Customer scenario

A leading packaging foundry in Penang, Malaysia, sought a reliable, high-throughput solution for Fan‑Out Wafer Level Package (FOWLP) Underfill production. The fab required a Class 10 clean dispensing machine that could run fully automated underfill, coating, flux spray and Dam & Fill processes for both 8‑inch and 12‑inch wafers. Key constraints included strict particle control for exposed RDL surfaces, micron‑level dispense accuracy, tight thermal management to prevent bump and substrate stress, and effective anti‑warp capability to maintain wafer flatness within ±3 mm during processing.

Mingseal SS101 solution — the first domestic FOWLP wafer dispenser for mass production

Mingseal deployed the SS101 as the first domestically produced wafer-level dispensing system validated for high-volume FOWLP underfill runs. Built for Class 10 compatibility and full fab integration, the SS101 addressed process control, traceability and throughput needs while minimizing contamination risk for sensitive fan‑out architectures.

Key system features implemented

• Class 10 clean enclosure and automated workflow: The SS101 operates inside a Class 10 cleanroom‑compatible enclosure with automated FOUP/cassette loading, robotic wafer transfer, alignment, code scanning and full process orchestration. Lights‑out operation reduces human contamination and supports continuous high-volume production.
• Dual dispensing stations with ±10 μm positioning: Two GS600SWA/SWB dispensing heads provide high‑precision application for underfill, coating, flux spray and Dam & Fill. Positioning repeatability and motion control ensure accurate bead placement relative to delicate RDL structures and exposed bumps.
• Tight anti‑warp control (±3 mm): A mechanical anti‑warp and vacuum chuck system maintains wafer planarity within ±3 mm during preheat, dispense and operation heating stages. This prevents nozzle crashes and ensures consistent dispense height across the wafer for uniform underfill flow and void avoidance.
• Precise thermal management: Integrated preheating and heat dissipation stations hold wafers at optimized temperatures to stabilize adhesive viscosity and capillary flow. Closed‑loop temperature control minimizes thermal gradients that could stress bumps or alter flow dynamics during underfill and coating operations.
• Clean fab communication and traceability: SS101 supports SEMI‑compliant open communication protocols, SECS/GEM interfaces and AMHS integration for MES docking, ensuring full process traceability, recipe control and automated material handling in Penang’s smart fab environment.

Process controls and quality assurance

Real‑time monitoring: In‑cell sensors and cameras monitor dispense quality, bead geometry and wafer handling in real time. AOI and inline metrology detect defects early and trigger corrective actions without interrupting throughput.
Recipe and lot traceability: Dispense recipes, temperature logs, images and equipment events are stored and exported to MES for auditability and consistent batch production across multiple shifts.

Production outcomes and benefits for the Penang line

Higher yield and reduced defects: Accurate underfill deposition, reliable anti‑warp control and tight thermal regulation reduced voiding and bump stress, increasing first‑pass yield for FOWLP assemblies.
Scalable, unattended throughput: Dual dispensing stations, FOUP handling and robotic transfer enable scalable production rates with minimal operator intervention—supporting the foundry’s volume and cost targets.
Seamless fab integration: SEMI‑compatible interfaces and AMHS readiness simplified deployment into existing lines in Penang, accelerating qualification and time‑to‑volume.
Local support and faster ramp: As the first domestic SS101 used for FOWLP underfill mass production, Mingseal provided rapid on‑site commissioning, recipe tuning and ongoing service—shortening qualification cycles and reducing downtime.

Conclusion

For Penang-based semiconductor fabs tackling FOWLP underfill, coating, flux spray and Dam & Fill at scale, the SS101 offers a production‑ready, domestically engineered platform. With Class 10 compatibility, ±3 mm anti‑warp control, precise thermal management and SEMI‑compliant integration, the SS101 delivers stable, traceable underfill processes that improve yield, reliability and fab throughput. Contact Mingseal to schedule a pilot qualification and validate SS101 performance with your FOWLP materials and wafer portfolio.