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home
about us
Company Profile
factory tour
quality control
Faq
products

Desktop Glue Dispensing Machine

Adhesive Dispensing Machine

Solder Paste Dispenser Machine​

Dispensing Controller

Jetting Valve​

Auger Valve

Hot Melt Dispenser Machine

Electronic Dispensing Machine

Advanced Packaging Equipment

Robot Dispensing Machine

Micro Spot Welder

Dispensing Machine Spare Parts
solutions
video
news
contact us
VR
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Latest company Solutions about DW200P Enables High‑Speed, High‑Yield VCM Enameled‑Wire Welding for Korean Camera Module Makers
2024-01-10

DW200P Enables High‑Speed, High‑Yield VCM Enameled‑Wire Welding for Korean Camera Module Makers

Problem A Korean camera actuator (VCM) supplier faced low throughput and inconsistent weld quality when manually spot‑welding enamelled coil leads to actuator terminals. Manual alignment and variable weld energy produced weak joints, insulation breakdown, and cosmetic defects—driving rework and ...
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Latest company Solutions about KPS2000 Enables Precise, Gentle Reagent Coating for Algerian Blood Glucose Test Strip Production
2025-09-19

KPS2000 Enables Precise, Gentle Reagent Coating for Algerian Blood Glucose Test Strip Production

Background / Problem An Algerian medical device manufacturer scaling production of dynamic blood glucose test strips needed a micro-dispense solution that balances ultra-fine reagent control with strict cost targets. Manual and slow jetting systems caused inconsistent reagent volumes, high material ...
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Latest company Solutions about FS600A Delivers Precise Bio‑Fluid Coating for CGM Sensors at Russian Manufacturing Line
2022-05-17

FS600A Delivers Precise Bio‑Fluid Coating for CGM Sensors at Russian Manufacturing Line

Problem A Russian medical device manufacturer producing continuous glucose monitoring (CGM) sensors needed reliable, repeatable coating of bio‑compatible fluids on sensor substrates. The process required fine linear deposits—0.3mm width with 3mm and 5mm lengths—to form protective hydrophilic...
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Latest company Solutions about FS600DDF Enables High‑Throughput Low‑Temp Thermoset Coating and Encapsulation for Vietnamese Laptop FPC Line
2025-10-21

FS600DDF Enables High‑Throughput Low‑Temp Thermoset Coating and Encapsulation for Vietnamese Laptop FPC Line

Problem A Vietnam-based EMS supplier assembling laptop FPC modules needed a reliable inline system to apply chip-level coating, encapsulation, and protective fill using low-temperature thermoset adhesives. The line required high throughput (100,000 units per 24 hours), strict placement accuracy to ...
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Latest company Solutions about FS200A Doubles Throughput for Korean Smartphone Camera IR Filter Dust‑Capture and Reinforcement Process
2025-10-24

FS200A Doubles Throughput for Korean Smartphone Camera IR Filter Dust‑Capture and Reinforcement Process

Problem A Korean camera module maker needed a robust inline solution to apply dust‑capture adhesive and reinforcement glue to IR filter assemblies. Manual dosing and separate stations caused low UPH, inconsistent glue coverage, particle contamination during handling, and variable cure quality that ...
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Latest company Solutions about AC100 Automates Diaphragm and Housing Mounting for Vietnamese Hearing‑Aid Inductor Production
2025-08-14

AC100 Automates Diaphragm and Housing Mounting for Vietnamese Hearing‑Aid Inductor Production

Problem A medical-device subcontractor in Vietnam producing hearing‑aid inductors relied on manual assembly for mounting delicate diaphragms and plastic housings. Manual dispensing of epoxy and hand placement led to inconsistent adhesive dots, glue overflow, scattered splatter, and variable acoustic ...
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Latest company Solutions about AC100 Enables High‑Precision VCM Assembly for Indian Camera Module Manufacturers
2024-10-11

AC100 Enables High‑Precision VCM Assembly for Indian Camera Module Manufacturers

Problem Indian manufacturers producing voice coil motors (VCMs) for smartphone camera actuators face increasing demands for sub-micron placement accuracy, repeatable adhesive volume control, and higher line throughput. Inconsistent adhesive application and placement errors lead to reduced valve ...
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Latest company Solutions about SS200 Automated Lid Attach Line Improves FCBGA/FCCSP Yield for Malaysian Packaging Plant
2024-06-26

SS200 Automated Lid Attach Line Improves FCBGA/FCCSP Yield for Malaysian Packaging Plant

Problem A contract packager in Penang, Malaysia, scaling FCBGA and FCCSP lid-attach production reported frequent lid misalignment, glue-path defects, and throughput bottlenecks during high-mix runs. Manual handoffs and disparate equipment for AD/TIM application, lid attachment and cure led to ...
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Latest company Solutions about GS700SU Enables High‑Throughput, Low‑Void FCBGA Bottom‑Fill for Texas AI/HPC Packaging Line
2024-06-12

GS700SU Enables High‑Throughput, Low‑Void FCBGA Bottom‑Fill for Texas AI/HPC Packaging Line

Problem A Texas-based advanced packaging house producing large FCBGA modules (>50 × 50 mm) for AI/HPC applications needed to scale capillary bottom-fill (underfill) from pilot to production while preserving yield for high-value, large-area packages. Typical challenges included void formation across ...
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Latest company Solutions about SS300 Enables First Domestic High‑Volume FoPLP Panel-Level Underfill Production for Taiwan Line
2025-11-11

SS300 Enables First Domestic High‑Volume FoPLP Panel-Level Underfill Production for Taiwan Line

Problem A Taiwan electronics OEM scaling panel-level fan-out panel-level packaging (FoPLP) from prototype to mass production faced repeatability and throughput challenges. Critical processes—underfill, coating and flux spray—required consistent glue shape, full-panel coverage, and robust handling of ...
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Latest company Solutions about GS600SUA Enables First Domestic High‑Volume FCBGA Underfill Production for Malaysian Packaging Line
2022-06-14

GS600SUA Enables First Domestic High‑Volume FCBGA Underfill Production for Malaysian Packaging Line

Background A semiconductor packaging house in Malaysia selected Mingseal’s GS600SUA—the first domestically produced dispensing system qualified for mass FCBGA CUF process high-volume production. The customer needed ultra-fine underfill control for large-format FCBGA assemblies while maintaining ...
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Latest company Solutions about SS101 Enables First Domestic High‑Volume FoWLP Underfill Production for Penang Semiconductor Line
2025-05-05

SS101 Enables First Domestic High‑Volume FoWLP Underfill Production for Penang Semiconductor Line

Problem A semiconductor assembly house in Penang, Malaysia faced capacity and yield challenges moving fan-out wafer-level packaging (FoWLP) from pilot to volume production. Key pain points included inconsistent underfill dispensing across full 8–12" wafers, limited equipment capable of coping with ...
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