production, Mingseal provided rapid on‑site commissioning, recipe tuning and ongoing service—shortening qualification cycles and reducing downtime. Conclusion For Penang-based semiconductor fabs tackling FOWLP underfill, coating, flux spray and Dam & Fill at scale, the SS101 offers a production‑ready, domestically engineered platform. With Class 10 compatibility, ±3 mm anti‑warp control, precise thermal management and SEMI‑compliant integration, the SS101 delivers stable, traceable underfill processes that improve yield, reliability and fab throughput. Contact Mingseal to schedule a pilot qualification and validate SS101 performance with your FOWLP materials and wafer portfolio.

Customer scenario A Taiwanese advanced packaging company pursuing local supply-chain resilience needed a reliable panel-level dispensing solution for RDL-first FOPLP (Fan‑Out Panel Level Packaging) manufacturing. Their process mix included Underfill, coating and flux spray across panel formats up to 510 × 515 mm and 600 × 600 mm. Critical challenges were precise, repeatable underfill deposition across large panels, prevention of panel warp during thermal cycles, integration with automated material handling (PGV/AGV/OHT) and full-process traceability for high-yield production. Mingseal SS300 solution — the first domestically produced FoPLP panel dispenser Mingseal delivered the SS300 as Taiwan’s first home‑grown panel-level dispensing system purpose-built for FOPLP. Engineered to meet demanding thermal, mechanical and process-control requirements of panel-level underfill and related steps, the SS300 combined production-grade throughput with industry standard automation interfaces. Key system capabilities implemented Panel compatibility and flexible handling: The SS300 supports both 510 × 515 mm and 600 × 600 mm formats, enabling the customer to run multiple product families without changeover. Automatic panel loading and unloading interfaces (PGV/AGV/OHT compatible) were configured to fit the customer’s factory OHT flow for unattended operation. Four-valve independent dispensing: Four independently controlled dispensing valves allowed concurrent multi-zone processing on a single panel or simultaneous work on several smaller panel arrays. This increased throughput and provided process flexibility for mixed recipes (underfill, coating, flux spray) in the same line. Precision underfill and coating: High-stability motion control and fine dispense metering ensured uniform bead geometry and predictable capillary flow for RDL-first underfill. Recipes for underfill, coating and flux spray were stored and recalled via the system’s recipe management to guarantee process repeatability and traceability. Robust anti-warping mechanical design: A unique mechanical anti-warping system maintains panel planarity within ±10 mm during loading, preheating, operation heating and dispensing. Combined with closed-loop temperature control, this prevents nozzle crashes and mis-deposition caused by thermal bowing common to large, thin panels. Full-process thermal management: The SS300 provides finely controlled preheat and operation heating zones. Automatic temperature correction across the process minimizes viscosity drift and improves underfill flow control—critical for complete void-free wetting in FOPLP architectures. In-line video monitoring and AOI: Whole-process video monitoring records panel turnover, dispense head motion and dispense quality. Glue-shape AOI inspects bead width and continuity, enabling immediate corrective actions and simplified problem tracing for yield optimization. Production outcomes and value for the Taiwanese line Improved yield and reliability: Accurate underfill deposition and anti-warping control reduced voiding and nozzle crashes, increasing first-pass yield in FOPLP runs and lowering scrap and rework rates. Higher throughput with flexible recipes: The four-valve architecture and automatic handling interfaces supported uninterrupted, high-mix production while maintaining consistent process parameters for underfill, coating and flux spray recipes. Seamless factory integration and traceability: Standard semiconductor communication protocols and AGV/PGV/OHT interfaces allowed easy MES docking and enabled unattended operation with full trace logs for audits and quality control. Localized support and faster ramp-up: As the first domestic system in Taiwan tailored to FOPLP, the SS300 offered faster validation, on-site tuning and supply-chain advantages compared with imported alternatives—accelerating production ramp and reducing lead times. Conclusion For Taiwanese manufacturers pursuing RDL-first FOPLP, the SS300 provides a production-ready, domestically produced panel-level dispensing platform. By combining large-panel compatibility, four-valve independent dispensing, robust anti-warping mechanics (±10 mm), precise thermal control and full-process AOI, the SS300 secures consistent underfill, coating and flux applications—supporting higher yield, reliable operation and streamlined factory integration. Contact Mingseal to schedule a site demo and process qualification for your FOPLP panel portfolio.