FCBGA FCCSP のための高度な不充填配給ソリューション

1.2 半導体配給機
July 14, 2025
Video Description:
Discover the GS600 series Automatic Underfill Dispensing Machine, the ultimate solution for high-precision CUF applications in FCBGA, FCCSP, and SiP modules. This advanced semiconductor packaging equipment ensures consistent glue patterns and minimal manual intervention with its six integrated process modules.