The global semiconductor community will once again gather in Taipei as SEMICON Taiwan 2025 takes place from September 10–12 at the Nangang Exhibition Center. With the theme “Leading with Collaboration. Innovating with the World.”, the event will bring together more than 1,200 companies, 4,100 booths, and over 100,000 professionals, creating the largest platform in the show’s history to explore next-generation semiconductor innovations.
As one of the industry’s leading providers of advanced dispensing and packaging solutions, Mingseal Technology is proud to announce its participation at Booth P5719, where it will showcase a full portfolio of solutions covering advanced packaging, panel-level processes, and high-precision material processing. We warmly invite our global customers and partners to visit our booth and exchange insights on the future of semiconductor manufacturing.
Focus on Advanced Packaging and Thermal Management
At this year’s SEMICON Taiwan, Mingseal will present a comprehensive lineup of equipment and process solutions designed for panel-level packaging (PLP), wafer-level packaging (WLP), and system-in-package (SiP) applications. Core demonstrations will highlight advanced underfill, dam & fill, flux jetting, micro solder paste dispensing, and heatsink assembly processes.
Key solutions on display include:
SS300 – Panel-Level Dispensing System
Designed for RDL-First FoPLP underfill applications, the SS300 integrates automatic panel loading/unloading with high-precision dispensing. Features include:
- Full-panel transport, alignment, preheating, dispensing, and AOI inspection
- Anti-warpage control for large panels
- Compatibility with PGV/AGV/OHT automation and international semiconductor communication protocols
- Supports fully automated and unmanned smart manufacturing environments
SS101 – Wafer-Level Dispensing System
Targeting RDL-First FoWLP processes, the SS101 delivers stability and accuracy for CoWoS, FoPoP, and other advanced packaging technologies. Capabilities include:
- Automated wafer loading/unloading, alignment, and dispensing
- Integrated preheating and thermal management
- Support for AMHS robotic handling and factory-wide automation standards
SS400 – Heatsink Assembly Solution
With TIM1/TIM2 thermal interface applications becoming essential for high-power devices, the SS400 provides:
- Precision attachment of thermal materials such as silicone grease, indium foil, graphene, and diamond composites
- Integrated flux spraying and dam & fill functions for passive components
- Support for large-size FCBGA chips and Q-panel operations, covering a wide range of thermal management requirements
New Highlight: MLS300 Ultra-Precision Water-Guided Laser System
Making its debut at SEMICON Taiwan 2025, the MLS300 water-guided laser system represents a breakthrough in ultra-precision material processing. Developed in-house by Mingseal, it delivers cutting, drilling, and coring performance with ±10 μm accuracy across challenging materials including:
- Ceramic substrates
- Liquid metals
- Wafers
- Diamond heat spreaders
- Wide bandgap semiconductors such as SiC and GaN
This technology addresses the rising demand for precision machining in advanced semiconductor materials.
Precision Fluid Control Solutions
Mingseal will also display its latest range of precision fluid control technologies, including:
These solutions expand the process capabilities for underfill, sealing, coating, and material deposition across semiconductor, optical, and electronic packaging industries.
Visit Mingseal at SEMICON Taiwan 2025
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