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home
about us
Company Profile
factory tour
quality control
Faq
products

Desktop Glue Dispensing Machine

Adhesive Dispensing Machine

Solder Paste Dispenser Machine​

Dispensing Controller

Jetting Valve​

Auger Valve

Hot Melt Dispenser Machine

Electronic Dispensing Machine

Advanced Packaging Equipment

Robot Dispensing Machine

Micro Spot Welder

Dispensing Machine Spare Parts
solutions
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Latest company Solutions about SS300 — First Domestic Panel-Level Dispensing System for FoPLP Underfill in Taiwan
2023-08-23

SS300 — First Domestic Panel-Level Dispensing System for FoPLP Underfill in Taiwan

Customer scenario A Taiwanese advanced packaging company pursuing local supply-chain resilience needed a reliable panel-level dispensing solution for RDL-first FOPLP (Fan‑Out Panel Level Packaging) manufacturing. Their process mix included Underfill, coating and flux spray across panel formats up to ...
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Latest company Solutions about KSV1000 Concentric Auger Valve Enables Reliable Micro‑Dispense for Threaded Hole Bonding in Indian Smartwatch Assembly
2026-04-15

KSV1000 Concentric Auger Valve Enables Reliable Micro‑Dispense for Threaded Hole Bonding in Indian Smartwatch Assembly

Customer scenario An Indian wearable manufacturer producing smartwatches faced recurring issues with assembly of compact metal housings: securing tiny screws into threaded holes that are prone to loosening during use. The line required precise micro‑dispensing of moisture‑curing adhesives into micro...
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Latest company Solutions about KSP Series Two‑Component Screw Valve Enables Precise Thermal‑Gap Filling for Taiwanese AI Server Assembly
2023-07-17

KSP Series Two‑Component Screw Valve Enables Precise Thermal‑Gap Filling for Taiwanese AI Server Assembly

Customer scenario A Taiwanese systems integrator assembling AI servers required a reliable, high‑precision solution for dispensing particulate‑filled thermal gap pads and bonding adhesives during module assembly. Core modules include heat spreaders, high‑power ASICs and stacked memory where ...
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Latest company Solutions about FS600S Enables Micron-Scale Underfill Control for Malaysian AI Glasses SiP Packaging
2026-02-25

FS600S Enables Micron-Scale Underfill Control for Malaysian AI Glasses SiP Packaging

Customer scenario A Malaysian electronics OEM producing AI glasses required a robust inline solution for SiP packaging of the main control module. Substrates measure up to 325 × 162 mm and integrate 40~60 chips per board. Individual die sizes are under 10 × 10 mm with solder bumps 150~200 μm tall, ...
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Latest company Solutions about KSV3000 Enables Precise, High‑Speed Thermally Conductive Glue Dispensing for Malaysian Automotive Sensor Lines
2022-12-19

KSV3000 Enables Precise, High‑Speed Thermally Conductive Glue Dispensing for Malaysian Automotive Sensor Lines

Background and Problem A Malaysian tier‑1 supplier producing automotive temperature and pressure sensors needed to convert a manual potting and thermal‑gap‑filling step to an automated cell. Operators applying thermally conductive glue by syringe produced inconsistent bead volume and weight, causing ...
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Latest company Solutions about PD500D Delivers High‑Precision 3D Dispensing for Wireless Magnetic Ring Assembly at Thai Smartphone Line
2025-02-11

PD500D Delivers High‑Precision 3D Dispensing for Wireless Magnetic Ring Assembly at Thai Smartphone Line

Background and Problem A Thailand-based contract manufacturer supplying wireless magnetic rings for premium smartphones faced challenges when scaling production. The magnetic ring assemblies feature irregular 3D geometries and tight keep-out zones; manual or 3‑axis dispensing produced inconsistent ...
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Latest company Solutions about GS600M Stabilizes MEMS ASIC Encapsulation and Frame Solder‑Paste for Korean MEMS Lines
2025-07-18

GS600M Stabilizes MEMS ASIC Encapsulation and Frame Solder‑Paste for Korean MEMS Lines

Problem Korean manufacturers of MEMS microphones and pressure sensors faced variability in ASIC encapsulation and solder‑paste deposition on metal frames. Inconsistent paste volume and uneven encapsulant coverage led to reflow defects, electrical shorts, and acoustic/performance variability—driving ...
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Latest company Solutions about DW200P Enables High‑Speed, High‑Yield VCM Enameled‑Wire Welding for Korean Camera Module Makers
2024-01-10

DW200P Enables High‑Speed, High‑Yield VCM Enameled‑Wire Welding for Korean Camera Module Makers

Problem A Korean camera actuator (VCM) supplier faced low throughput and inconsistent weld quality when manually spot‑welding enamelled coil leads to actuator terminals. Manual alignment and variable weld energy produced weak joints, insulation breakdown, and cosmetic defects—driving rework and ...
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Latest company Solutions about KPS2000 Enables Precise, Gentle Reagent Coating for Algerian Blood Glucose Test Strip Production
2025-09-19

KPS2000 Enables Precise, Gentle Reagent Coating for Algerian Blood Glucose Test Strip Production

Background / Problem An Algerian medical device manufacturer scaling production of dynamic blood glucose test strips needed a micro-dispense solution that balances ultra-fine reagent control with strict cost targets. Manual and slow jetting systems caused inconsistent reagent volumes, high material ...
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Latest company Solutions about FS600A Delivers Precise Bio‑Fluid Coating for CGM Sensors at Russian Manufacturing Line
2022-05-17

FS600A Delivers Precise Bio‑Fluid Coating for CGM Sensors at Russian Manufacturing Line

Problem A Russian medical device manufacturer producing continuous glucose monitoring (CGM) sensors needed reliable, repeatable coating of bio‑compatible fluids on sensor substrates. The process required fine linear deposits—0.3mm width with 3mm and 5mm lengths—to form protective hydrophilic...
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Latest company Solutions about FS600DDF Enables High‑Throughput Low‑Temp Thermoset Coating and Encapsulation for Vietnamese Laptop FPC Line
2025-10-21

FS600DDF Enables High‑Throughput Low‑Temp Thermoset Coating and Encapsulation for Vietnamese Laptop FPC Line

Problem A Vietnam-based EMS supplier assembling laptop FPC modules needed a reliable inline system to apply chip-level coating, encapsulation, and protective fill using low-temperature thermoset adhesives. The line required high throughput (100,000 units per 24 hours), strict placement accuracy to ...
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Latest company Solutions about FS200A Doubles Throughput for Korean Smartphone Camera IR Filter Dust‑Capture and Reinforcement Process
2025-10-24

FS200A Doubles Throughput for Korean Smartphone Camera IR Filter Dust‑Capture and Reinforcement Process

Problem A Korean camera module maker needed a robust inline solution to apply dust‑capture adhesive and reinforcement glue to IR filter assemblies. Manual dosing and separate stations caused low UPH, inconsistent glue coverage, particle contamination during handling, and variable cure quality that ...
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