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| Brand Name: | Mingseal |
| Model Number: | SS101 |
| MOQ: | 1 |
| Price: | $28000-$150000 / pcs |
| Delivery Time: | 5-60 Days |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union |
Fan-Out 2.5D Chip on Wafer on Substrate Wafer-Level Dispensing Machine
The SS101 Wafer-Level Dispensing Machine is an advanced underfill dispensing solution engineered for the demanding requirements of Fan-Out 2.5D Chip on Wafer on Substrate (CoWoS) processes. Equipped with dedicated underfill valves, the SS101 precisely dispenses fine volumes for small bump and narrow pitch applications, ensuring optimal flow without voids or bridging. Its programmable dispensing path and real-time temperature compensation effectively minimize thermal fluctuations during dispensing — a crucial factor for achieving uniform underfill in delicate 2.5D stacked chip structures.
An integrated weighing calibration module and whole-process video monitoring enable precise glue weight control and easy traceability, while ESD protection complies fully with IEC and ANSI standards to safeguard sensitive wafers throughout the process.
Core Advantages
Perfect for Small Bump, Tight Pitch & Low SOH: Support ultra-small bump dimensions and low stand-off height encapsulation without overflow or air gaps.
Dedicated Underfill Valve Control: Custom-designed underfill dispensing valve ensures stable, consistent flow with minimal clogging and bubble formation.
Stable Thermal Management: Integrated preheating, chuck table with uniform heating, and automatic temperature correction prevent thermal stress and resin defects.
Programmable Dispensing Path: Flexible path editing supports complex wafer-level layouts and variable fill depths, improving efficiency and precision.
Application Areas
✔ Fan-Out 2.5D Chip on Wafer on Substrate (CoWoS)
✔ RDL First FoWLP (Fan-Out Wafer-Level Packaging)
✔ High-Density ASIC/CPU/GPU Underfill
✔ Advanced Packaging for High-Performance Computing
✔ Small Bump Fine-Pitch Wafer Encapsulation
Technical Specifications
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SS101 Wafer Level Dispensing Machine |
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Application Range |
Wafer Configuration |
φ200±0.5mm/φ300±0.5mm (Standard version supports 12-inch only) |
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Wafer Thickness |
300~25500 μm |
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Max. Acceptable Wafer Warp |
5mm (subject to Finger model selection) |
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Max. Wafer Weight |
600g (subject to Finger model selection) |
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Supported Wafer-box Type |
8-inch Open Cassette/ 12-inch Foup (Standard version supports 12-inch only) |
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PC101 (EFEM) |
Loading & Unloading Method |
Landport +Robot Arm |
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Pre-Aligner Precision |
Circle center correction deviation ≤ ±0.1 mm Angle correction deviation ≤ ±0.2° |
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Wafer Reader |
Supporting SEMI fonts (flat or embossed surfaces), non-SEMI fonts |
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Jetting System |
Transmission System |
X/Y: Linear motor Z: Servo motor&Screw module |
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Repeatability (3sigma) |
X/Y:±3 μ m Z:±5 μ m |
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Positioning Accuracy (3sigma) |
X/Y:±10 μ m |
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Max. Speed |
X/Y:1000mm/s Z: 500mm/s |
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Max. Acceleration |
X/Y:1g Z: 0.5g |
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Visual System |
Pixel |
130W |
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Identify Accuracy |
±1pixel |
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Identify Range |
10*12mm |
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Light Resource |
Red, Green, White combined light + extra red illumination |
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Chuck Table |
Vacuum Suction Planeness Deviation |
≤30μ m |
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Heating Temperature Deviation |
±1.5℃ |
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Lifting height repeatability |
±10μ m |
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Vacuum Suction Pressure |
-85~-70KPa (Settable) |
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General Condition |
Footprint W× D × H |
3075*2200*2200mm (Display screen unfold) |
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Operation Environment Temperature |
23℃±3℃ |
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Operation Environment Humidity |
30-70% |
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FAQ
Q1: How does the SS101 handle small bumps and tight pitches?
A: The system’s dedicated underfill valves, high-resolution vision, and precise motion ensure exact glue placement for bumps, minimizing voids and resin spread.
Q2: What makes its thermal management unique?
A: The integrated chuck table and preheating system deliver uniform wafer temperature, while real-time feedback auto-corrects heat drift, preventing thermal stress and warping.
Q3: Does it support AMHS integration?
A: Yes — the PC101 EFEM module connects seamlessly with AMHS robots for automated wafer handling and improved production efficiency.
Q4: Is the SS101 suitable for RDL First processes like FoPoP and CoWoS?
A: Absolutely — it’s purpose-built for high-end RDL First FoWLP lines, including CoWoS and FoPoP, where underfill precision is mission-critical.
About Mingseal
Mingseal is a trusted global manufacturer of advanced inline dispensing and precision automation solutions. With a strong focus on semiconductor, MEMS, optical, and microelectronics applications, we deliver high-stability equipment and localized technical support to help manufacturers worldwide achieve higher yield, greater efficiency, and smarter production lines.
Contact us today to discuss your wafer-level underfill needs and experience the Mingseal difference.
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