SMT PCBA Hot Melt Glue Dispenser Machine Underfill Glue Inline Dispensing Equipment

SMT PCBA Underfill Glue Dual-Valve Inline Dispensing Equipment

The FS600 Series is a high-efficiency, double-head, double-valve, dual-vision inline dispensing machine developed by Mingseal specifically for SMT industry PCBA processes. It is ideal for SMT underfill, BGA/CSP chip encapsulation, PCB solder paste jetting, and various high-precision dispensing applications.

Widely used across Southeast Asian markets—such as Malaysia, India, and South Korea—the FS600 series help local EMS and OEM factories significantly boost production cycle time and yield.

Compared to traditional single-head, single-valve models, the FS600 Series utilizes dual-head synchronous operation and flexible dual-valve switching, achieving a 50%–100% UPH increase with one machine. It effectively solves typical SMT dispensing line pain points such as capacity bottlenecks, inconsistent glue lines, and frequent manual corrections.

Core Features

• Double-Head Double-Valve for Flexible High Throughput
  The FS600DDF's heads can independently mount jet valves, adapting to different glue types and viscosities. It supports multiple processes on one machine, greatly reducing line changeover downtime.
• Dual-Vision System for Automatic Alignment & Compensation
  Dual top-and-bottom CCD vision modules capture PCB fiducials and pad positions in real-time. Automatic deviation correction and path compensation ensure repeatable dispensing accuracy up to ±10μm, guaranteeing consistent underfill quality and stable solder paste lines.
• Compact Footprint, Easy Maintenance
  Compact floor-standing design fits various SMT workshop layouts. Its modular structure allows later expansion, such as dual-track systems, bottom heating, or tilting head modules, to flexibly meet different PCBA process needs.

Typical Applications

✔ SMT Underfill (bottom filling)
✔ PCBA solder paste jetting & reinforcement
✔ MiniLED / LED module packaging
✔ FPC cable glue dispensing & reinforcement
✔ Optical module bonding (optional UV)
✔ Automotive electronics sensor encapsulation

Conclusion

Whether you are a PCB, SMT, or EMS factory, or a high-end manufacturer requiring optical module dispensing in semi-clean conditions, the Double-Head Double-Valve Inline Visual Dispensing Machine will help you dramatically increase cycle time, improve glue line consistency, and enhance process flexibility.

Q&A

Q1: Our dispensing line efficiency is limited—switching processes or valves wastes too much time. What can we do?
A1: The FS600DDF’s dual-head, dual-valve design allows two valves to work independently or simultaneously. Multiple processes can run on the same line without valve replacement, truly maximizing equipment utilization and doubling cycle speed.

Q2: How can we ensure underfill consistency and stable solder paste lines to reduce rework?
A2: The dual-vision system uses top and bottom CCD cameras for automatic PCB alignment and deviation compensation. Repeatability reaches ±10μm, ensuring uniform glue volume and full underfill coverage for higher yields.

Q3: Can it connect to SMT lines, AOI, or MES?
A3: Absolutely. The FS600 Series fully complies with SMEMA standards and can connect seamlessly with upstream and downstream SMT equipment. Optional AOI, UV curing, and weight monitoring modules are available, and it is fully compatible with SECS-GEM/MES for traceable production.

Q4: We don’t have a cleanroom—can we still run high-precision, high-volume jobs?
A4: The FS600 Series is designed for standard electronic workshop conditions. It achieves high-precision dispensing and high-volume production without additional cleanroom costs, making it perfect for MiniLED, LED, FPC, and PCBA applications with excellent flexibility and ROI.