Customer scenario A Thailand-based contract manufacturer producing wireless magnetic attachment rings faced challenges applying adhesive to rings with complex, freeform geometries and tight optical/functional tolerances. The magnetic rings include chamfered edges, variable curvature, and embedded ...
Customer scenario A South Korean MEMS supplier producing microphones and barometric sensors needed a reliable inline solution for ASIC chip encapsulation and frame-level solder‑paste (stencil‑free) coating on MEMS packages. Market demand required sustained volume growth to keep the customer among ...
Customer scenario A South Korean camera module OEM sought to upgrade from manual to semi‑automated welding for Voice Coil Motor (VCM) assemblies used in compact camera modules. The existing manual process limited throughput, introduced variability from operator-dependent electrode pressure and ...
Customer scenario A Vietnamese laptop manufacturer needed a reliable inline solution to coat, encapsulate and protect chips mounted on flexible printed circuits (FPCs) used in notebook hinge and connector assemblies. Production demand targeted 100,000 coated FPC assemblies per 24‑hour shift, with ...
Customer scenario A South Korean smartphone camera module manufacturer needed a compact, high-throughput solution to apply dust‑capture adhesive to infrared (IR) filters used in front‑camera assemblies. The customer required simultaneous handling of two process steps on a single platform—reinforceme...
In the ever-evolving world of electronics manufacturing, precision and efficiency are paramount. Mingseal has revolutionized the production of hearing aid components, specifically focusing on the application of its AC100 fully-automatic mounting and precision dispensing machine. This innovative ...
Overview The GS700SU is a high-speed, high-precision dispensing system purpose-built for large-package FCBGA underfill. Designed to meet the thermal and structural demands of AI and high-performance computing (HPC) modules, the GS700SU delivers robust throughput, full inspection and production-grade ...
Customer challenge A Vietnamese manufacturer in the A‑system VCM (Vacuum Coating Material/Magnetic tape) sector needed to scale smart production for volatile demand while improving yield and reducing downtime. The customer required a turnkey, automated line that delivered high throughput, precise ...
Customer challenge A Malaysian semiconductor contract manufacturer preparing to volume-produce FCBGA CPU modules needed a domestic, production-ready underfill solution that met strict keep-out zone (KOZ), flow-height and traceability requirements. Substrates up to 325 × 162 mm carried high-density ...
Customer challenge An Algerian medical device manufacturer scaling production of dynamic blood glucose test strips faced tight cost targets while needing sub-microliter reagent control. Existing manual and slow jetting methods delivered inconsistent reagent volumes, high material waste and reduced ...
Customer scenario A leading packaging foundry in Penang, Malaysia, sought a reliable, high-throughput solution for Fan‑Out Wafer Level Package (FOWLP) Underfill production. The fab required a Class 10 clean dispensing machine that could run fully automated underfill, coating, flux spray and Dam & ...