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Advanced Underfill Dispensing Solution for FCBGA FCCSP

1.2 Semiconductor Dispensing Machine
July 14, 2025
Category Connection: Advanced Packaging Equipment
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Tags:
#auto Dispensing Machine #automatic glue dispenser #glue dispensing equipment
Brief: Discover the GS600 series Automatic Underfill Dispensing Machine, the ultimate solution for high-precision CUF applications in FCBGA, FCCSP, and SiP modules. This advanced semiconductor packaging equipment ensures consistent glue patterns and minimal manual intervention with its six integrated process modules.
Related Product Features:
  • Piezoelectric CUF jetting module with micro-gram precision for exceptional underfill accuracy.
  • Closed-loop glue temperature management maintains stable flow for consistent quality.
  • Triple low-level detection ensures continuous glue supply, preventing downtime surprises.
  • Vacuum fixture with real-time heat feedback guarantees uniform substrate preheat.
  • Fully automated wafer or substrate loading/unloading with integrated visual inspection.
  • Dual-track press-down structure preserves workpiece flatness for perfect underfill gap control.
  • Supports high-viscosity adhesives up to 200,000cps for fine-pitch semiconductor applications.
  • Modular design with SMEMA-compatible track for easy integration into existing lines.
Faqs:
  • What type of adhesives are compatible with the GS600 series?
    The machine supports a wide range of underfill epoxies, high-viscosity adhesives (up to 200,000cps), and other advanced formulations needed for fine-pitch semiconductor applications.
  • How does it keep the glue temperature consistent?
    The CUF piezo jetting system works with a real-time closed-loop heater that keeps fluid-box and nozzle temperatures stable within ±2°C.
  • What if the glue runs low during operation?
    The GS600 series uses triple-level alarms -- weighing, capacitive sensing, and magnetic detection -- to alert operators before glue runs out, avoiding process interruptions.
  • Can the GS600 series be integrated into an existing line?
    Yes! The unit's modular loading/unloading and SMEMA-compatible track design make integration into advanced packaging lines quick and cost-efficient.
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