Wafer-level packaging (WLP) is at the forefront of advanced semiconductor assembly, especially as technologies like 2.5D Chip-on-Wafer-on-Substrate (CoWoS) push integration density to new limits. One of the most critical challenges in these processes is adhesive dispensing consistency. Even slight variations in underfill or encapsulation volume can cause voids, bridging, or mechanical stress that compromise device reliability.

To address this, manufacturers are increasingly adopting dispensing systems with real-time weighing calibration modules. By monitoring and adjusting glue output dynamically, these systems ensure adhesive volume remains uniform across wafers with fine-pitch interconnects and small bump structures.

Why Adhesive Consistency Matters in WLP

In wafer-level assembly, dispensing precision directly impacts yield and performance:

• Underfill uniformity prevents stress fractures between dies and substrates.
• Stable glue volumes reduce risk of air bubbles and voids in narrow-pitch areas.
• Consistent flow paths improve reliability in multi-layer stacked chip structures.

Without proper control, inconsistencies can result in rework, scrap, and costly production delays.

The Role of Weighing Calibration

The SS101 wafer-level dispensing system integrates a weighing calibration module that actively monitors glue weight during operation. Unlike traditional systems that rely solely on path control or valve timing, weighing calibration provides direct feedback on the actual dispensed volume.

Key benefits include:

• ±3% Volume Accuracy – Reduces glue variation to ensure consistent fill.
• Real-Time Feedback Loop – Automatically corrects deviations during dispensing.
• Easy Traceability – Logged calibration data supports quality audits and process validation.

This approach ensures that each dot or line of adhesive meets the target specification, regardless of viscosity changes or thermal fluctuations.

Taiwan’s Growing Need for Precision

As Taiwan expands its role in high-performance computing and AI chip manufacturing, wafer-level packaging has become a critical focus area. Local production lines handling CoWoS and Fan-Out WLP face increasing pressure to balance throughput with reliability.

By implementing weighing calibration systems, packaging houses in Taiwan can:

• Improve yield rates by minimizing adhesive-related defects.
• Support advanced CPU, GPU, and ASIC packaging with tight process control.
• Maintain competitiveness in the global semiconductor supply chain.

This makes real-time calibration not just a technical upgrade but a strategic necessity.

Conclusion

For wafer-level packaging, adhesive consistency is more than a process detail—it is a foundation for device reliability. Weighing calibration technology, as seen in advanced systems like the SS101, ensures precise glue control and reduces process variability. For Taiwan’s semiconductor manufacturers, adopting such solutions provides a clear path to higher yields, fewer defects, and stronger global leadership in advanced packaging.