Across Asia, semiconductor and electronics assembly plants face a recurring challenge: high-frequency jetting valves leaking during adhesive dispensing. Engineers in Singapore, South Korea, and Japan have all reported similar issues—especially when handling corrosive adhesives used in optical modules, camera lenses, and MEMS devices.

In a Seoul-based MEMS assembly line, operators noticed that traditional valves quickly deteriorated when dispensing aggressive epoxies. In Tokyo, camera module manufacturers experienced inconsistent glue dots and occasional overflow, slowing production. Even in Singapore’s wafer-level packaging fabs, leakage in high-frequency jetting was a bottleneck that affected both throughput and yield.

Corrosive Adhesives: The Hidden Risk

The root cause is often material incompatibility. Standard metal wetted valves react with corrosive fluids, leading to micro-leakage, air bubbles, and unstable dosing. In high-volume production, even minor leaks can multiply into significant downtime and product defects.

 
KPS4000: Corrosion-Resistant Piezo Solution

Many manufacturers are turning to the KPS4000 Piezoelectric Jetting Valve for a more reliable solution. This valve features ceramic and PEEK wetted parts that resist corrosive adhesives while maintaining high-frequency, high-precision micro-dosing. Its non-contact jetting mechanism reduces contamination and ensures stable glue delivery even under aggressive conditions.

For example, a camera lens assembler in Osaka integrated the KPS4000 into their line and achieved consistent dot placement at high speeds with minimal maintenance. Similarly, a Singapore MEMS fab reported improved yield and reduced downtime after replacing conventional valves with the KPS4000.

Lessons for Singapore, Korea, and Japan

For high-precision manufacturers, jetting valve leakage is not merely a technical issue—it affects productivity, cost, and product reliability. Using a corrosion-resistant solution like KPS4000 helps overcome these challenges, providing stable dispensing, lower maintenance, and higher process reliability.

As electronics and semiconductor hubs in Asia expand their advanced packaging capabilities, solutions like KPS4000 that combine chemical resistance, high-frequency jetting, and precise control will be increasingly critical to maintaining competitive production lines.