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| Brand Name: | Mingseal |
| Model Number: | GS600SU/SUA |
| MOQ: | 1 |
| Price: | $28000-$150000 / pcs |
| Delivery Time: | 5-60 Days |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union |
The GS600 series Automatic Underfill Dispensing Machine is an industry-grade solution engineered for high-precision CUF (Capillary Underfill) dispensing tasks in advanced semiconductor packaging, including FCBGA, FCCSP, and SiP modules. The GS600 series combines a piezoelectric jetting valve with six integrated process modules, which ensures steady flow rates and consistent glue patterns, even with high-viscosity epoxy and underfill adhesives. Automatic platform loading and unloading modules, plus inline visual inspection, complete the fully automated workflow, keeping yields high and manual intervention minimal.
Core Advantages
Exceptional underfill accuracy: Piezoelectric CUF jetting module with micro-gram precision.
Consistent quality: Closed-loop glue temperature management maintains stable flow.
No downtime surprises: Triple low-level detection ensures glue supply stays continuous.
Controlled heating: Vacuum fixture plus real-time heat feedback guarantees uniform substrate preheat.
Automated operation: Fully automated wafer or substrate loading/unloading with integrated visual inspection to detect flaws before or after the process.
Dual-track press-down structure: Preserves workpiece flatness for perfect underfill gap control.
Typical Applications
✔ FCBGA CUF Application
✔ FCCSP CUF Application
✔ SiP CUF Application
The GS600SU series combines six integrated process modules for a fully automated CUF underfill workflow:
Step 1 — Automated Loading: The platform-type loading system automatically sequences incoming substrates within the Plasma time window. The human-machine interface provides intuitive operation with recipe management.
Step 2 — Pre-Process Inspection: The vision system performs incoming material inspection to identify and reject defective substrates before dispensing, preventing waste of underfill material.
Step 3 — Thermal Conditioning: The vacuum adsorption heating fixture preheats the substrate to target temperature. Real-time temperature compensation maintains uniform conditions throughout the dispensing cycle.
Step 4 — Precision CUF Jetting: The piezoelectric jetting module dispenses underfill adhesive with closed-loop temperature control. Specialized CUF jetting ensures capillary flow into narrow die-to-substrate gaps without voids or air entrapment.
Step 5 — Weighing Calibration: The automatic weighing module calibrates glue amount between cycles. Triple low-level alarms monitor adhesive supply via capacitive, photoelectric, and weighing detection to prevent interruptions.
Step 6 — Post-Process Inspection & Unloading: After-dispensing vision inspection verifies complete underfill coverage. Qualified substrates proceed to the unloading module. Full process data is logged to MES for complete traceability.
Selecting the right capillary underfill dispensing solution for FCBGA, FCCSP and SiP packaging requires evaluating these decision factors:
1. Application Coverage — Verify the system supports your full portfolio: FCBGA, FCCSP, and SiP CUF applications. Multi-process flexibility reduces equipment investment and floor space requirements.
2. Jetting Precision — Piezoelectric jetting with micro-gram precision and closed-loop temperature control (±2°C) ensures consistent underfill flow for high-viscosity adhesives up to 200,000cps.
3. Material Supply Reliability — Triple low-level alarm system (capacitive + photoelectric + system weighing) prevents batch defects caused by unexpected glue depletion. Automatic glue residue cleaning reduces operator intervention.
4. Thermal Control — Vacuum adsorption heating fixture with real-time temperature feedback maintains surface uniformity within ±1.5°C, critical for consistent underfill viscosity and void-free filling.
5. Automation Level — Platform-type auto loading/unloading with automatic feed sequencing and Plasma time-window compliance supports high-volume production with minimal manual handling.
6. Quality Assurance — Pre-dispensing inspection rejects defective materials before processing. Post-dispensing visual verification prevents batch defects. MES connectivity provides full traceability for each unit.
Core Modules
CUF Special Piezoelectric Jetting System
Adhesive insulation + piezoelectric ceramic temperature closed-loop control to avoid system instability caused by temperature influence
Triple Low-level Alarm Module
Capacitive detection + photoelectric detection + system weighing to avoid poor batch operation caused by lack of glue
Process Module
Automatic glue residue cleaning, automatic weighing and glue amount calibration function.
Vacuum Adsorption Heating Fixture
The temperature difference of the whole fixture surface ≤ ±1.5°C. Real-time temperature and compensation to avoid poor operation caused by product temperature variation during operation.
Platform-Type Loading & Unloading System
Automatic sorting of feed sequence. Completion of operation within Plasma time limit. Friendly human-machine interface design.
Visual System
Positioning and detection functions. Inspection before operation to avoid defective incoming materials. Inspection after operation to prevent batch defects.
FAQ
Q1: What type of adhesives are compatible with the GS600 series?
A: The machine supports a wide range of underfill epoxies, high-viscosity adhesives (up to 200,000cps), and other advanced formulations needed for fine-pitch semiconductor applications.
Q2: How does it keep the glue temperature consistent?
A: The CUF piezo jetting system works with a real-time closed-loop heater that keeps fluid-box and nozzle temperatures stable within ±2°C.
Q3: What if the glue runs low during operation?
A: The GS600 series uses triple-level alarms — weighing, capacitive sensing, and magnetic detection — to alert operators before glue runs out, avoiding process interruptions.
Q4: Can the GS600 series be integrated into an existing line?
A: Yes! The unit's modular loading/unloading and SMEMA-compatible track design make integration into advanced packaging lines quick and cost-efficient.
About Mingseal
Mingseal is a trusted supplier of cutting-edge dispensing and jetting solutions for the global semiconductor, MEMS, and advanced electronics industries. With decades of experience in high-precision glue application and process automation, Mingseal continues to help manufacturers push the limits of accuracy, repeatability, and cleanroom productivity.
