Brief: Discover the Mingseal GS600SUA SiP & FCBGA Coating Underfill Dispensing Machine, designed for high-reliability semiconductor production. This advanced inline jet underfill dispenser ensures ultra-fine dispensing paths, precise glue control, and minimal overflow for FCBGA packaging applications. Perfect for CPU underfill and high-density BGA packages.
Related Product Features:
Industry-leading KOZ control with glue spread consistently under 250μm.
Height-controlled capillary flow maintains fill height below 70% of die height.
Precision glue weight and path control with volume variation within ±3%.
Reliable low-level monitoring reduces process interruptions and improves efficiency.
Advanced piezo jetting module ensures high fill uniformity and minimal overflow.
Real-time glue weight calibration for stable and accurate dispensing.
Triple low-level alarm module prevents unexpected downtime in mass production.
Precision visual alignment system with repeatable dot accuracy within ±25µm.
Faqs:
How does the GS600 control KOZ below 250 μm?
Our proprietary path planning and flow control algorithms precisely confine glue spread, while high-resolution jetting and vision alignment minimize lateral flow beyond the intended area.
How do you ensure the flow does not climb too high?
By combining precision piezo jetting with advanced temperature control and bottom heating, the GS600 consistently limits the fill height to <70% of die height.
What about glue weight consistency?
Real-time inline glue weight inspection keeps glue output stable within ±3% while dot placement holds repeatability within ±25μm.
How is downtime minimized?
The GS600 includes a triple low-level alarm, integrated MES traceability, and smart syringe status detection, ensuring material runs are predictable and uninterrupted.