As smartphones, earbuds, and wearable devices continue to shrink in size while expanding in functionality, micro speakers have become a critical component. These tiny acoustic units must deliver clear, distortion-free sound, even as their housings become smaller and more complex. For manufacturers, the biggest challenge lies in dispensing adhesives during assembly—too much adhesive, or inconsistent placement, can alter vibration behavior, compromise acoustic quality, and increase defect rates.

So, how can manufacturers in high-density electronics assembly ensure precise, reliable adhesive dispensing without impacting sound performance?

The Solution: Automated Jetting with Dual Piezo Control

The KPS6000 Automated Jetting Dispenser with Dual Piezo Hydraulic Valve is designed to address these micro-assembly challenges head-on. Unlike traditional time-pressure or needle dispensing methods, the dual piezo system provides non-contact jetting with ultra-fast response. Its dual actuators deliver 20% greater jetting force, enabling accurate dispensing of high-viscosity adhesives (up to 500,000 mPa·s) while maintaining stable dot size and repeatability.

Key technical strengths include:

• Precision glue control: 0.01ms valve opening time, with minimum jet volume as low as 0.5nl (CPK > 1.33).
• Consistency without calibration: Nozzle-free adjustment design ensures quick recovery after maintenance.
• Process adaptability: Multifunctional controller supports flow channel heating, monitoring, and up to 10 programmable dispensing parameters.
• Easy integration: Standardized flow channels and foolproof design make it simple to install and maintain.

For micro speakers, this means adhesive can be applied precisely to bonding lines and sealing areas without spilling into acoustic cavities—maintaining optimal sound quality.

Case Example: Micro Speaker Production in Southeast Asia

A Singapore-based electronics manufacturer recently faced yield challenges in its earbud speaker assembly line. Traditional dispensing methods caused adhesive overflow near vibration membranes, leading to inconsistent sound performance. After adopting the KPS6000 Dual Piezo Jet Valve, the company reported:

• 40% reduction in acoustic defects, thanks to precise glue control.
• Increased UPH with non-contact jetting that supported over 1000Hz jetting frequency.
• Lower maintenance downtime, as calibration was no longer required after servicing.

This not only improved overall product reliability but also reduced scrap rates, directly lowering manufacturing costs in a highly competitive market.

Applications Beyond Micro Speakers

While micro speakers are a standout application, the KPS6000 also supports chip underfill, solder paste jetting, optical lens bonding, and biomedical microfluidics—all sectors where Singapore manufacturers are investing heavily in advanced packaging and miniaturized devices.

Conclusion

In precision electronics assembly, especially in Singapore’s competitive smart device manufacturing ecosystem, controlling adhesive placement in micro-scale components is critical. The KPS6000 Dual Piezo Jetting Dispenser delivers speed, precision, and stability, ensuring adhesives are applied without compromising acoustic or functional performance.

For companies seeking to enhance product quality, reduce defects, and scale up high-volume production, adopting advanced dispensing solutions like the KPS6000 is no longer optional—it’s a strategic necessity.