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Adhesive Dispensing Machine
Created with Pixso. Dual Valve Inline Visual Dispensing Machine — Smartphone Assembly SMT Adhesive Dispenser System

Dual Valve Inline Visual Dispensing Machine — Smartphone Assembly SMT Adhesive Dispenser System

Brand Name: Mingseal
Model Number: FS600DF
MOQ: 1
Price: $28000-$150000 / pcs
Delivery Time: 5-60 Days
Payment Terms: L/C,D/A,D/P,T/T,Western Union
Detail Information
Place of Origin:
China
Certification:
ISO CE
Dimensions W*D*H:
770×1200×1450mm
Power Supply:
220V AV 50Hz
Power:
3.6KW
Structure:
Floor-Type
Communication Protocol:
SMEMA/MES
Packaging Details:
Wooden Case
Highlight:

Dual ValveVisual Dispensing Machine

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Visual Dispensing Machine

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SMT adhesive dispenser system

Product Description

Product overview

This Dual valve inline visual dispensing machine is built for high‑volume smartphone and SMT assembly. It features two independently controllable dispensing valves for parallel or staggered operation, an onboard vision module for fiducial alignment and AOI, a precision gantry for repeatable motion, and recipe management with MES/PLC connectivity. Configurable for pressure/pulse or pump modes, the system minimizes stringing and supports fast product changeovers.


Problem → Cause → Solution

Problem: Smartphone assembly requires consistent micro‑dots and bead placement; inconsistent dispensing causes cosmetic defects, rework and yield loss.
Cause: Single‑head throughput limits, slow valve response, unstable adhesive temperature and insufficient alignment lead to volume variation and misplacement.
Solution: This system uses dual valves for parallel throughput, fast valve actuation, heated syringe or heated feed line options for stable viscosity, and vision‑guided placement—validate and lock recipes for repeatable inline production.


Technical Specifications


FS600DF Dual-Valve Inline Visual Dispensing Machine
Basic Parameters Frame Structure Floor-mounted gantry 3-axis
Dimensions W*D*H (w/o Loading & Unloading) 770×1200×1450mm
Power Supply 220V AV 50Hz
Power 3.6KW
Motion System Transmission Mechanisms

X/Y: Linear motor 

Z: Servo motor & Screw module

Repeatability X/Y: ±0.01mm Z: ±0.005mm
Positioning Accuracy X/Y: ±0.02mm Z: ±0.01mm
Max. Movement Speed X/Y: 1300mm/s Z:500mm/s
Max. Accelerated Velocity X/Y: 1.3g Z: 0.5g
Track Load-bearing Capacity 3kg
Track Width Adjustment Range (Single track) 35~520mm
Communication Protocol SMEMA/MES
Minimum Board Edge Gap 4mm
Max. Height of Devices on Top of PCB 25mm
Max. Height of Devices on Bottom of PCB 25mm
Z axis Motion Range 40mm


Applications

  • Adhesive dotting and bead sealing for smartphone camera modules, bezels and subassemblies.
  • SMT adhesive deposition for component fixation prior to reflow.
  • High‑throughput inline bonding for wearables and compact electronics.


How it works

  1. Load syringe cartridge(s) or connect heated feed line and set temperature.
  2. Upload or select recipe; vision aligns part fiducials.
  3. Dual valves dispense in parallel or staggered sequence while gantry follows programmed path.
  4. AOI inspects bead/dot geometry; recipe and batch data logged for traceability.


How to choose

Throughput vs precision: use dual‑head parallel mode for high UPH; use staggered or single‑head with piezo for micro‑dots.
Adhesive type: for filled/thixotropic adhesives choose heated feed and piston/peristaltic pump options; for minimal stringing select piezo valves.
Nozzle selection: choose nozzle geometry to match bead profile requirements; validate with pilot runs.
Integration: confirm MES/PLC protocol needs and I/O mapping for inline sync.


Installation & maintenance

Installation: inline mounting with conveyor integration; connect mains, compressed air (if needed), and network I/O. Provide safety guards.
Commissioning: perform material × nozzle × temperature × speed matrix to establish validated recipes.
Maintenance: daily nozzle cleaning for high‑use lines; regular valve cartridge inspection and quick‑change routines; monthly vision calibration.

FAQ

Q: What adhesives are supported?
A: Supports common electronics adhesives (hot‑melt, epoxies, UV‑cure, silicones). For filled adhesives validate viscosity‑temperature curves and select pump/valve accordingly.
Q: How do the dual valves operate?
A: Valves can run synchronized for identical patterns or staggered for optimized coverage; configurable per recipe.
Q: Can the system integrate with MES for recipe control?
A: Yes—supports recipe push/pull and batch logging via standard industrial protocols.