Changzhou Mingseal Robot Technology Co., Ltd.

Customer background A major semiconductor packaging house in Penang, Malaysia, required a reliable, high-throughput wafer-level dispensing solution to support mass production of Fan-Out Wafer-Level Packaging (FOWLP). Their production roadmap demanded an in‑fab system that could run underfill, coating, flux spray, and dam & fill processes with strict cleanliness, thermal stability, and anti-warp control for mixed 8‑inch and 12‑inch wafer lots. Technical challenge  FOWLP underfill at wafer level exposes delicate redistribution layers (RDLs) and bump structures to particulate and thermal stress. Key production constraints included: Maintaining Class 10 clean dispensing to avoid contamination on exposed wafer surfaces. Controlling wafer warpage during preheat and dispense cycles (target anti-warp ±3 mm) to preserve nozzle standoff and capillary flow behavior. Delivering sub-10 µm positional accuracy and repeatable dispense volumes across full 8/12‑inch wafer formats. Integrating with factory MES/AMHS for traceability and unmanned operation. Mingseal solution  Mingseal deployed the SS101 — the first domestically developed wafer-level dispensing cell qualified for FOWLP underfill mass production. System highlights and process adaptations for the Penang line included: Class 10 cleanroom-compatible enclosure with automated FOUP and open cassette handling to support both 12‑inch and 8‑inch wafers without cross‑contamination risk. Robotic wafer transfer and high-precision aligner for sub-10 µm placement accuracy; code scanning and MES logging provide per‑wafer traceability for recipes, images, and event history. Zoned preheating and closed‑loop thermal control to bring wafers to optimal dispensing temperature while minimizing thermal gradients that cause warpage. Dual GS600SWA/SWB dispensing stations within the SS101 cell to run underfill, conformal coating, flux spray, and dam & fill operations in a configurable sequence with ±10 µm positional control. Mechanical anti‑warp fixture and process tuning capable of compensating wafer deformation up to ±3 mm, preserving nozzle standoff and preventing tailing or void formation during capillary underfill. Post‑dispense heat dissipation station to control cool‑down rate and protect bump integrity before FOUP return, enabling consistent cure profiles and reduced stress. Production outcomes Successful FOWLP mass production: The SS101 cell enabled the customer’s transition from pilot to full-rate production for wafer-level underfill and associated processes, supporting both 8‑inch and 12‑inch wafer programs. Improved process stability: Active anti‑warp control and precise thermal management reduced underfill voiding and edge overflow, improving first-pass yield and lowering scrap. High precision and throughput: Dual dispensing stations and automated wafer handling preserved cycle time targets while maintaining sub‑10 µm positioning and repeatable dispense volumes across large wafer batches. Seamless fab integration: SEMI‑compliant communication and AMHS/MES connectivity allowed lights‑out operation, full traceability, and rapid fault diagnosis through logged process data and imaging. Conclusion  As the first domestically produced wafer-level dispensing system validated for FOWLP underfill in Penang, the SS101 delivered a production‑grade solution combining cleanroom compatibility, precise thermal and anti‑warp controls, and full factory integration. Mingseal continues to support on‑site process optimization, DOE-based recipe tuning, and MES integration to help fabs scale FOWLP production with predictable yield and throughput. Contact Mingseal to arrange a pilot run or qualification plan tailored to your wafer sizes and process mix.

Customer scenario A Malaysian automotive supplier producing temperature and pressure sensors for engine control sought to replace manual thermal-grease application with an automated, robot-mounted dispensing solution. The manual process suffered from inconsistent bead size and variable adhesive mass, causing uneven thermal paths, rework, and periodic field failures. Target requirements included precise control of thermal-grease volume (repeatable dots and short bead starts), integration with existing robot arms, easy nozzle changeover for multiple sensor models, and a reliable feed for medium-to-high viscosity thermal compounds. Mingseal solution: KSV3000 with robotic integration Mingseal proposed the wear-resistant KSV3000 concentric auger valve mounted on the customer’s six-axis robot end effector. The KSV3000 is designed for medium and high-viscosity materials and offers a high maximum flow rate (360 µL/s) with positive-displacement metering that tracks motor speed linearly — critical for matching production takt times while maintaining deposit consistency. Key process elements and implementation Positive-displacement auger metering: The concentric auger design eliminates pressure-pulse artifacts common with pressure-supply systems. By controlling motor rpm, the KSV3000 provides proportional, repeatable volume per cycle, reducing variation in dot mass and bead starts across thousands of parts. High throughput and cycle matching: With a 500 rpm-capable drive and fast response, the valve synchronizes with robot motion profiles to produce short, precise deposits and rapid cycle times required by high-volume automotive lines. Wear-resistant wetted path: The KSV3000’s wear-resistant materials handle abrasive thermal greases and silver-filled compounds without rapid erosion, ensuring long-term stability of dispense volume and minimizing maintenance downtime. Short fluid path and anti-clog design: A compact, short-flow path reduces air entrapment and paste separation. Combined with matched nozzles and a quick-change interface, the system supports frequent format changes and simple cleaning procedures — important for multi-SKU production. Inline process control and verification: Integration of the valve with the robot controller and a compact inline balance or camera-based AOI allows closed-loop verification of deposit mass and position. Recipes store rpm profiles, nozzle types, and robot trajectories for each sensor variant to ensure repeatable results and fast changeover. Production outcomes and value Consistent thermal interface performance: Automated, metered deposition produced uniform grease mass and coverage at the chip-to-heat-sink interface, improving thermal conductivity predictability and reducing field failures caused by inconsistent thermal paths. Reduced rework and scrap: Positive metering and recipe-controlled nozzles eliminated the majority of under- and over-apply defects seen in manual operations, lowering rework rates and material waste. Labor optimization and safety: Replacing manual dispensing removed operator variability, reduced ergonomic strain, and freed skilled technicians for higher-value tasks while improving shop-floor safety around hot components. Scalability and integration: The compact head and robot-ready mounting enabled straightforward retrofitting into existing robotic cells. MES-friendly recipe logging and traceable dispense parameters support quality audits and automotive traceability standards. Conclusion  For Malaysian automotive sensor manufacturers transitioning from manual to automated thermal-grease dispensing, the KSV3000 concentric auger valve offers a robust solution: positive-displacement metering for precise mass control, wear-resistant construction for abrasive greases, fast response to match robot cycles, and compact, serviceable packaging for production environments. Together with inline verification and recipe management, the KSV3000 delivers repeatable thermal interface quality, reduced rework, and improved throughput—helping sensor assemblies meet automotive reliability and traceability requirements. Contact Mingseal to pilot the KSV3000 on your sensor designs and validate dispense recipes and nozzle selection.

Customer scenario A Vietnamese laptop manufacturer needed a reliable inline solution to coat, encapsulate and protect chips mounted on flexible printed circuits (FPCs) used in notebook hinge and connector assemblies. Production demand targeted 100,000 coated FPC assemblies per 24‑hour shift, with processes requiring low‑temperature thermosetting hot‑melt adhesives to avoid heat damage to flexible substrates and nearby components. Key challenges were maintaining consistent bead mass and coverage during high-speed runs, preventing stringing and overflow that can affect connector contacts, and providing traceable process control for quality and yield. Mingseal FS600DDF solution Mingseal recommended the FS600DDF Visual Inline Dispensing Machine configured for high-volume low‑temp hot‑melt coating and protective filling on FPC chip areas. The FS600DDF’s heated syringe cartridge system, fast‑response valve options (piezo/VCM), high‑precision gantry motion, optional weighing and 2D/3D vision combine to meet throughput, process stability and traceability targets. Process highlights and implementation Low‑temperature thermoset adhesive control: The FS600DDF supports heated syringe cartridges and heated lines with closed‑loop temperature control to maintain adhesive viscosity within narrow windows suitable for low‑temp thermosets. Temperature stability prevents premature gelation and ensures controlled wetting on FPC copper pads and polymer layers. Fast, responsive valves for clean deposits: For micro‑dot and fine bead work, a piezo valve option delivers sub‑nanoliter to nanoliter control and minimizes stringing during rapid strokes. For larger protective fills, a VCM valve offers repeatable volumetric flow. Valve pulse profiles and nozzle geometry were tuned to eliminate tailing and ensure clean, isolated deposits near delicate contacts. High‑precision motion and vision alignment: With repeatability of ±10 μm and pixel resolution ≤8 μm/pixel, the FS600DDF’s vision system performs fiducial and feature alignment at line speed. Fly‑align capability preserves placement accuracy during high‑throughput double‑track operation, critical for the small chip footprints on FPCs. Dual‑track operation to meet UPH: The FS600DDF’s optional double‑track configuration and auto width adjustment allow two parallel production lanes on a single platform. Coupled with high motion speed (X/Y up to 1300 mm/s) and fast valve actuation, the system achieves the required throughput of 100,000 units per 24 hours while keeping machine footprint and staffing minimal.Inline verification and recipe traceability: Optional microbalance weighing (0.01 mg) and real‑time vision inspection verify deposited mass and wet bead geometry. Dispense recipes, temperature logs and inspection images are logged to MES/SECS‑GEM for full traceability and process control. Production outcomes and value Achieved throughput: By deploying dual tracks, synchronized dual valves and optimized dispense paths, the FS600DDF met the 100k/24h production target without sacrificing deposit quality. Consistent protective coverage: Closed‑loop temperature control and valve tuning reduced shot‑to‑shot variance, preventing under‑ or over‑apply that can lead to connector failures or assembly rework. Reduced defects and rework: Vision‑guided placement and inline weighing cut misplacement and volume variance, decreasing downstream solder or mechanical failures and improving first‑pass yield. Lower thermal risk to FPCs: Low‑temperature thermoset handling preserved substrate integrity and component reliability, reducing warpage and delamination risks common with higher‑temperature processes. Operational resilience: The FS600DDF’s modular design and MES connectivity support quick recipe changeover between different FPC designs and adhesives, and isolated track operation minimizes downtime during service. Conclusion For Vietnamese laptop OEMs facing high‑volume FPC chip coating and protective filling requirements, the FS600DDF provides a proven inline solution. Combining low‑temp hot‑melt handling, fast metering valves, micron‑level motion control, dual‑track throughput and inline verification, the FS600DDF secures consistent protection, higher yields and the production rate needed for modern notebook assembly lines. Contact Mingseal to run a pilot validating your adhesive formulation and FPC geometries on the FS600DDF.