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Advanced Packaging Equipment
Created with Pixso. AD TIM Advanced Packaging Equipment Glue Dispensing System For Lid Attach Processes

AD TIM Advanced Packaging Equipment Glue Dispensing System For Lid Attach Processes

Brand Name: Mingseal
Model Number: GS600DD
MOQ: 1
Price: $28000-$150000 / pcs
Delivery Time: 5-60 Days
Payment Terms: L/C,D/A,D/P,T/T,Western Union
Detail Information
Place of Origin:
China
Certification:
ISO CE
Dimensions:
770×1650×2100mm
Dispensing Range:
355mm×595mm
Footprint:
770×1650×2100mm
Camera View:
35×35mm
Packaging Details:
Wooden Case
Highlight:

AD Advanced Packaging Equipment

,

TIM Advanced Packaging Equipment

,

Glue Dispensing System 595mm

Product Description

Dual-Valve AD/TIM Glue Dispensing System for Lid Attach Processes

 

The GS600 series is an advanced dual-valve inline dispensing system purpose-built to handle demanding AD (Adhesive Dispensing) and TIM (Thermal Interface Material) applications in lid attach processes for high-end semiconductor packaging.
In modern CPU or GPU manufacturing, ensuring precise and void-free bonding between die and lid is critical for thermal management and mechanical protection. The GS600 series makes this possible by delivering highly accurate, repeatable glue paths for both structural adhesives and thermal interface materials in a single pass.

Its dual-valve architecture enables synchronous dispensing, allowing manufacturers to apply different materials sequentially or simultaneously. The system’s machine vision module automatically identifies the workpiece position, aligns the nozzle height, and generates a precise glue path to meet strict lid attach specifications.

 

 

Core Advantages

 

  • Purpose-built for Lid Attach: Supports AD/TIM dispensing to create a reliable, void-free bond between silicon die and heat spreader.
  • Dual-Valve Flexibility: Configure screw valves for high-viscosity adhesives or piezo jetting valves for ultra-precise TIM application.
  • Consistent Quality: Machine vision auto alignment, glue tank scanning, and laser needle height sensors ensure precise glue volumes every cycle.
  • Productivity Boost: Synchronous interpolation reduces cycle time by enabling dual material dispensing in a single workstation.
  • Easy Integration: Compatible with MES systems and existing packaging lines. Cabinet design allows easy maintenance and process expansion.

 


Typical Applications


Lid attach station for CPU/GPU packaging
Adhesive bonding for metal lids and heat spreaders
TIM layer deposition for advanced thermal management
Void-free underfill or dam & fill bonding processes
Multi-material bonding in semiconductor assembly

 


Technical Specifications

 
 
Transmission System Dimensions 770×1650×2100mm
Transmission system

X/Y: Linear motor 

Z: Servo motor&Screw module

Repeatability (3sigma) X/Y: ±5 μm Z: ±10 μm
Positioning accuracy (3sigma) X/Y: ±10 μm Z: ±25 μm
Max. movement speed X/Y:1300mm/s Z: 500mm/s
Max. accelerated velocity X/Y:1.3g Z:0.5g
Dispensing range 355mm×595mm
Grating resolution 1 μm
Visual repetitive matching accuracy 5μ m
Adhesive single-point position accuracy ≤±30 μ m
Laser sensor accuracy ±1 μ m
Applicable syringe type 5cc, 10cc,30cc,50cc,70cc
Glue weight accuracy 10mg±3%,5mg±5%
Weighing module accuracy 220g/0.1mg
Vision Module Pixel 500W (2048×2448dpi)
Lens 0.2X telecentric lens
Camera view 35×35mm
Single pixel accuracy 17um
Glue width detection ≥ 170um

Angle correction capability of the secondary valve

relative to the main valve

0-180° (7 ×7mmWorkpiece)
0-3° (110×110mmWorkpiece)
Shooting method Positioning shot/fly shot
Facilities Ambient temp. & humidity 25℃±5℃ , 30 ~ 70%
Footprint W× D × H

770×1650×2100mm

(w/o Loading & Unloading)

 

 

FAQ

 

Q1: How does GS600 series ensure uniform TIM and adhesive coverage?
A: Its machine vision auto-tracking, laser height detection, and synchronous dual-valve operation deliver precise path control and volume repeatability.

 

Q2: Can I switch between screw and piezo jetting valves?
A: Absolutely. The GS600 series supports both valve types, allowing you to handle high-viscosity structural adhesives and low-viscosity thermal pastes on the same line.

 

Q3: Is it suitable for high-volume production?
A: Yes. The system is designed for inline integration in semiconductor factories, with robust cabinet build quality, FFU filtration, and real-time monitoring to ensure stable output.

 

Q4: Can it integrate with upstream and downstream automation?
A: Yes. The GS600 series is compatible with MES, glue tank scanners, and auto loaders/unloaders for seamless inline operation.

 


About Mingseal


Mingseal is a trusted partner for precision fluid dispensing solutions serving global semiconductor, MEMS, optical, and electronics industries. With decades of experience, we help manufacturers improve yield, reduce cycle time, and meet the tightest tolerances for next-generation microelectronic packaging.