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SMT PCBA Underfill Glue Dual-Valve Precision Dispensing System

1.2 Semiconductor Dispensing Machine
July 18, 2025
Category Connection: Adhesive Dispensing Machine
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Tags:
#automatic glue dispenser #glue dispensing systems #Inline Dispensing Equipment
Brief: Discover the FS600 Series SMT PCBA Hot Melt Glue Dispenser Machine, a high-efficiency dual-valve inline dispensing system designed for SMT underfill, BGA/CSP encapsulation, and PCB solder paste jetting. Boost your production cycle time and yield with this advanced dual-head, dual-vision solution.
Related Product Features:
  • Double-head double-valve design for flexible high throughput and reduced line changeover downtime.
  • Dual-vision system with top-and-bottom CCD modules for automatic alignment and ±10μm repeatability.
  • Compact floor-standing design fits various SMT workshop layouts with modular expansion options.
  • Supports multiple processes on one machine, including SMT underfill and PCBA solder paste jetting.
  • Ideal for MiniLED, LED module packaging, FPC cable glue dispensing, and automotive electronics.
  • Dual-head synchronous operation increases UPH by 50%-100% compared to single-head models.
  • Automatic deviation correction ensures consistent underfill quality and stable solder paste lines.
  • SMEMA-compliant for seamless integration with SMT lines, AOI, and MES systems.
Faqs:
  • How does the FS600DDF improve dispensing line efficiency?
    The dual-head, dual-valve design allows two valves to work independently or simultaneously, enabling multiple processes on the same line without valve replacement, maximizing equipment utilization and doubling cycle speed.
  • What ensures underfill consistency and stable solder paste lines?
    The dual-vision system uses top and bottom CCD cameras for automatic PCB alignment and deviation compensation, achieving ±10μm repeatability for uniform glue volume and full underfill coverage.
  • Can the FS600 Series integrate with existing SMT lines and MES?
    Yes, it fully complies with SMEMA standards and can connect seamlessly with upstream and downstream SMT equipment, including optional AOI, UV curing, and weight monitoring modules, and is compatible with SECS-GEM/MES for traceable production.
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