CUF FCBGA Advanced Packaging Equipment Underfill Dispensing Solution FCCSP SiP

Advanced Underfill Dispensing Solution for CUF Application in FCBGA FCCSP SiP

The GS600 series Automatic Underfill Dispensing Machine is an industry-grade solution engineered for high-precision CUF (Capillary Underfill) dispensing tasks in advanced semiconductor packaging, including FCBGA, FCCSP, and SiP modules. The GS600 series combines a piezoelectric jetting valve with six integrated process modules, which ensures steady flow rates and consistent glue patterns, even with high-viscosity epoxy and underfill adhesives. Automatic platform loading and unloading modules, plus inline visual inspection, complete the fully automated workflow, keeping yields high and manual intervention minimal.

Core Advantages

• Exceptional underfill accuracy: Piezoelectric CUF jetting module with micro-gram precision.
• Consistent quality: Closed-loop glue temperature management maintains stable flow.
• No downtime surprises: Triple low-level detection ensures glue supply stays continuous.
• Controlled heating: Vacuum fixture plus real-time heat feedback guarantees uniform substrate preheat.
• Automated operation: Fully automated wafer or substrate loading/unloading with integrated visual inspection to detect flaws before or after the process.
• Dual-track press-down structure: Preserves workpiece flatness for perfect underfill gap control.

Typical Applications

✔ FCBGA CUF Application
✔ FCCSP CUF Application
✔ SiP CUF Application

Core Modules

CUF Special Piezoelectric Jetting System
Adhesive insulation + piezoelectric ceramic temperature closed-loop control to avoid system instability caused by temperature influence
 

Triple Low-level Alarm Module
Capacitive detection + photoelectric detection + system weighing to avoid poor batch operation caused by lack of glue

 Process Module
Automatic glue residue cleaning, automatic weighing and glue amount calibration function.

 Vacuum Adsorption Heating Fixture
The temperature difference of the whole fixture surface ≤ ±1.5°C

Real-time temperature and compensation to avoid poor operation caused by product temperature variation during operation.

 Platform-Type Loading & Unloading System
Automatic sorting of feed sequenceCompletion of operation within Plasma time limit

Friendly human-machine interface design

Visual system
Positioning and detection functions
Inspection before operation to avoid defective incoming materials
Inspection after operation to prevent batch defects

FAQ

Q1: What type of adhesives are compatible with the GS600 series?
A: The machine supports a wide range of underfill epoxies, high-viscosity adhesives (up to 200,000cps), and other advanced formulations needed for fine-pitch semiconductor applications.

Q2: How does it keep the glue temperature consistent?
A: The CUF piezo jetting system works with a real-time closed-loop heater that keeps fluid-box and nozzle temperatures stable within ±2°C.

Q3: What if the glue runs low during operation?
A: The GS600 series uses triple-level alarms — weighing, capacitive sensing, and magnetic detection — to alert operators before glue runs out, avoiding process interruptions.

Q4: Can the GS600 series be integrated into an existing line?
A: Yes! The unit’s modular loading/unloading and SMEMA-compatible track design make integration into advanced packaging lines quick and cost-efficient.

About Mingseal

Mingseal is a trusted supplier of cutting-edge dispensing and jetting solutions for the global semiconductor, MEMS, and advanced electronics industries.
With decades of experience in high-precision glue application and process automation, Mingseal continues to help manufacturers push the limits of accuracy, repeatability, and cleanroom productivity.