FCBGA FCCSP를 위한 고급 부충기 분배 솔루션

1.2 반도체 디스펜싱 기계
July 14, 2025
Video Description:
Discover the GS600 series Automatic Underfill Dispensing Machine, the ultimate solution for high-precision CUF applications in FCBGA, FCCSP, and SiP modules. This advanced semiconductor packaging equipment ensures consistent glue patterns and minimal manual intervention with its six integrated process modules.