The Growing Demand for Advanced Packaging in Taiwan

As the global semiconductor industry shifts toward high-density integration, Taiwan continues to lead with 2.5D and 3D IC stacking technologies. From high-performance computing to AI accelerators and advanced GPUs, these architectures require fine-pitch interconnections and minimal stand-off heights, placing extreme demands on underfill quality.

Traditional dispensing solutions often struggle with small bumps, narrow pitches, and tight keep-out zones. Uneven underfill not only risks voids and delamination, but also creates thermal stress that can shorten device lifespan. To meet these challenges, wafer-level dispensing machines such as Mingseal's SS101 Wafer-Level Dispensing Machine provide the precision and stability necessary for reliable 2.5D/3D IC packaging.

Why Uniform Underfill Matters in 2.5D/3D IC Stacking

In 2.5D and 3D architectures, chips are stacked on silicon interposers or directly bonded, leaving tiny gaps that must be filled with underfill resin. Any inconsistency—whether a void, bubble, or overflow—can compromise electrical performance and mechanical strength.

Uniform underfill is critical because it:

• Prevents mechanical stress fractures during thermal cycling.
• Ensures electrical reliability by avoiding resin voids near fine-pitch connections.
• Maintains thermal stability in high-power devices like CPUs, GPUs, and ASICs.
• Supports long-term device reliability, especially for HPC and AI-driven applications.
   

How Wafer-Level Dispensing Machines Solve the Challenge

The SS101 Wafer-Level Dispensing Machine addresses these challenges with advanced features tailored for 2.5D and 3D IC stacking.

1. Precision Control for Small Bumps and Narrow Pitch
The SS101 is designed for ultra-small bump dimensions and low stand-off heights, delivering consistent resin flow that eliminates voids and air gaps. Its dedicated underfill valve system prevents clogging and bubble formation, a common issue in high-density packaging.

2. Stable Thermal Management
Thermal fluctuations during underfill can lead to resin shrinkage or uneven flow. The SS101 integrates preheating, uniform chuck table heating, and automatic temperature correction, ensuring consistent resin viscosity and uniform capillary flow throughout the wafer.

3. Programmable Dispensing Paths for Complex Layouts
2.5D and 3D IC packaging often involves irregular wafer layouts and varying fill depths. With flexible path editing, the SS101 adapts to different package designs, improving efficiency while reducing waste.

4. Real-Time Process Monitoring and Calibration
To meet the rigorous standards of advanced semiconductor packaging, the SS101 integrates real-time glue weight calibration and video monitoring. This enables accurate volume control, full process traceability, and immediate fault detection—minimizing production downtime.

5. ESD Protection for Sensitive Wafers
With advanced IC stacks often including sensitive GPU, CPU, or ASIC wafers, ESD events can result in costly failures. The SS101 complies with IEC and ANSI ESD protection standards, safeguarding wafers during the dispensing process.

Application Areas in Taiwan’s Semiconductor Industry

The SS101 is already being applied across Taiwan’s leading advanced packaging fabs, supporting processes such as:

• Fan-Out 2.5D Chip on Wafer on Substrate (CoWoS) – ensuring stable underfill for large interposers.
• RDL First Fan-Out Wafer-Level Packaging (FoWLP) – handling ultra-fine redistribution layers.
• High-Density CPU/GPU Underfill – improving reliability in high-performance computing.
• Small Bump Fine-Pitch Encapsulation – ensuring uniform fill for AI and data center processors.

Conclusion

As 2.5D and 3D IC stacking become central to next-generation semiconductor packaging, the need for uniform, precise underfill dispensing is greater than ever. Taiwan, as a global leader in advanced packaging, requires equipment that delivers both accuracy and stability at wafer scale.

The SS101 Wafer-Level Dispensing Machine meets this demand by providing dedicated underfill valve control, stable thermal management, programmable dispensing paths, and real-time monitoring. For semiconductor fabs seeking to improve yield, ensure reliability, and scale production of advanced IC stacks, wafer-level dispensing technology is no longer optional—it’s a necessity.