| Brand Name: | Mingseal |
| Model Number: | VS300D |
| MOQ: | 1 |
| Price: | $6000-$50000 / pcs |
| Delivery Time: | 5-60 Days |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union |
The EDU Module dispensing machine is a benchtop glue dispenser designed for EV battery cell prototyping, lab validation and small pilot runs. Key features include heated 10 kg reservoir option, selectable valve metering, programmable XYZ motion, recipe storage, optional vision alignment and MES connectivity for traceable process setup.
Problem: Manual underfill, tab glue and module sealing lead to inconsistent adhesive volume, voids and assembly failures in battery prototypes.
Cause: Viscosity changes, manual dosing variability and poor placement accuracy cause inconsistent joints and thermal/electrical reliability issues.
Solution: Use a desktop dispenser with temperature control, agitation, precise metering and recipe management to stabilize viscosity, control deposit volume and place adhesive accurately. Validate recipes via pilot runs and AOI or electrical checks before scale‑up.
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Motion System |
4-axis (X/Y/Z + Rotation) |
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Transmission |
Servo motor & screw module |
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Repeatability |
X/Y: ±0.015mm |
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Positioning Accuracy |
X/Y: ±0.025mm |
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Max Speed |
X/Y: 500mm/s, Z: 300mm/s |
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Max Acceleration |
X/Y: 0.5g, Z: 0.3g |
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Max Fixture Load |
10 kg |
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Visual Positioning |
Mark / product feature recognition |
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Identify Accuracy |
±1 pixel |
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Power Supply |
220V AC, 50Hz, 500W |
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Air Inlet |
0.5 Mpa, 150L/min |
Material prep: load adhesive into heated reservoir and enable low‑speed agitation to maintain uniform viscosity.
Recipe setup: load or program dispense path, volume, temperature and pump/valve settings.
Dispense cycle: XYZ stage indexes part; dispenser applies dots or beads per recipe; optional vision alignment corrects placement.
Verification & logging: AOI or manual check; process parameters and batch logs saved for traceability.
Adhesive type: for filled, thixotropic adhesives use piston pump + heated reservoir; for low‑viscosity fluids peristaltic or pressure/time may suffice.
Precision needs: require min dot ≥0.01 μL → choose high‑resolution piston or micro‑dispense valve.
Throughput: for frequent small batches prioritize easy recipe recall and quick nozzle change; for longer pilot runs choose larger reservoir & agitation.
Integration: enable MES interface when you need recipe push or production logging.
Cleanability: choose removable reservoir and quick‑release nozzle options for frequent material changeovers.
Installation: bench or small cell mount; connect power, compressed air (if used) and network; observe ESD and grounding for battery cell handling.
Commissioning: run a material × nozzle × temperature matrix to create validated recipes; record AOI/electrical acceptance criteria.
Maintenance: clean nozzles after each lot; perform reservoir purge and filter changes per adhesive vendor guidance; check pump seals monthly.
Q: Which adhesive types are supported?
A: Supports common battery adhesives and underfills (epoxy, silicone, thermally conductive adhesives). Confirm viscosity and run sample validation for filled systems.
Q: How small a dot can the machine deposit?
A: Typical minimum volume is ≥0.01 μL with high‑resolution piston or micro valve setups; confirm with material and nozzle selection.
Q: Can the system integrate with MES?
A: Yes—optional Ethernet/MES and RS‑485/Modbus interfaces are available; confirm protocol during procurement.