3‑Axis Glue Dispensing Equipment — Large PCB & Flexible Process Automated Glue Dispenser

Product introduction

The FS700 Series Inline Visual Dispensing Machine is an advanced dispensing solution specifically developed for large-format PCB manufacturing and high-mix SMT production lines. One of the standout features of the FS700 Series is its dual-valve asynchronous mode: the two valves can operate independently to handle different adhesives or solder pastes—for example, dispensing red glue and solder paste simultaneously. This makes it ideal for complex multi-process production tasks such as adhesive bonding and solder paste deposition on the same PCB.

Problem → Cause → How this machine helps

Problem: In large PCB and flexible processes, inconsistent dispensing size or misplacement causes assembly defects and rework.
Cause: Manual dispensing, material temperature swings and limited motion range create variability in deposit size and location.
How this machine helps: The 3‑axis motion system combined with controlled material feed and camera‑assisted alignment stabilizes deposit size and position; recipes can be saved to reproduce the process reliably.

Technical Specifications

Applications

• Large PCB adhesive dispensing, glue lines and component fixation.
• Flexible PCB (FPC) adhesive placement for connectors and stiffeners.
• Small batch R&D and inline production transfer where larger work areas are required.

Operation flow

1. Load adhesive: install cartridge or connect heated feed and set temperature.
2. Register board: place board on fixture or conveyor; camera locates registration marks.
3. Run recipe: select stored recipe or receive from factory system; dispenser deposits per program.
4. Inspect & log: camera inspects deposits; log saved for traceability.

How to pick the right setup

• Board size & fixture: confirm motion travel covers your largest board and fixture layout.
• Deposit size & material: for filled/heavy adhesives choose heated feed and larger tips; for micro‑dots confirm minimum deposit with a sample.
• Speed needs: request measured cycle time with your pattern to validate throughput.
• Integration: confirm required I/O and protocol (digital signals, Modbus or Ethernet) for line sync.

Installation & maintenance

• Installation: bench or inline cell mount; connect mains, air (if needed), conveyor signals and network. Ensure ESD precautions for sensitive boards.
• Commissioning: run material × tip × temperature × motion tests to create validated recipes.
• Maintenance: daily tip/nozzle cleaning in heavy use; periodic actuator checks and monthly camera calibration.

FAQ

Q: What is the largest board this machine can handle?
A: Check the motion travel specs — the unit supports boards up to [900 × 600 mm]. Confirm fixture size for your layout.
Q: Can it run with heated adhesive?
A: Yes — heated feed line or heated cartridge sleeve options maintain setpoint temperature with ±1 °C stability.
Q: Does the camera correct for board misplacement?
A: Yes — the camera registers reference marks and offsets motion commands to ensure accurate placement.