As the semiconductor industry evolves, the need for advanced dispensing systems capable of handling larger package sizes becomes critical. Our GS700SU Underfill Dispensing System stands out as a pioneering domestic solution tailored for bottom filling of large package sizes in FCBGA (Flip Chip Ball Grid Array) applications. Recently deployed in Texas, USA, the GS700SU is setting new benchmarks in the semiconductor manufacturing process.

Application Focus and Key Process Capabilities

The GS700SU is specifically designed for underfill dispensing, making it highly effective for package sizes greater than 50×50mm. The machine offers unmatched versatility and precision in its operations, allowing manufacturers to achieve consistent and reliable results in large package assembly.

Maximum Boat Compatibility

The GS700SU supports a maximum boat size of 325×325mm with a dual-track system, featuring four operational stations and dual heads.
It also accommodates 325×162mm boat sizes, supporting a four-track configuration with eight operational stations and dual heads.
These specifications allow the GS700SU to handle a wide variety of FCBGA sizes, enhancing the flexibility of production lines and increasing throughput.

Enhanced Efficiency and Productivity

One of the most significant advantages of the GS700SU is its impressive operational efficiency:

The GS700SU improves dispensing efficiency by up to 3.7 times compared to its predecessor, the GS600SUA. This remarkable enhancement allows manufacturers to increase their production capacity significantly while maintaining high-quality standards.
Industry Impact and Benefits

The introduction of the GS700SU in Texas represents a significant advancement in domestic semiconductor manufacturing, providing numerous benefits:

Reliable Production: As the first domestically produced dispensing system for large package sizes, the GS700SU ensures consistent performance tailored to the specific needs of local manufacturers.
Increased Throughput: Enhanced operational efficiency leads to faster production times, meeting the growing demand for FCBGA components without sacrificing quality.
Cost-effectiveness: The use of domestic technology reduces reliance on imported systems, lowering costs and improving accessibility for manufacturers in Texas.

Conclusion

The GS700SU Underfill Dispensing System is a groundbreaking tool in the semiconductor industry, particularly for large package sizes in FCBGA applications. By combining innovative technology with enhanced efficiency, the GS700SU empowers manufacturers in Texas to achieve higher quality and productivity in their operations.

For semiconductor manufacturers looking to optimize their underfill dispensing processes for larger packages, the GS700SU offers an unparalleled solution. Contact us today to discover how the GS700SU can elevate your FCBGA production capabilities.