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Advanced Underfill Dispensing Solution for FCBGA FCCSP

1.2 Semiconductor Dispensing Machine
July 14, 2025
Keyword: Advanced Packaging Equipment
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Tags:
#auto Dispensing Machine #automatic glue dispenser #glue dispensing equipment
Video Description:
Discover the GS600 series Automatic Underfill Dispensing Machine, the ultimate solution for high-precision CUF applications in FCBGA, FCCSP, and SiP modules. This advanced semiconductor packaging equipment ensures consistent glue patterns and minimal manual intervention with its six integrated process modules.
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