SMT PCBA Underfill Glue Dual-Valve Precision Dispensing System

1.2 Semiconductor Dispensing Machine
July 18, 2025
Video Description:
Discover the FS600 Series SMT PCBA Hot Melt Glue Dispenser Machine, a high-efficiency dual-valve inline dispensing system designed for SMT underfill, BGA/CSP encapsulation, and PCB solder paste jetting. Boost your production cycle time and yield with this advanced dual-head, dual-vision solution.