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about us
Company Profile
factory tour
quality control
FAQ
products

Desktop Glue Dispensing Machine

Adhesive Dispensing Machine

Solder Paste Dispenser Machine​

Dispensing Controller

Jetting Valve​

Auger Valve

Hot Melt Dispenser Machine

Electronic Dispensing Machine

Advanced Packaging Equipment

Robot Dispensing Machine

Micro Spot Welder

Dispensing Machine Spare Parts
solutions
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Latest company Solutions about An Advanced Solution for FCBGA and FCCSP Lid Attachment in Malaysia
2025-12-01

An Advanced Solution for FCBGA and FCCSP Lid Attachment in Malaysia

As the semiconductor industry continues to evolve, the need for efficient and reliable lid attachment processes becomes increasingly crucial. Our SS200 System, recently introduced in Malaysia, offers a state-of-the-art solution specifically designed for the attachment of lids in FCBGA (Flip Chip ...
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Latest company Solutions about The First Domestic Solution for Large Package Size FCBGA Bottom Filling in Texas, USA
2025-11-27

The First Domestic Solution for Large Package Size FCBGA Bottom Filling in Texas, USA

As the semiconductor industry evolves, the need for advanced dispensing systems capable of handling larger package sizes becomes critical. Our GS700SU Underfill Dispensing System stands out as a pioneering domestic solution tailored for bottom filling of large package sizes in FCBGA (Flip Chip Ball ...
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Latest company Solutions about VCM Intelligent Production Line – Transforming A-System VCM Manufacturing in Vietnam
2025-11-24

VCM Intelligent Production Line – Transforming A-System VCM Manufacturing in Vietnam

As the demand for advanced VCM (Voice Coil Motor) technologies continues to grow, manufacturers are seeking innovative solutions to enhance their production efficiency and quality. Our cutting-edge VCM Intelligent Production Line, recently delivered in bulk to Vietnam, sets a new standard in the A...
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Latest company Solutions about Case Study: The First Domestic Solution for FCBGA Bottom Filling in Malaysia
2025-11-21

Case Study: The First Domestic Solution for FCBGA Bottom Filling in Malaysia

As the semiconductor industry pushes the boundaries of technology, the demand for reliable and efficient underfill dispensing solutions for FCBGA (Flip Chip Ball Grid Array) packaging has never been greater. Our GS600SUA Underfill Dispensing Machine stands out as the first domestically manufactured ...
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Latest company Solutions about SS101 Wafer-Level Dispensing System for FoWLP Packaging in Malaysia's Penang Market
2025-11-18

SS101 Wafer-Level Dispensing System for FoWLP Packaging in Malaysia's Penang Market

As the demand for advanced semiconductor packaging grows globally, particularly in Fan-Out Wafer-Level Packaging (FoWLP), there is a pressing need for precise, reliable, and cost-effective dispensing solutions. Our company is proud to introduce the SS101 Wafer-Level Dispensing System to the ...
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Latest company Solutions about The First Domestic Solution for FoPLP Panel-Level Encapsulation in Taiwan
2025-11-17

The First Domestic Solution for FoPLP Panel-Level Encapsulation in Taiwan

As the demands for advanced display technology and compact packaging continue to evolve, the industry requires exact and reliable dispensing systems for FoPLP (Fan-out Panel-Level Packaging) processes. Our flagship SS300 Panel-Level Dispensing System has emerged as the first domestically produced ...
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Latest company Solutions about Precision Micro-Dispensing for India’s Expanding Smartwatch Manufacturing Industry
2025-11-13

Precision Micro-Dispensing for India’s Expanding Smartwatch Manufacturing Industry

As India’s smartwatch and wearable device industry continues to grow rapidly, manufacturers face increasing challenges in maintaining precision and consistency in adhesive applications for miniature components. One critical process — thread hole dispensing — requires extreme accuracy to ensure ...
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Latest company Solutions about Precision Dispensing for Malaysia’s Automotive Sensor Industry: Accurate Thermal Glue Application
2025-11-12

Precision Dispensing for Malaysia’s Automotive Sensor Industry: Accurate Thermal Glue Application

As Malaysia’s automotive electronics manufacturing industry accelerates its transition toward automation, precision dispensing of thermal conductive materials for automotive sensors has become a critical process. Many factories that once relied on manual glue application now face challenges such as ...
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Latest company Solutions about High Precision Robot Dispensing Improves Efficiency for Thailand Smartphone Magnetic Ring Assembly
2025-11-07

High Precision Robot Dispensing Improves Efficiency for Thailand Smartphone Magnetic Ring Assembly

Thailand’s smartphone assembly sector is rapidly growing, driven by demand for advanced features such as wireless charging and magnetic accessories. One critical component is the magnetic ring used for wireless charging on smartphones, which requires precise adhesive dispensing on irregular 3D ...
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Latest company Solutions about Precision Heat Dissipation Coating for Taiwan’s AI Server Industry
2025-11-04

Precision Heat Dissipation Coating for Taiwan’s AI Server Industry

As Taiwan rapidly expands its AI server and data center manufacturing, demand for high-precision thermal management in assembly processes has increased significantly. To ensure long-term stability of core components, manufacturers are turning to advanced dispensing technologies that can handle ...
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Latest company Solutions about The Ideal Solution for CGM Sensor Biopharmaceutical Coating in the Russian Market
2025-10-30

The Ideal Solution for CGM Sensor Biopharmaceutical Coating in the Russian Market

With continuous advancements in medical technology, biosensors such as Continuous Glucose Monitors (CGM) are gaining widespread adoption worldwide. To ensure precise coating and consistent dispensation of biopharmaceutical liquids, manufacturers demand high-precision dispensing equipment. Our FS600A ...
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Latest company Solutions about Boosting MEMS Production Efficiency with Inline Visual Dispensing Technology in Korea
2025-10-27

Boosting MEMS Production Efficiency with Inline Visual Dispensing Technology in Korea

In the rapidly growing Korean MEMS (Micro-Electro-Mechanical Systems) market, precision and stability are key to maintaining competitiveness in ASIC chip encapsulation and frame solder paste coating. To address these demands, a leading Korean MEMS manufacturer introduced our Inline Visual Dispensing ...
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