As the demand for advanced semiconductor packaging grows globally, particularly in Fan-Out Wafer-Level Packaging (FoWLP), there is a pressing need for precise, reliable, and cost-effective dispensing solutions. Our company is proud to introduce the SS101 Wafer-Level Dispensing System to the Malaysian market, marking the first domestically produced dispensing equipment applied in large-scale FoWLP bottom fill production in Penang.

Innovative Solution for FoWLP Manufacturing

The SS101 system is designed to meet the rigorous standards of modern wafer-level packaging processes, including Underfill, Coating, Flux Spray, and Dam&Fill applications. Supporting wafer sizes of 8 and 12 inches makes it versatile for various production lines, while its impressive anti-warping capability of ±3mm ensures consistent dispensing even on warped wafers, thus maintaining high quality standards.

Application Highlights

FoWLP Underfill: Ensures robust mechanical and electrical stability by precisely filling gaps between chips and substrates.
Coating: Uniform layer application for protection or functionalization of wafer surfaces.
Flux Spray: Accurate flux application is critical to soldering and bonding quality.
Dam & Fill: Creating dam structures and cavity filling to prevent leakage and improve device reliability.

Performance and Advantages

Precision and Consistency: Capable of micro-level dispensing with high repeatability, ensuring stable process control.
Compatibility: Supports wafers up to 12 inches, adaptable to various manufacturing setups.
Warp Resistance: Maintains ±3mm anti-warping tolerance, accommodating wafer deformations without compromising accuracy.
Domestic Innovation: As the first locally developed dispensing system used in large-scale FoWLP bottom fill production, the SS101 showcases technological self-reliance and innovation in Malaysia’s semiconductor sector.

Market Impact and Benefits

Implementing the SS101 has enabled Malaysian manufacturers in Penang to realize significant improvements in process stability, product quality, and production efficiency. It also reduces dependency on imported equipment, fostering local technological advancement and supporting Malaysia's pursuit of a self-sufficient semiconductor manufacturing ecosystem.

Conclusion

The successful deployment of the SS101 Wafer-Level Dispensing System in Malaysia’s FoWLP manufacturing exemplifies the potential of domestic innovation to meet and exceed industry standards. Its precise, reliable, and scalable design is set to propel Malaysia’s semiconductor packaging industry forward, paving the way for future technological breakthroughs and sustained industry growth.