As the demand for advanced semiconductor packaging grows globally, particularly in Fan-Out Wafer-Level Packaging (FoWLP), there is a pressing need for precise, reliable, and cost-effective dispensing solutions. Our company is proud to introduce the SS101 Wafer-Level Dispensing System to the ...
As the demands for advanced display technology and compact packaging continue to evolve, the industry requires exact and reliable dispensing systems for FoPLP (Fan-out Panel-Level Packaging) processes. Our flagship SS300 Panel-Level Dispensing System has emerged as the first domestically produced ...
As India’s smartwatch and wearable device industry continues to grow rapidly, manufacturers face increasing challenges in maintaining precision and consistency in adhesive applications for miniature components. One critical process — thread hole dispensing — requires extreme accuracy to ensure ...
As Malaysia’s automotive electronics manufacturing industry accelerates its transition toward automation, precision dispensing of thermal conductive materials for automotive sensors has become a critical process. Many factories that once relied on manual glue application now face challenges such as ...
Thailand’s smartphone assembly sector is rapidly growing, driven by demand for advanced features such as wireless charging and magnetic accessories. One critical component is the magnetic ring used for wireless charging on smartphones, which requires precise adhesive dispensing on irregular 3D ...
As Taiwan rapidly expands its AI server and data center manufacturing, demand for high-precision thermal management in assembly processes has increased significantly. To ensure long-term stability of core components, manufacturers are turning to advanced dispensing technologies that can handle ...
With continuous advancements in medical technology, biosensors such as Continuous Glucose Monitors (CGM) are gaining widespread adoption worldwide. To ensure precise coating and consistent dispensation of biopharmaceutical liquids, manufacturers demand high-precision dispensing equipment. Our FS600A ...
In the rapidly growing Korean MEMS (Micro-Electro-Mechanical Systems) market, precision and stability are key to maintaining competitiveness in ASIC chip encapsulation and frame solder paste coating. To address these demands, a leading Korean MEMS manufacturer introduced our Inline Visual Dispensing ...
In South Korea’s competitive camera module (VCM) manufacturing sector, precision and consistency are critical to maintaining product quality. A Korean optical components manufacturer recently adopted our Vibration Motors Desktop Spot Welding System for the enameled wire welding process in VCM (Voice ...
Vietnam has rapidly become a global center for notebook and mobile electronics manufacturing. As device designs continue to shrink, manufacturers rely on flexible printed circuits (FPCs) to support thinner structures and denser signal transmission. These FPC components require chip coating ...
South Korea continues to lead the global smartphone camera supply chain, focusing on higher-resolution sensors and enhanced optical performance. However, as components become thinner and more sensitive, manufacturers face increasing challenges in contamination control during assembly. In particular, ...
Vietnam’s consumer electronics industry has been expanding rapidly, driven by strong exports and growing local production capacity. However, many factories are still facing challenges in precision assembly — especially when bonding micro-components such as inductor modules, speaker diaphragms, and ...