Changzhou Mingseal Robot Technology Co., Ltd.

Customer background A major semiconductor packaging house in Penang, Malaysia, required a reliable, high-throughput wafer-level dispensing solution to support mass production of Fan-Out Wafer-Level Packaging (FOWLP). Their production roadmap demanded an in‑fab system that could run underfill, coating, flux spray, and dam & fill processes with strict cleanliness, thermal stability, and anti-warp control for mixed 8‑inch and 12‑inch wafer lots. Technical challenge  FOWLP underfill at wafer level exposes delicate redistribution layers (RDLs) and bump structures to particulate and thermal stress. Key production constraints included: Maintaining Class 10 clean dispensing to avoid contamination on exposed wafer surfaces. Controlling wafer warpage during preheat and dispense cycles (target anti-warp ±3 mm) to preserve nozzle standoff and capillary flow behavior. Delivering sub-10 µm positional accuracy and repeatable dispense volumes across full 8/12‑inch wafer formats. Integrating with factory MES/AMHS for traceability and unmanned operation. Mingseal solution  Mingseal deployed the SS101 — the first domestically developed wafer-level dispensing cell qualified for FOWLP underfill mass production. System highlights and process adaptations for the Penang line included: Class 10 cleanroom-compatible enclosure with automated FOUP and open cassette handling to support both 12‑inch and 8‑inch wafers without cross‑contamination risk. Robotic wafer transfer and high-precision aligner for sub-10 µm placement accuracy; code scanning and MES logging provide per‑wafer traceability for recipes, images, and event history. Zoned preheating and closed‑loop thermal control to bring wafers to optimal dispensing temperature while minimizing thermal gradients that cause warpage. Dual GS600SWA/SWB dispensing stations within the SS101 cell to run underfill, conformal coating, flux spray, and dam & fill operations in a configurable sequence with ±10 µm positional control. Mechanical anti‑warp fixture and process tuning capable of compensating wafer deformation up to ±3 mm, preserving nozzle standoff and preventing tailing or void formation during capillary underfill. Post‑dispense heat dissipation station to control cool‑down rate and protect bump integrity before FOUP return, enabling consistent cure profiles and reduced stress. Production outcomes Successful FOWLP mass production: The SS101 cell enabled the customer’s transition from pilot to full-rate production for wafer-level underfill and associated processes, supporting both 8‑inch and 12‑inch wafer programs. Improved process stability: Active anti‑warp control and precise thermal management reduced underfill voiding and edge overflow, improving first-pass yield and lowering scrap. High precision and throughput: Dual dispensing stations and automated wafer handling preserved cycle time targets while maintaining sub‑10 µm positioning and repeatable dispense volumes across large wafer batches. Seamless fab integration: SEMI‑compliant communication and AMHS/MES connectivity allowed lights‑out operation, full traceability, and rapid fault diagnosis through logged process data and imaging. Conclusion  As the first domestically produced wafer-level dispensing system validated for FOWLP underfill in Penang, the SS101 delivered a production‑grade solution combining cleanroom compatibility, precise thermal and anti‑warp controls, and full factory integration. Mingseal continues to support on‑site process optimization, DOE-based recipe tuning, and MES integration to help fabs scale FOWLP production with predictable yield and throughput. Contact Mingseal to arrange a pilot run or qualification plan tailored to your wafer sizes and process mix.

Customer challenge A leading smartwatch manufacturer in India required a robust inline process to deposit adhesive into small threaded screw holes used to secure bezel and module assemblies. The screws rely on a controlled micro-volume of moisture-curing adhesive inside the threads to prevent loosening while avoiding excess that can foul threads or interfere with assembly. Manual application produced inconsistent glue volumes and occasional thread blockage; variability in bead mass (and hence cure performance) led to rework, slower downstream assembly, and occasional field returns. Technical requirements Target deposit mass: 0.2~0.3 mg per threaded hole. Deposit geometry: contained micro-dot within the thread root (diameter

Product promise Bring panel-level RDL-first FoPLP production in-house with the SS300: a locally developed dispensing platform that combines high-capacity panel handling, multi-head parallel dispensing, and robust anti-warp control to deliver consistent underfill and coating results across up to 600×600 mm panels. Why customers choose the SS300 Large-panel compatibility: Process 510×515 mm and 600×600 mm panels on a single platform. Four independent dispense heads: Simultaneously run underfill, coating, and flux processes to dramatically shorten cycle times. Superior anti-warp control: Mechanical compensation keeps panels flat within ±10 mm through thermal steps—preserving nozzle standoff and dispensing accuracy. End-to-end traceability: Integrated AOI and MES connectivity capture images, recipes, and event logs for full production accountability. Factory-ready automation: Standard PGV/AGV/OHT interfaces make it straightforward to add the SS300 to an automated, lights-out production line. Customer benefits Higher first-pass yields and lower rework from uniform, automated dispensing. Faster throughput using parallel dispense heads without expanding floor space. Reduced dependency on imported equipment with a domestically supported solution. Call to action Validate the SS300 on your materials and panel SKUs with a Mingseal pilot. We offer on-site qualification support, process development, and tailored MES integration packages to accelerate your FoPLP transition. Contact Mingseal to schedule a demo, request a detailed quotation—let us map the qualification timeline, acceptance criteria, and expected yield/up-time improvements for your specific application.