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Latest company Solutions about SS101 Wafer-Level Dispensing System for FoWLP Packaging in Malaysia's Penang Market
2025-11-18

SS101 Wafer-Level Dispensing System for FoWLP Packaging in Malaysia's Penang Market

As the demand for advanced semiconductor packaging grows globally, particularly in Fan-Out Wafer-Level Packaging (FoWLP), there is a pressing need for precise, reliable, and cost-effective dispensing solutions. Our company is proud to introduce the SS101 Wafer-Level Dispensing System to the ...
Latest company Solutions about The First Domestic Solution for FoPLP Panel-Level Encapsulation in Taiwan
2025-11-17

The First Domestic Solution for FoPLP Panel-Level Encapsulation in Taiwan

As the demands for advanced display technology and compact packaging continue to evolve, the industry requires exact and reliable dispensing systems for FoPLP (Fan-out Panel-Level Packaging) processes. Our flagship SS300 Panel-Level Dispensing System has emerged as the first domestically produced ...
Latest company Solutions about Precision Micro-Dispensing for India’s Expanding Smartwatch Manufacturing Industry
2025-11-13

Precision Micro-Dispensing for India’s Expanding Smartwatch Manufacturing Industry

As India’s smartwatch and wearable device industry continues to grow rapidly, manufacturers face increasing challenges in maintaining precision and consistency in adhesive applications for miniature components. One critical process — thread hole dispensing — requires extreme accuracy to ensure ...
Latest company Solutions about Precision Dispensing for Malaysia’s Automotive Sensor Industry: Accurate Thermal Glue Application
2025-11-12

Precision Dispensing for Malaysia’s Automotive Sensor Industry: Accurate Thermal Glue Application

As Malaysia’s automotive electronics manufacturing industry accelerates its transition toward automation, precision dispensing of thermal conductive materials for automotive sensors has become a critical process. Many factories that once relied on manual glue application now face challenges such as ...
Latest company Solutions about High Precision Robot Dispensing Improves Efficiency for Thailand Smartphone Magnetic Ring Assembly
2025-11-07

High Precision Robot Dispensing Improves Efficiency for Thailand Smartphone Magnetic Ring Assembly

Thailand’s smartphone assembly sector is rapidly growing, driven by demand for advanced features such as wireless charging and magnetic accessories. One critical component is the magnetic ring used for wireless charging on smartphones, which requires precise adhesive dispensing on irregular 3D ...
Latest company Solutions about Precision Heat Dissipation Coating for Taiwan’s AI Server Industry
2025-11-04

Precision Heat Dissipation Coating for Taiwan’s AI Server Industry

As Taiwan rapidly expands its AI server and data center manufacturing, demand for high-precision thermal management in assembly processes has increased significantly. To ensure long-term stability of core components, manufacturers are turning to advanced dispensing technologies that can handle ...
Latest company Solutions about The Ideal Solution for CGM Sensor Biopharmaceutical Coating in the Russian Market
2025-10-30

The Ideal Solution for CGM Sensor Biopharmaceutical Coating in the Russian Market

With continuous advancements in medical technology, biosensors such as Continuous Glucose Monitors (CGM) are gaining widespread adoption worldwide. To ensure precise coating and consistent dispensation of biopharmaceutical liquids, manufacturers demand high-precision dispensing equipment. Our FS600A ...
Latest company Solutions about Boosting MEMS Production Efficiency with Inline Visual Dispensing Technology in Korea
2025-10-27

Boosting MEMS Production Efficiency with Inline Visual Dispensing Technology in Korea

In the rapidly growing Korean MEMS (Micro-Electro-Mechanical Systems) market, precision and stability are key to maintaining competitiveness in ASIC chip encapsulation and frame solder paste coating. To address these demands, a leading Korean MEMS manufacturer introduced our Inline Visual Dispensing ...
Latest company Solutions about Case Study — VCM Assembly Spot Welding Machine Applied in Korea
2025-10-23

Case Study — VCM Assembly Spot Welding Machine Applied in Korea

In South Korea’s competitive camera module (VCM) manufacturing sector, precision and consistency are critical to maintaining product quality. A Korean optical components manufacturer recently adopted our Vibration Motors Desktop Spot Welding System for the enameled wire welding process in VCM (Voice ...
Latest company Solutions about High Efficiency Dual Valve Inline Dispensing Boosts Vietnam Notebook FPC Production
2025-10-20

High Efficiency Dual Valve Inline Dispensing Boosts Vietnam Notebook FPC Production

Vietnam has rapidly become a global center for notebook and mobile electronics manufacturing. As device designs continue to shrink, manufacturers rely on flexible printed circuits (FPCs) to support thinner structures and denser signal transmission. These FPC components require chip coating ...
Latest company Solutions about Korean Camera Manufacturers Benefit from Dual Station Inline Visual Dispensing for Dust Catching Glue
2025-10-16

Korean Camera Manufacturers Benefit from Dual Station Inline Visual Dispensing for Dust Catching Glue

South Korea continues to lead the global smartphone camera supply chain, focusing on higher-resolution sensors and enhanced optical performance. However, as components become thinner and more sensitive, manufacturers face increasing challenges in contamination control during assembly. In particular, ...
Latest company Solutions about Case Study: How a Fully Automatic Mounting & Dispensing Machine Improved Inductor Assembly Efficiency in Vietnam
2025-10-14

Case Study: How a Fully Automatic Mounting & Dispensing Machine Improved Inductor Assembly Efficiency in Vietnam

Vietnam’s consumer electronics industry has been expanding rapidly, driven by strong exports and growing local production capacity. However, many factories are still facing challenges in precision assembly — especially when bonding micro-components such as inductor modules, speaker diaphragms, and ...
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