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| Brand Name: | Mingseal |
| Model Number: | GS600SU |
| MOQ: | 1 |
| Price: | $28000-$150000 / pcs |
| Delivery Time: | 5-60 Days |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union |
FCBGA SiP FCCSP Solution Inline Jet Underfill Dispensing Machine
The GS600 Series Inline Jet Underfill Dispensing Machine is an advanced, high-precision dispensing solution designed specifically for FCCSP, SiP, and FCBGA semiconductor packaging manufacturers who demand exceptional process control for Capillary Underfill (CUF) applications.
This model combines Mingseal’s proprietary piezoelectric jetting system with a dual-track inline configuration. It supports cleanroom-level operations while offering a compact footprint that optimizes valuable cleanroom space. The GS600 Series enables manufacturers to handle ultra-small glue volumes down to 0.001mg/dot, delivering precise die underfill with minimal voids—crucial for next-generation chip packaging. Users can also choose a standalone configuration with manual loading/unloading, or scale up with a fully automated handler or inline connection for seamless integration into existing SMT/SiP lines.
Core Advantages
Precision Jetting for CUF: Ensure micro-volume underfill with superior dot consistency.
Dual-Track Efficiency: Boost UPH within a tight factory footprint.
Advanced Process Control: Features real-time glue weight monitoring, bottom heating, and vacuum-assisted substrate holding.
Compact Footprint, High ROI: Designed for space-constrained semiconductor cleanrooms.
Industry-Ready: Compatible with semiconductor MES systems and standard communication protocols for smart traceability.
Typical Applications
✔ FCCSP (Flip Chip Chip Scale Package)
✔ SiP (System in Package) Multi-Chip Modules
✔ FCBGA Underfill Encapsulation
✔ Fine-Pitch Flip Chip CUF Processes
✔ Die Attach and Corner Fill for Advanced Packages
✔ Ultra-Fine Jetting for MEMS and IC Packaging
Technical Specifications
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Cleanliness Level |
Cleanliness of working area |
Class 100 (Class 1000 workshop) |
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Class 10 (Class 100 workshop) |
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Transmission Mechanism |
Transmission system |
X/Y:Linear motor Z: Servo motor&Screw module |
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Repeatability (3sigma) |
X/Y: ±0.003mm, Z: ±0.005mm |
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Positioning accuracy (3sigma) |
X/Y: ±0.010mm, Z: ±0.015mm |
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Max. movement speed |
X/Y: 1000mm/s |
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Z: 500mm/s |
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Max. accelerated velocity |
X/Y: 1g Z: 0.5g |
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Grating resolution |
1μm |
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Z axis movement range(W× D) |
3 5 0 mm×4 7 0mm |
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Z axis height calibration & compensation Method |
Laser sensor (Laser sensor) |
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Laser sensor accuracy |
2μm |
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Dispensing System |
Glue control accuracy |
± 3 % / 1mg |
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Single dot position repeatability CPK＞1.0 |
±25 μ m |
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Min. nozzle diameter |
30 μ m |
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Min. single dot glue weight |
0 .001mg/dot |
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Max. fluid viscosity |
200000cps |
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Max. jetting frequency |
1000Hz |
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Runner/nozzle heating temperature |
Room temperature~200℃ |
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Runner/nozzle heating temp. deviation |
± 2 ℃ |
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Applicable adhesive packaging spec. |
5CC/ 10CC/ 30CC/ 50CC/ 70CC |
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Syringe cooling range |
Cools down to 15°C below ambient temp. |
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Piezo cooling range |
Cools down to compressed air source temp. |
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Track System |
Number of tracks |
2 |
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Number of belt sections |
One piece |
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Max. track transmission speed |
300mm/s |
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Max. track transmission weight |
3kg |
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Minimum edge clearance |
3 mm |
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Track width adjustment range |
60mm~ 162mm Adjustable |
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Track width adjustment Method |
Manual |
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Track height |
910mm~960mm Adjustable |
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Max. thickness of applicable substrate/carrier |
6 mm |
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Applicable substrate/carrier length range |
60mm-325mm |
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Vacuum suction pressure Range |
-50~-80Kpa (Adjustable) |
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Bottom heating temperature range |
Room temperature~180℃ |
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Bottom heating temp. deviation |
≤ ± 1.5 ℃ |
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Facilities |
Footprint (W× D× H)
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2380mm*1550mm*2080mm (Loading, Unloading, and display included) |
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2380mm*1200mm*2080mm (Loading&Unloading included, display excluded) |
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Weight |
1600kg |
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Power supply |
200~240VAC, 47~63Hz (Single-phase voltage adaptation power supply) |
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Electric current |
30A |
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Power |
6.4KW |
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Inhale |
(0.5Mpa, 450L/min) ×2 |
FAQ
Q1: What makes the GS600 Series ideal for CUF?
A: Its dedicated piezo jetting system enables ultra-fine dot sizes down to 30μm with a minimum glue weight of 0.001mg—essential for void-free underfill of fine-pitch dies.
Q2: How does it handle small-batch and high-volume needs?
A: The GS600 can run in manual load/unload mode for small lots or link to auto handlers and inline tracks for continuous high-volume production.
Q3: Can it work in strict cleanroom conditions?
A: Yes—its mineral-based stable frame and enclosed system maintain consistent performance under Class 100 cleanroom requirements.
Q4: What value does Mingseal add?
A: Mingseal is a trusted high-precision dispensing specialist, delivering thousands of inline and desktop solutions globally. We back every unit with expert process engineering and local support to help you optimize yield, process control, and ROI.
Conclusion
Mingseal’s GS600 Series brings industry-leading underfill jetting technology to FCCSP, SiP, and FCBGA manufacturers seeking precise CUF with minimal footprint. Whether you need tight process control for next-gen packaging or flexible line integration, the GS600 is your proven partner for high-yield microelectronics production.
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