FCBGA FCCSP のための高度な不充填配給ソリューション

1.2 半導体配給機
July 14, 2025
カテゴリー接続: 先進的な包装機器
概要: Discover the GS600 series Automatic Underfill Dispensing Machine, the ultimate solution for high-precision CUF applications in FCBGA, FCCSP, and SiP modules. This advanced semiconductor packaging equipment ensures consistent glue patterns and minimal manual intervention with its six integrated process modules.
関連製品特性:
  • Piezoelectric CUF jetting module with micro-gram precision for exceptional underfill accuracy.
  • Closed-loop glue temperature management maintains stable flow for consistent quality.
  • Triple low-level detection ensures continuous glue supply, preventing downtime surprises.
  • Vacuum fixture with real-time heat feedback guarantees uniform substrate preheat.
  • Fully automated wafer or substrate loading/unloading with integrated visual inspection.
  • Dual-track press-down structure preserves workpiece flatness for perfect underfill gap control.
  • Supports high-viscosity adhesives up to 200,000cps for fine-pitch semiconductor applications.
  • Modular design with SMEMA-compatible track for easy integration into existing lines.
よくある質問:
  • What type of adhesives are compatible with the GS600 series?
    The machine supports a wide range of underfill epoxies, high-viscosity adhesives (up to 200,000cps), and other advanced formulations needed for fine-pitch semiconductor applications.
  • How does it keep the glue temperature consistent?
    The CUF piezo jetting system works with a real-time closed-loop heater that keeps fluid-box and nozzle temperatures stable within ±2°C.
  • What if the glue runs low during operation?
    The GS600 series uses triple-level alarms -- weighing, capacitive sensing, and magnetic detection -- to alert operators before glue runs out, avoiding process interruptions.
  • Can the GS600 series be integrated into an existing line?
    Yes! The unit's modular loading/unloading and SMEMA-compatible track design make integration into advanced packaging lines quick and cost-efficient.