Changzhou Mingseal Robot Technology Co., Ltd.

As the demand for advanced semiconductor packaging grows globally, particularly in Fan-Out Wafer-Level Packaging (FoWLP), there is a pressing need for precise, reliable, and cost-effective dispensing solutions. Our company is proud to introduce the SS101 Wafer-Level Dispensing System to the Malaysian market, marking the first domestically produced dispensing equipment applied in large-scale FoWLP bottom fill production in Penang. Innovative Solution for FoWLP Manufacturing The SS101 system is designed to meet the rigorous standards of modern wafer-level packaging processes, including Underfill, Coating, Flux Spray, and Dam&Fill applications. Supporting wafer sizes of 8 and 12 inches makes it versatile for various production lines, while its impressive anti-warping capability of ±3mm ensures consistent dispensing even on warped wafers, thus maintaining high quality standards. Application Highlights FoWLP Underfill: Ensures robust mechanical and electrical stability by precisely filling gaps between chips and substrates.Coating: Uniform layer application for protection or functionalization of wafer surfaces.Flux Spray: Accurate flux application is critical to soldering and bonding quality.Dam & Fill: Creating dam structures and cavity filling to prevent leakage and improve device reliability. Performance and Advantages Precision and Consistency: Capable of micro-level dispensing with high repeatability, ensuring stable process control.Compatibility: Supports wafers up to 12 inches, adaptable to various manufacturing setups.Warp Resistance: Maintains ±3mm anti-warping tolerance, accommodating wafer deformations without compromising accuracy.Domestic Innovation: As the first locally developed dispensing system used in large-scale FoWLP bottom fill production, the SS101 showcases technological self-reliance and innovation in Malaysia’s semiconductor sector. Market Impact and Benefits Implementing the SS101 has enabled Malaysian manufacturers in Penang to realize significant improvements in process stability, product quality, and production efficiency. It also reduces dependency on imported equipment, fostering local technological advancement and supporting Malaysia's pursuit of a self-sufficient semiconductor manufacturing ecosystem. Conclusion The successful deployment of the SS101 Wafer-Level Dispensing System in Malaysia’s FoWLP manufacturing exemplifies the potential of domestic innovation to meet and exceed industry standards. Its precise, reliable, and scalable design is set to propel Malaysia’s semiconductor packaging industry forward, paving the way for future technological breakthroughs and sustained industry growth.

As the demands for advanced display technology and compact packaging continue to evolve, the industry requires exact and reliable dispensing systems for FoPLP (Fan-out Panel-Level Packaging) processes. Our flagship SS300 Panel-Level Dispensing System has emerged as the first domestically produced dispenser specifically designed for FoPLP applications in Taiwan, setting a new standard in panel-level encapsulation technology. Application Focus and Key Process Capabilities The SS300 is specially engineered to meet the rigorous requirements of FoPLP processes, including: Underfill Dispensing: Ensuring void-free encapsulation for enhanced device stability.Coating: Precise application of protective and functional coatings on large panel areas.Flux Spray: Uniform flux application for soldering and bonding processes.Designed for versatility, the SS300 provides seamless support for multiple process needs with high accuracy and consistency. Panel Compatibility and Size Range The SS300 Panel-Level Dispensing System is compatible with large-format panels, supporting dimensions of 510×515mm and 600×600mm.This broad compatibility allows manufacturers to adapt to various substrate sizes, improving production flexibility and throughput. Superior Warpage Resistance Our SS300 system boasts an exceptional warpage compensation capability of ±10mm, enabling accurate dispensing on panels with slight deformation or bending. This feature ensures consistent application across the entire panel, regardless of warping issues commonly encountered during large-format manufacturing. Industry Impact and Benefits The introduction of the SS300 as Taiwan’s first domestically developed FoPLP dispensing solution has revolutionized local panel-level packaging. Key benefits include: Enhanced Precision: Achieving high-accuracy dispensing is critical for reliable device performance. Increased Efficiency: Faster setup times and optimized process flow reduce production costs. Improved Reliability: Consistent application on large panels leads to fewer reworks and higher yields. Domestic Innovation: Supports local manufacturing by reducing reliance on imported equipment. Conclusion The SS300 Panel-Level Dispensing System is a groundbreaking achievement in Taiwan’s advanced packaging industry. It provides manufacturers with a reliable, versatile, and precise solution tailored for FoPLP applications, elevating the quality and consistency of panel-level encapsulation. If you're looking to improve your FoPLP process with a proven, domestically developed system, the SS300 is your ideal choice. Contact us today to learn more about how the SS300 can optimize your panel-level packaging operations.

As India’s smartwatch and wearable device industry continues to grow rapidly, manufacturers face increasing challenges in maintaining precision and consistency in adhesive applications for miniature components. One critical process — thread hole dispensing — requires extreme accuracy to ensure proper screw fixation and long-term product stability. A major Indian smartwatch manufacturer recently introduced the KSV1000A-U Auger Valve to solve recurring issues of inconsistent glue weight and poor uniformity in micro-hole applications. The target was to achieve precise adhesive control within a range of 0.2–0.3 mg per cycle, using a moisture-curing glue on threaded holes. Consistent Performance for Micro-Scale Dispensing The KSV1000A-U is an advanced precision auger valve dispenser designed for high-viscosity and particle-filled materials, such as thermal grease, UV adhesives, and structural glues. Built with a durable tungsten steel screw and closed-loop servo control, it ensures stable and repeatable dispensing — even for glue points as small as a millimeter. Compatible with 10cc, 30cc, and 50cc syringes, the valve offers quick replacement and easy cleaning through its quick-release design, allowing operators to switch between materials without production delays. The augmented auger part options (8P / 16P / 32P) give flexibility to adapt to different fluid viscosities and application requirements, making it suitable for diverse wearable assembly processes.  Indian Customer Feedback and Results After integrating the KSV1000A-U Auger Valve into their smartwatch assembly line, the Indian manufacturer reported several measurable improvements: Consistent glue weight control within ±0.02 mg per point Improved bonding strength for threaded holes, ensuring stable screw fixation Reduced rework rate caused by overflow or missing glue Enhanced production efficiency, achieving stable operation even with moisture-curing adhesive By using the KSV1000A-U’s precise screw-driven control, the factory successfully automated a process that was previously performed manually, eliminating human error and ensuring every smartwatch unit met strict quality standards.  Strengthening India’s Wearable Technology Manufacturing This success demonstrates how micro-dispensing automation is becoming essential in India’s electronics and wearable manufacturing sector. As product designs get thinner and more compact, traditional manual dispensing can no longer guarantee the accuracy required for components like smartwatch housings, camera modules, and micro-sensors. The KSV1000A-U Auger Valve offers an efficient, reliable, and scalable solution that enables manufacturers to achieve repeatable micro-dispensing performance while improving throughput and maintaining high precision — key factors driving India’s growing wearable technology ecosystem.