Customer scenario

A Malaysian electronics OEM producing AI glasses required a robust inline solution for SiP packaging of the main control module. Substrates measure up to 325 × 162 mm and integrate 40~60 chips per board. Individual die sizes are under 10 × 10 mm with solder bumps 150~200 μm tall, 250~350 μm pitch and only 90 μm gaps between components. Underfill at the pad bottom is especially challenging: the process demands micro-scale, repeatable control of adhesive volume and flow to ensure full wetting without overflow or voids.

Mingseal FS600S solution

Mingseal proposed the FS600S inline Dam & Fill system tuned for high-density SiP underfill in AI glasses control modules. Key process elements delivered on the customer’s constraints:

• Non-contact high-speed jetting: Piezo-driven dispensing at up to 1000 Hz with a minimum droplet size of 0.5 nL enables ultra-fine micro-dosing into tight 90 μm gaps without mechanical contact that might disturb fragile bumps or nearby components.
• Full-zone precision temperature control: Independent, closed-loop temperature control across the feed and dispense zones maintains adhesive rheology with ±3°C stability, ensuring consistent viscosity and predictable flow during long runs and across different adhesive chemistries.
• Vision plus intelligent closed-loop algorithms: Dual high-resolution cameras locate fiducials and component edges with micron-class accuracy. An intelligent control loop combines visual alignment with periodic inline microbalance sampling to auto-correct dispense mass and maintain target volume per cavity.
• Multi-pass segmented paths: For very narrow 90 μm gaps, the FS600S programs multi-pen segmented fill strokes that sequentially deposit and let capillary action draw adhesive under the die, ensuring complete wetting while avoiding over-apply at edges.
• Micron-level repeatability: System mechanics and motion control deliver 10 μm repeat positioning to reliably hit narrow gaps between bumps and maintain uniform bead geometry across densely populated substrates.

Production outcomes and value

• Robust solder-joint protection: Controlled underfill penetration around 150~200 μm bumps reduces mechanical stress on solder joints, improving drop and vibration resistance for wearable devices.
• Preserved touch sensitivity and thermal performance: Precise, minimal adhesive over-apply prevents sensor interference and maintains designed thermal pathways, keeping the AI glasses cool during continuous operation.
• Higher yield and reliability: Reduced voiding and consistent underfill coverage cut rework and thermal cycling failures, improving lot yield and long-term reliability necessary for consumer wearables.
• Traceability and integration: FS600S supports MES docking and stores dispense recipes, images and weight logs for production traceability and quality audits.

Conclusion 

For Malaysian AI glasses manufacturers facing extreme miniaturization and tight geometries, the FS600S provides a practical, high-throughput inline underfill solution. By combining sub-nanoliter jetting, precise thermal control, intelligent vision-based closed-loop correction and multi-pass fill strategies, the FS600S secures mechanical protection, thermal stability and reliable field performance—helping AI eyewear withstand drops, moisture and extended use. Contact Mingseal to validate the FS600S with your adhesive and SiP layout in a pilot run.