As the semiconductor industry continues to evolve, the need for efficient and reliable lid attachment processes becomes increasingly crucial. Our SS200 System, recently introduced in Malaysia, offers a state-of-the-art solution specifically designed for the attachment of lids in FCBGA (Flip Chip Ball Grid Array) and FCCSP (Flip Chip Chip Scale Package) applications.

Key Features and Capabilities

Single-Track Line Efficiency: The SS200 operates on a single-track line, supporting a maximum boat size of 325×162mm. This capability allows manufacturers to handle various substrate dimensions with ease, enhancing operational flexibility.
SnapCure Technology: The SS200 features innovative SnapCure technology that enables rapid bonding and curing of lids. This system supports up to 4 sets of heat-press tooling, reducing production time by enabling simultaneous processing of multiple units. Each boat can withstand a maximum pressure of 80kg, ensuring secure attachment without compromising package integrity.
Modular Design: The system’s modular design allows for easy customization according to specific process requirements. Manufacturers can adjust, add, or rearrange workstations to meet evolving production demands, making the SS200 an ideal solution for dynamic manufacturing environments.

Benefits for Manufacturers

The SS200 System provides significant advantages for manufacturers in the semiconductor packaging sector:

Enhanced Efficiency: With its streamlined processes and SnapCure capabilities, the SS200 minimizes cycle times, enabling higher throughput and productivity.
Improved Quality Control: The precise lid attachment and curing process contribute to a higher yield of quality packages, fulfilling industry standards and customer expectations.
Flexibility: The modular design supports scalability and adaptability, allowing manufacturers to respond quickly to changing production needs.

Conclusion

The SS200 System represents a significant advancement in FCBGA and FCCSP lid attachment technology, providing Malaysian manufacturers with a reliable and efficient solution. By leveraging its advanced features, including SnapCure technology and a flexible modular design, the SS200 enhances productivity and quality in semiconductor packaging processes.

For manufacturers looking to optimize their lid attachment operations, the SS200 is a perfect choice. Contact us today to learn how the SS200 System can elevate your packaging capabilities.