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about us
Company Profile
factory tour
quality control
Faq
products

Desktop Glue Dispensing Machine

Adhesive Dispensing Machine

Solder Paste Dispenser Machine​

Dispensing Controller

Jetting Valve​

Auger Valve

Hot Melt Dispenser Machine

Electronic Dispensing Machine

Advanced Packaging Equipment

Robot Dispensing Machine

Micro Spot Welder

Dispensing Machine Spare Parts
solutions
video
news
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Latest company Solutions about KSV3000 + Robot Integration Solves Thermal-Grease Dispensing for Malaysian Automotive Sensor Assembly
2026-01-21

KSV3000 + Robot Integration Solves Thermal-Grease Dispensing for Malaysian Automotive Sensor Assembly

Problem Automotive sensor manufacturers in Malaysia face rising demand for higher production speed, tighter process control, and lower defect rates. Manual dispensing of thermal conductive glue (TIM) onto sensor housings causes inconsistent bead weight and placement, frequent rework, and material ...
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Latest company Solutions about Overcoming MagSafe Wireless Magnetic Ring Displacement: 5-Axis Linkage Ensures 3D Path Consistency
2026-04-08

Overcoming MagSafe Wireless Magnetic Ring Displacement: 5-Axis Linkage Ensures 3D Path Consistency

In the ultra-competitive smartphone accessory market, the MagSafe magnetic ring has become a standard for wireless charging and peripheral attachment. However, for manufacturers, the bonding process of these rings presents a significant technical hurdle. Because the magnetic array is often ...
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Latest company Solutions about Breakthrough in MEMS Production Stability: Minimizing Contamination Risks in ASIC Encapsulation
2026-04-17

Breakthrough in MEMS Production Stability: Minimizing Contamination Risks in ASIC Encapsulation

In the high-stakes world of semiconductor packaging, specifically within the South Korean smart mobile supply chain, the margin for error is shrinking. As MEMS sensors—such as microphones, barometers, and accelerometers—become increasingly integrated into compact 5G devices, the stability of the ...
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Latest company Solutions about Targeting South Korea’s Smart Mobile Market: Optimizes Microphone Module Production Efficiency
2025-01-14

Targeting South Korea’s Smart Mobile Market: Optimizes Microphone Module Production Efficiency

South Korea stands at the global epicenter of smartphone innovation and semiconductor packaging. As mobile devices become thinner and more powerful, the demand for MEMS (Micro-Electro-Mechanical Systems) microphones and barometers has surged. For South Korean manufacturers and OSATs (Outsourced ...
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Latest company Solutions about Overcoming VCM Enameled Wire Burn-out: Mingseal Unveils DW200P Precision Welding Solution
2024-04-10

Overcoming VCM Enameled Wire Burn-out: Mingseal Unveils DW200P Precision Welding Solution

The manufacturing of Voice Coil Motors (VCM)—crucial components in smartphone cameras and micro-speakers—demands ultra-high precision, particularly during the critical bonding of enameled copper wires. A single error in heat or pressure can lead to pad burnout or wire collapse, resulting in costly ...
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Latest company Solutions about Solving FPC Narrow-Pitch Dispensing: How Dual-Vision Real-Time Compensation Ensures 24/7 Zero-Deviation Operation
2026-04-02

Solving FPC Narrow-Pitch Dispensing: How Dual-Vision Real-Time Compensation Ensures 24/7 Zero-Deviation Operation

In the high-precision world of laptop FPC (Flexible Printed Circuit) assembly, the margin for error is shrinking. As components become more densely packed, the demand for "Protection Coating" and "Underfill" has shifted from general application to micron-level accuracy. For EMS providers in regions ...
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Latest company Solutions about Solving Throughput Bottlenecks in Smartphone Camera Assembly: Asynchronous Dual-Head Mode for High UPH
2026-03-18

Solving Throughput Bottlenecks in Smartphone Camera Assembly: Asynchronous Dual-Head Mode for High UPH

In the 2026 smartphone market, the transition toward multi-lens arrays and ultra-high-resolution sensors has placed unprecedented pressure on the Infrared Cut Filter (IRCF) assembly process. The dual challenge of maintaining micron-level dispensing accuracy while scaling Units Per Hour (UPH) has ...
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Latest company Solutions about An Advanced Solution for FCBGA and FCCSP Lid Attachment in Malaysia
2025-12-01

An Advanced Solution for FCBGA and FCCSP Lid Attachment in Malaysia

As the semiconductor industry continues to evolve, the need for efficient and reliable lid attachment processes becomes increasingly crucial. Our SS200 System, recently introduced in Malaysia, offers a state-of-the-art solution specifically designed for the attachment of lids in FCBGA (Flip Chip ...
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Latest company Solutions about The First Domestic Solution for Large Package Size FCBGA Bottom Filling in Texas, USA
2025-11-27

The First Domestic Solution for Large Package Size FCBGA Bottom Filling in Texas, USA

As the semiconductor industry evolves, the need for advanced dispensing systems capable of handling larger package sizes becomes critical. Our GS700SU Underfill Dispensing System stands out as a pioneering domestic solution tailored for bottom filling of large package sizes in FCBGA (Flip Chip Ball ...
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Latest company Solutions about VCM Intelligent Production Line – Transforming A-System VCM Manufacturing in Vietnam
2025-11-24

VCM Intelligent Production Line – Transforming A-System VCM Manufacturing in Vietnam

As the demand for advanced VCM (Voice Coil Motor) technologies continues to grow, manufacturers are seeking innovative solutions to enhance their production efficiency and quality. Our cutting-edge VCM Intelligent Production Line, recently delivered in bulk to Vietnam, sets a new standard in the A...
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Latest company Solutions about Case Study: The First Domestic Solution for FCBGA Bottom Filling in Malaysia
2025-11-21

Case Study: The First Domestic Solution for FCBGA Bottom Filling in Malaysia

As the semiconductor industry pushes the boundaries of technology, the demand for reliable and efficient underfill dispensing solutions for FCBGA (Flip Chip Ball Grid Array) packaging has never been greater. Our GS600SUA Underfill Dispensing Machine stands out as the first domestically manufactured ...
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Latest company Solutions about SS101 Wafer-Level Dispensing System for FoWLP Packaging in Malaysia's Penang Market
2025-11-18

SS101 Wafer-Level Dispensing System for FoWLP Packaging in Malaysia's Penang Market

As the demand for advanced semiconductor packaging grows globally, particularly in Fan-Out Wafer-Level Packaging (FoWLP), there is a pressing need for precise, reliable, and cost-effective dispensing solutions. Our company is proud to introduce the SS101 Wafer-Level Dispensing System to the ...
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