Singapore has steadily grown into one of Asia’s semiconductor powerhouses, hosting global players in wafer fabrication and advanced packaging. As the industry shifts toward high-performance computing and AI-driven applications, local fabs face a familiar challenge: how to ensure fast, precise underfill dispensing in advanced processes such as Fan-Out Wafer-Level Packaging (FoWLP) and 2.5D Chip on Wafer on Substrate (CoWoS).

Dispensing may appear routine, but in wafer-level packaging it often becomes a bottleneck. Small bump dimensions, narrow pitches, and low stand-off heights leave little room for error. Voids, resin overflow, or uneven flow can undermine device reliability, while process slowdowns can affect throughput at scale.

Where the Bottlenecks Arise

Engineers in Singapore fabs report three recurring issues during wafer-level dispensing:

• Inconsistent material flow – high-viscosity underfill can clog or trap bubbles, causing uneven coverage.
• Thermal instability – changes in wafer temperature shift adhesive behavior, leading to irregular flow.
• Calibration overhead – frequent adjustments and verification extend downtime and reduce efficiency.

With demand for smaller, faster, and denser chips, these pain points are magnified. A single process delay at the dispensing stage can ripple through the entire packaging line.

A Wafer-Level Solution to Match

The SS101 Wafer-Level Dispensing Machine was developed with these exact challenges in mind. Designed for CoWoS and advanced Fan-Out processes, the system integrates dedicated underfill valves capable of managing ultra-small bump structures and low stand-off encapsulation. The result is a more stable flow that minimizes clogging and bridging.

Thermal management is another focus. The machine combines preheating, a uniformly heated chuck, and automatic temperature correction, allowing adhesives to perform consistently across the wafer. This feature directly addresses one of the main causes of bottlenecks in local fabs: resin fluctuation under thermal stress.

 
Traceability and Control

To support fabs that require stringent process tracking, the SS101 incorporates weighing calibration and whole-process video monitoring. Every shot of underfill is verified in real time, providing both quality assurance and traceability. With ESD protection aligned to IEC and ANSI standards, the system is also well-suited for handling sensitive wafers in high-value production lines.

 
Implications for Singapore

The push toward advanced packaging is central to Singapore’s semiconductor roadmap. Eliminating bottlenecks in wafer-level dispensing not only boosts efficiency but also secures the reliability needed for applications in AI, mobile, and automotive electronics.

While dispensing may not capture headlines like EUV lithography or chiplet design, its role is no less critical. As fabs in Singapore continue to scale production for next-generation devices, solutions that bring precision, consistency, and monitoring to underfill dispensing will define who stays ahead in the global supply chain.