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| Brand Name: | Mingseal |
| Model Number: | GS600SU |
| MOQ: | 1 |
| Price: | $28000-$150000 / pcs |
| Delivery Time: | 5-60 Days |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union |
FCBGA Packaging CUF Application Inline Jet Underfill Dispenser
The GS600 Series Inline Jet Underfill Dispenser is Mingseal’s next-generation solution engineered specifically for FCBGA encapsulating applications, where process stability, ultra-fine dispensing paths, and precise glue control are critical to yield and performance.
Built for high-reliability semiconductor production, the GS600 integrates an advanced piezo jetting module, real-time glue weight calibration, and a triple low-level alarm module—ensuring zero unexpected downtime in demanding mass production lines.
A key advantage for CPU packaging is the ability to strictly limit flow height to less than 70% of the chip’s sidewall while keeping keep-out zones (KOZ) under 250 μm. Combined with a precision visual alignment system and repeatable dot accuracy within ±25µm, the GS600 ensures minimal overflow and high fill uniformity.
Core Advantages
Typical Applications
✔ FCBGA (CPU) Underfill
✔ Flip Chip CPU Die Attach Protection
✔ High-Density BGA Packages
✔ Fine-Pitch Flip Chip Bonding
✔ Capillary Fill for High-Performance Microprocessors
Technical Specifications
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Cleanliness Level |
Cleanliness of working area |
Class 100 (Class 1000 workshop ); Class 10 (Class 100 workshop) |
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Transmission System |
Transmission System |
X/Y: Linear motor Z: Servo motor&Screw module |
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Repeatability (3sigma) |
X/Y:±0.003mm Z:±0.005mm |
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Positioning Accuracy (3sigma) |
X/Y:±0.010mm Z:±0.015mm |
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Max. Speed |
X/Y:1000mm/s |
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Z: 500mm/s |
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Max. Acceleration |
X/Y:1g Z:0.5g |
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Grating Resolution |
1 μm |
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Z-Axis Range (W*D) |
350*470mm |
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Laser Sensor Accuracy |
2 μm |
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Jetting System |
Adhesive Control Precision |
±3%/1mg |
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Single-dot Dispensing Position Repeatability |
±25 μ m |
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Min. Nozzle Diameter |
30 μ m |
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Min. Single-dot Weight |
0.001mg/dot |
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Max. Fluid Viscosity |
200000cps |
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Max. Jetting Frequency |
1000Hz |
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Fluid-box/Nozzle Heating Temperature |
Room Temperature~200℃ |
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Fluid-box/Nozzle Heating Temperature Deviation |
±2℃ |
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Track System |
Max. Convey Speed |
300mm/s |
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Width Adjustment Range |
60-162mm |
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Max. Carrier Plate Thickness |
6mm |
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Max. Vacuum Suction Pressure |
-80KPa ~ -50KPa |
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Bottom Heating Temperature Range |
Room Temperature~150℃ |
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Bottom Heating Temperature Deviation |
±1.5℃ |
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Number of Tracks |
2 |
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General Condition |
Footprint W× D × H |
2380*1550*2080mm (With loading & Unloading and Screen Display) |
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2380*1550*2080mm (With loading & Unloading, w/o Screen Display) |
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Current |
30A |
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Power |
9.4kw |
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Air Inlet |
(0.5Mpa, 450L/min)×2 |
FAQ
Q1: How does the GS600 control KOZ below 250μm?
A: Our proprietary path planning and flow control algorithms precisely confine glue spread, while high-resolution jetting and vision alignment minimize lateral flow beyond the intended area.
Q2: How do you ensure the flow does not climb too high?
A: By combining precision piezo jetting with advanced temperature control and bottom heating, the GS600 consistently limits the fill height to <70% of die height.
Q3: What about glue weight consistency?
A: Real-time inline glue weight inspection keeps glue output stable within ±3% while dot placement holds repeatability within ±25μm.
Q4: How is downtime minimized?
A: The GS600 includes a triple low-level alarm, integrated MES traceability, and smart syringe status detection, ensuring material runs are predictable and uninterrupted.
About Mingseal
As a trusted leader in high-precision dispensing, Mingseal provides cutting-edge inline and desktop systems for semiconductor, electronics, and precision optics industries. With deep process expertise, global support teams, and a commitment to smart manufacturing, we help advanced packaging factories achieve higher yield, lower cost, and stable quality—from CPU to SiP, BGA, and beyond.
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