Video-Kanal von China Changzhou Mingseal Robot Technology Co., Ltd.
Plaudern Kontaktieren Sie uns
Haus Videos Wiedergabeliste Webseite

Fortgeschrittene Unterfüll-Dosierlösung für FCBGA FCCSP

1.2 Halbleiter-Abgabemaschine
July 14, 2025
Kategorieverbindung: Fortschrittliche Verpackungsanlagen
Plaudern Kontaktieren Sie uns
Tags:
#Automatische Verteilermaschine #Automatische Kleber-Zufuhr #Kleberschankanlage
Kurzfassung: Discover the GS600 series Automatic Underfill Dispensing Machine, the ultimate solution for high-precision CUF applications in FCBGA, FCCSP, and SiP modules. This advanced semiconductor packaging equipment ensures consistent glue patterns and minimal manual intervention with its six integrated process modules.
Verwandte Produktmerkmale:
  • Piezoelectric CUF jetting module with micro-gram precision for exceptional underfill accuracy.
  • Closed-loop glue temperature management maintains stable flow for consistent quality.
  • Triple low-level detection ensures continuous glue supply, preventing downtime surprises.
  • Vacuum fixture with real-time heat feedback guarantees uniform substrate preheat.
  • Fully automated wafer or substrate loading/unloading with integrated visual inspection.
  • Dual-track press-down structure preserves workpiece flatness for perfect underfill gap control.
  • Supports high-viscosity adhesives up to 200,000cps for fine-pitch semiconductor applications.
  • Modular design with SMEMA-compatible track for easy integration into existing lines.
FAQ:
  • What type of adhesives are compatible with the GS600 series?
    The machine supports a wide range of underfill epoxies, high-viscosity adhesives (up to 200,000cps), and other advanced formulations needed for fine-pitch semiconductor applications.
  • How does it keep the glue temperature consistent?
    The CUF piezo jetting system works with a real-time closed-loop heater that keeps fluid-box and nozzle temperatures stable within ±2°C.
  • What if the glue runs low during operation?
    The GS600 series uses triple-level alarms -- weighing, capacitive sensing, and magnetic detection -- to alert operators before glue runs out, avoiding process interruptions.
  • Can the GS600 series be integrated into an existing line?
    Yes! The unit's modular loading/unloading and SMEMA-compatible track design make integration into advanced packaging lines quick and cost-efficient.
Ähnliche Videos
SMT PCBA Unterfüllkleber Präzisionsdosiersystem mit Doppelventil 00:48

SMT PCBA Unterfüllkleber Präzisionsdosiersystem mit Doppelventil
1.2 Halbleiter-Abgabemaschine
July 18, 2025
PCB-Pad-Anwendung Inline-Visuelle Lötmaschine 00:25

PCB-Pad-Anwendung Inline-Visuelle Lötmaschine
1.2 Halbleiter-Abgabemaschine
July 15, 2025
Mingseal SiP & FCBGA Beschichtungs-Underfill-Dosieranlage GS600SUA 00:38

Mingseal SiP & FCBGA Beschichtungs-Underfill-Dosieranlage GS600SUA
1.2 Halbleiter-Abgabemaschine
July 15, 2025
Einführung in die Mingseal-Technologie 00:14

Einführung in die Mingseal-Technologie
2.1 Firmeninformationen
July 23, 2025
Changzhou Mingseal Dosierausrüstungshersteller 00:55

Changzhou Mingseal Dosierausrüstungshersteller
2.1 Firmeninformationen
July 16, 2025
Exzenterschraubenventil für Zwei-Komponenten-Dosierung | Hohe Präzision von Mingseal 00:26

Exzenterschraubenventil für Zwei-Komponenten-Dosierung | Hohe Präzision von Mingseal
1.4 Schneckenventil
July 23, 2025
Mingseal FS600A Inline-Dosierung für CCM-Kameramodule 00:13

Mingseal FS600A Inline-Dosierung für CCM-Kameramodule
2.2 Ereignisse
October 14, 2025
Mingseal KDC2500 Präzisionskontroller 00:19

Mingseal KDC2500 Präzisionskontroller
2.2 Ereignisse
October 14, 2025
Mingseal Precision Piezo & Screw Jetting Ventile Sammlung 00:15

Mingseal Precision Piezo & Screw Jetting Ventile Sammlung
2.2 Ereignisse
October 14, 2025
GS600SUA Hochgeschwindigkeits-Halbleiterlösung Unterfüllstrahl-Disponierungsausrüstung 00:27

GS600SUA Hochgeschwindigkeits-Halbleiterlösung Unterfüllstrahl-Disponierungsausrüstung
2.2 Ereignisse
October 14, 2025