Customer scenario
A Taiwanese systems integrator assembling AI servers required a reliable, high‑precision solution for dispensing particulate‑filled thermal gap pads and bonding adhesives during module assembly. Core modules include heat spreaders, high‑power ASICs and stacked memory where controlled, repeatable application of thermally conductive pastes (including abrasively loaded, particle‑filled formulations) is critical to thermal performance and mechanical durability. The customer sought a valve that could meter two-component materials accurately, handle abrasive fillers, increase wear resistance of bonded interfaces, and extend maintenance intervals on high‑volume production lines.
Mingseal KSP Series solution
Mingseal recommended the KSP Series two‑component screw valve (KSP0350B configuration) to meet the integrator’s requirements by combining precision volumetric metering with a robust wet path engineered for filled pastes.
Key technical fits
Precision volumetric two‑component metering: The KSP screw architecture delivers linear, positive‑displacement flow proportional to screw rotation for both base and curing agent streams. This ensures accurate mix ratios and consistent shot masses across thousands of parts—critical for thermal conductivity and cure performance of the filled gap material.
Abrasion‑resistant wet path: Wetted components in the KSP0350B are made from wear‑resistant alloys and engineered seals to withstand silica/metal oxide filler abrasion. This reduces clearance growth and maintains dispense accuracy when processing high‑particle‑loading thermal pastes.Homogeneous mixing and shear control: The concentric screw geometry provides gentle but effective in‑line blending, preserving particle dispersion without excessive shear that could alter rheology or introduce air. Consistent mixing maintains particle suspension for predictable thermal pathways after cure.
High repeatability and throughput: Motor‑driven pulse control with encoder feedback enables fine resolution of shot volumes and rapid cycling to match AI server assembly takt times while ensuring repeatability across shifts and batches.Process integration and implementation
Material and nozzle selection: Mingseal performed material characterization to select screw pitch, rpm maps and nozzle geometries optimized for the customer’s particle size distribution and viscosity range, avoiding nozzle clogging while ensuring full cavity fill.Closed‑loop quality control: Inline weight sampling and periodic microscope inspection of bead geometry were integrated into the line. If microbalance data drifted, the system auto‑adjusted motor pulses and flagged preventive maintenance before quality impact.
Wear management and maintenance extension: The KSP0350B’s replaceable wear sleeves and scheduled purge cycles were configured to match shot counts, pushing mean time between service intervals well beyond the customer’s previous pneumatic dispensing setup.
Production outcomes and benefits
Improved thermal performance: Consistent mix ratio and uniform particle distribution produced reliable thermal paths between ASICs and heat spreaders, improving steady‑state die temperatures and reducing frequency of thermal throttling under heavy AI workloads.
Increased mechanical durability: Precisely controlled adhesive fillets and bonding layers increased shear and fatigue resistance of core components, lowering field failures from vibration and thermal cycling.
Reduced downtime and lower TCO: Abrasion‑resistant wet path and planned preventive maintenance extended service intervals, reduced unexpected stoppages, and lowered total cost of ownership compared with disposable or pneumatic metering heads.
Process traceability and compliance: The KSP system logs mix ratios, shot counts and maintenance actions for traceability—supporting quality audits and root‑cause analysis for high‑value server modules.
Conclusion
For Taiwanese AI server manufacturers facing demanding thermal management and reliability targets, the KSP Series two‑component screw valve (KSP0350B) provides a rugged, high‑precision dispensing platform for particle‑filled thermal adhesives. By combining volumetric metering, abrasion‑resistant construction, and closed‑loop control, the KSP helps deliver stable thermal conductivity, enhanced component durability, and longer maintenance cycles—supporting higher uptime and predictable production costs. Contact Mingseal to schedule a pilot trial with your thermal compound and server module layout.
Customer scenario
A Malaysian electronics OEM producing AI glasses required a robust inline solution for SiP packaging of the main control module. Substrates measure up to 325 × 162 mm and integrate 40~60 chips per board. Individual die sizes are under 10 × 10 mm with solder bumps 150~200 μm tall, 250~350 μm pitch and only 90 μm gaps between components. Underfill at the pad bottom is especially challenging: the process demands micro-scale, repeatable control of adhesive volume and flow to ensure full wetting without overflow or voids.
Mingseal FS600S solution
Mingseal proposed the FS600S inline Dam & Fill system tuned for high-density SiP underfill in AI glasses control modules. Key process elements delivered on the customer’s constraints:
Non-contact high-speed jetting: Piezo-driven dispensing at up to 1000 Hz with a minimum droplet size of 0.5 nL enables ultra-fine micro-dosing into tight 90 μm gaps without mechanical contact that might disturb fragile bumps or nearby components.
Full-zone precision temperature control: Independent, closed-loop temperature control across the feed and dispense zones maintains adhesive rheology with ±3°C stability, ensuring consistent viscosity and predictable flow during long runs and across different adhesive chemistries.
Vision plus intelligent closed-loop algorithms: Dual high-resolution cameras locate fiducials and component edges with micron-class accuracy. An intelligent control loop combines visual alignment with periodic inline microbalance sampling to auto-correct dispense mass and maintain target volume per cavity.
Multi-pass segmented paths: For very narrow 90 μm gaps, the FS600S programs multi-pen segmented fill strokes that sequentially deposit and let capillary action draw adhesive under the die, ensuring complete wetting while avoiding over-apply at edges.
Micron-level repeatability: System mechanics and motion control deliver 10 μm repeat positioning to reliably hit narrow gaps between bumps and maintain uniform bead geometry across densely populated substrates.
Production outcomes and value
Robust solder-joint protection: Controlled underfill penetration around 150~200 μm bumps reduces mechanical stress on solder joints, improving drop and vibration resistance for wearable devices.
Preserved touch sensitivity and thermal performance: Precise, minimal adhesive over-apply prevents sensor interference and maintains designed thermal pathways, keeping the AI glasses cool during continuous operation.
Higher yield and reliability: Reduced voiding and consistent underfill coverage cut rework and thermal cycling failures, improving lot yield and long-term reliability necessary for consumer wearables.
Traceability and integration: FS600S supports MES docking and stores dispense recipes, images and weight logs for production traceability and quality audits.
Conclusion
For Malaysian AI glasses manufacturers facing extreme miniaturization and tight geometries, the FS600S provides a practical, high-throughput inline underfill solution. By combining sub-nanoliter jetting, precise thermal control, intelligent vision-based closed-loop correction and multi-pass fill strategies, the FS600S secures mechanical protection, thermal stability and reliable field performance—helping AI eyewear withstand drops, moisture and extended use. Contact Mingseal to validate the FS600S with your adhesive and SiP layout in a pilot run.
Background and Problem
A Malaysian tier‑1 supplier producing automotive temperature and pressure sensors needed to convert a manual potting and thermal‑gap‑filling step to an automated cell. Operators applying thermally conductive glue by syringe produced inconsistent bead volume and weight, causing variable thermal transfer, part failures in thermal cycling, and significant rework. The customer required a solution that could integrate with existing robot arms, deliver repeatable per‑shot mass control, and support higher throughput with reduced material waste.
Cause
Primary failure modes were operator variability in squeeze pressure and dispense time, air entrainment and inconsistent paste supply from pressure pots, and lack of closed‑loop control for per‑part glue mass. These issues led to under‑ or over‑apply, inconsistent thermal paths between sensor die and housing, and increased scrap and customer complaints during vehicle qualification testing.
Solution — KSV3000 Concentric Auger Valve
Integrated with Robot Cell Mingseal supplied the KSV3000 concentric auger valve (wear‑resistant model) and integrated it onto the customer’s six‑axis robot end‑effector to replace manual dispensing. The KSV3000’s positive displacement screw metering and motor‑driven pulse control solved the core metering problems while enabling fast cycle rates required by the automotive takt.
Key Implementation Details
Positive displacement metering: The concentric auger design produces linear flow proportional to motor rpm, eliminating pressure‑pulse artifacts that plague pneumatic systems. Each timed motor pulse yields a fixed volumetric shot, giving tight control of glue weight per part.
High‑speed capability: The KSV3000 supports up to 500 rpm, enabling short pulse durations for small, repeatable deposits while matching robot motion speed for in‑motion dispensing and higher UPH.
Wear‑resistant wet path: Selected wetted materials resist abrasive, filler‑loaded thermal pastes and minimize clearance changes over long runs—reducing drift and maintenance frequency.
Compact head for robot mounting: The small footprint and quick‑change nozzle interface simplified end‑effector design and allowed fast nozzle swaps for different sensor families.
Process tuning and validation: Mingseal performed bench characterization to determine rpm, pulse time, and nozzle diameter for each thermal‑paste formulation and pad geometry. Encoder feedback on motor pulses was used to guarantee shot repeatability.
Integration and Process
Flow The cell was configured with robot pick‑and‑place, KSV3000 mounted on the wrist, and a heated, agitated feed pot with controlled pressure to maintain paste conditioning. Typical flow: robot aligns over sensor housing using vision fiducials, performs in‑motion bead or dot dispensing following the programmed path, and the part is weighed on a microbalance sample station at regular intervals. If mass drifts beyond SPC limits, the system triggers a purge, auto‑recalibration, or stops for maintenance.
Results and Benefits (Malaysian Deployment)
Controlled glue mass: Per‑shot variance fell below targeted tolerance, eliminating under‑fills and excessive squeeze‑out; weight control reduced thermal performance variance across lots.
Yield and quality improvement: Automated metering and closed‑loop sampling reduced rework and scrap—enabling more consistent thermal test pass rates and lowering warranty risk.
Throughput uplift: Robot‑mounted KSV3000 supported continuous, high‑speed dispensing cycles, increasing UPH versus manual lines while maintaining precision.
Reduced material waste: Positive displacement metering and tuned nozzle selection minimized over‑apply and cleaning frequency, lowering material cost per unit.
Lower maintenance and predictable uptime: The short fluid path and wear‑resistant components reduced clogging; quick nozzle changes and scheduled purge cycles simplified preventive maintenance.
Recommendations and Best Practices
Run a material characterization test to define rpm/pulse maps for each paste lot.
Use encoder feedback and periodic microbalance checks for closed‑loop mass control.
Implement purge and nozzle‑change SOPs based on shot counts for automotive traceability.
Conclusion
For Malaysian automotive sensor manufacturers, the KSV3000 concentric auger valve offers a robust path from manual dispensing to automated, robot‑mounted metering. Its mechanical positive displacement, high rpm capability, and wear‑resistant design deliver repeatable glue weight control, higher throughput, reduced waste, and improved thermal performance consistency—supporting scale‑up for demanding automotive production. Contact Mingseal for on‑site trials and process qualification with your thermal paste.