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High-Precision Underfill Solution Wafer-Level Dispensing Machine

1.2 Semiconductor Dispensing Machine
July 14, 2025
Category Connection: Advanced Packaging Equipment
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Tags:
#auto Dispensing Machine #automatic glue dispenser #glue dispensing equipment
Brief: Discover the SS101 RDL First WLP Underfill Advanced Packaging Equipment, a high-precision wafer-level dispensing machine designed for advanced semiconductor packaging. This machine ensures ultra-reliable underfill processes with precise thermal control, automated workflows, and cleanroom compatibility, making it ideal for 2.5D and fan-out wafer-level packaging.
Related Product Features:
  • Optimized for wafer-level underfill and CUF processes in advanced fan-out and RDL First packaging scenarios.
  • Fully automated workflow with robotic handling modules for wafer loading, alignment, preheating, and dispensing.
  • Class 10 cleanroom compatibility within a Class 1000 fab environment for minimal contamination.
  • Precise thermal control to maintain stable wafer temperatures during critical underfill operations.
  • Supports both 8-inch and 12-inch wafers with 12-inch FOUP compatibility as standard.
  • Compliant with international semiconductor ESD standards (IEC & ANSI) for seamless integration.
  • Open communication protocol for easy connection with existing factory information management systems.
  • Ideal for high-yield underfill lines in large-volume semiconductor fabs and next-gen processes like CoWoS and FoPoP.
Faqs:
  • What makes the SS101 different from standard dispensing systems?
    The SS101 is specialized for wafer-level underfill with built-in wafer alignment, preheating, and robotized transfer, ensuring uniform filling at micro-bump scales.
  • Can the SS101 handle both 8-inch and 12-inch wafers?
    Yes, it supports both sizes with 12-inch FOUP compatibility as standard and optional 8-inch open cassette configuration.
  • How does the SS101 help reduce wafer contamination?
    Its Class 10 dispensing zone and seamless robot handling minimize manual intervention, dust ingress, and ESD risk.
  • Is the SS101 easy to integrate into existing fabs?
    Absolutely, it supports SEMI-compliant wafer readers, AMHS interfaces, and standard factory communication protocols for seamless integration.
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