logo
Latest company case about

solutions

Created with Pixso. Home Created with Pixso. solutions
Latest company Solutions about PD500D Delivers Precise 3D Dispensing for Wireless MagSafe Rings — A Thai Case Study
2025-09-01

PD500D Delivers Precise 3D Dispensing for Wireless MagSafe Rings — A Thai Case Study

Customer scenario A Thailand-based contract manufacturer producing wireless magnetic attachment rings faced challenges applying adhesive to rings with complex, freeform geometries and tight optical/functional tolerances. The magnetic rings include chamfered edges, variable curvature, and embedded ...
Latest company Solutions about GS600M Boosts Yield and Throughput for Korean MEMS ASIC Encapsulation and Frame Solder-Paste Coating
2025-04-22

GS600M Boosts Yield and Throughput for Korean MEMS ASIC Encapsulation and Frame Solder-Paste Coating

Customer scenario A South Korean MEMS supplier producing microphones and barometric sensors needed a reliable inline solution for ASIC chip encapsulation and frame-level solder‑paste (stencil‑free) coating on MEMS packages. Market demand required sustained volume growth to keep the customer among ...
Latest company Solutions about DW200P Enables Semi‑Automated, High‑Yield VCM Enameled‑Wire Welding for Korean Camera Module Manufacturers
2025-06-03

DW200P Enables Semi‑Automated, High‑Yield VCM Enameled‑Wire Welding for Korean Camera Module Manufacturers

Customer scenario A South Korean camera module OEM sought to upgrade from manual to semi‑automated welding for Voice Coil Motor (VCM) assemblies used in compact camera modules. The existing manual process limited throughput, introduced variability from operator-dependent electrode pressure and ...
Latest company Solutions about  FS600A Ensures Precise Biofluid Coating for Russian CGM Sensors with Dual‑Track High‑Throughput Control
2025-09-25

FS600A Ensures Precise Biofluid Coating for Russian CGM Sensors with Dual‑Track High‑Throughput Control

Customer scenario A Russian medical device manufacturer producing continuous glucose monitoring (CGM) sensors required a high‑precision inline coating solution for applying biocompatible reagent fluid onto sensor substrates. The process demanded tightly controlled glue lines—typical target bead ...
Latest company Solutions about FS600DDF Delivers High‑Throughput Low‑Temp Hot‑Melt Coating for Vietnamese Laptop FPC Chip Protection
2023-09-07

FS600DDF Delivers High‑Throughput Low‑Temp Hot‑Melt Coating for Vietnamese Laptop FPC Chip Protection

Customer scenario A Vietnamese laptop manufacturer needed a reliable inline solution to coat, encapsulate and protect chips mounted on flexible printed circuits (FPCs) used in notebook hinge and connector assemblies. Production demand targeted 100,000 coated FPC assemblies per 24‑hour shift, with ...
Latest company Solutions about FS200A Enables Dual‑Station Dust‑Capture Adhesive Process for Korean Smartphone Camera IR Filters
2022-03-14

FS200A Enables Dual‑Station Dust‑Capture Adhesive Process for Korean Smartphone Camera IR Filters

Customer scenario A South Korean smartphone camera module manufacturer needed a compact, high-throughput solution to apply dust‑capture adhesive to infrared (IR) filters used in front‑camera assemblies. The customer required simultaneous handling of two process steps on a single platform—reinforceme...
Latest company Solutions about Enhancing Hearing Aid Components with Mingseal's AC100 Automation
2024-09-03

Enhancing Hearing Aid Components with Mingseal's AC100 Automation

In the ever-evolving world of electronics manufacturing, precision and efficiency are paramount. Mingseal has revolutionized the production of hearing aid components, specifically focusing on the application of its AC100 fully-automatic mounting and precision dispensing machine. This innovative ...
Latest company Solutions about GS700SU — High‑Throughput Underfill System for Large FCBGA Packages — Deployed for a Texas AI/HPC Manufacturer
2023-11-24

GS700SU — High‑Throughput Underfill System for Large FCBGA Packages — Deployed for a Texas AI/HPC Manufacturer

Overview The GS700SU is a high-speed, high-precision dispensing system purpose-built for large-package FCBGA underfill. Designed to meet the thermal and structural demands of AI and high-performance computing (HPC) modules, the GS700SU delivers robust throughput, full inspection and production-grade ...
Latest company Solutions about FI100 Enables High‑Efficiency VCM Smart Production for Vietnamese A‑System Manufacturers
2023-03-14

FI100 Enables High‑Efficiency VCM Smart Production for Vietnamese A‑System Manufacturers

Customer challenge A Vietnamese manufacturer in the A‑system VCM (Vacuum Coating Material/Magnetic tape) sector needed to scale smart production for volatile demand while improving yield and reducing downtime. The customer required a turnkey, automated line that delivered high throughput, precise ...
Latest company Solutions about GS600SUA Enables Reliable, High‑Throughput FCBGA Underfill for Malaysian CPU Packaging
2024-08-20

GS600SUA Enables Reliable, High‑Throughput FCBGA Underfill for Malaysian CPU Packaging

Customer challenge A Malaysian semiconductor contract manufacturer preparing to volume-produce FCBGA CPU modules needed a domestic, production-ready underfill solution that met strict keep-out zone (KOZ), flow-height and traceability requirements. Substrates up to 325 × 162 mm carried high-density ...
Latest company Solutions about KPS2000 Enables Precise, Low‑Cost Reagent Coating for Algerian Blood Glucose Test Strip Production
2022-12-16

KPS2000 Enables Precise, Low‑Cost Reagent Coating for Algerian Blood Glucose Test Strip Production

Customer challenge An Algerian medical device manufacturer scaling production of dynamic blood glucose test strips faced tight cost targets while needing sub-microliter reagent control. Existing manual and slow jetting methods delivered inconsistent reagent volumes, high material waste and reduced ...
Latest company Solutions about Localized FOWLP Production with SS101: Stable Underfill, Tight Warp Control, SEMI‑Ready Integration
2021-08-27

Localized FOWLP Production with SS101: Stable Underfill, Tight Warp Control, SEMI‑Ready Integration

Customer scenario A leading packaging foundry in Penang, Malaysia, sought a reliable, high-throughput solution for Fan‑Out Wafer Level Package (FOWLP) Underfill production. The fab required a Class 10 clean dispensing machine that could run fully automated underfill, coating, flux spray and Dam & ...
1 2 3 4 5
Contact Us