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Four Precision Dispensing Systems Enable ±3% Glue Accuracy in Taiwan’s Advanced Packaging Lines

2025-10-25

As Taiwan continues to lead the global semiconductor industry, advanced packaging processes such as 2.5D, 3D IC, and fan-out wafer-level packaging (FOWLP) increasingly require ultra-precise glue control to ensure yield stability. To meet these demands, a semiconductor packaging manufacturer in Hsinchu introduced four sets of our high-precision visual dispensing systems for its underfill and chip underfill (CUF) production lines.

Each of our dispensing units is equipped with closed-loop feedback, real-time temperature compensation, and AI-based flow algorithms. This configuration ensures ±3% glue volume accuracy, significantly reducing void defects and improving the consistency of underfill flow and curing.

After three months of operation, the customer reported an 8.3% yield improvement and a 10% reduction in adhesive material usage. The stability and repeatability of our precision control system — monitoring pressure, needle movement, and viscosity in real time — have become a key factor in their packaging line optimization.

This successful deployment demonstrates how our precision dispensing technology empowers Taiwan’s advanced packaging fabs to achieve higher efficiency, consistency, and global competitiveness.

Desktop Glue Dispensing Machine

Adhesive Dispensing Machine

Solder Paste Dispenser Machine

Dispensing Controller

Jetting Valve

Auger Valve

Hot Melt Dispenser Machine

Electronic Dispensing Machine

Advanced Packaging Equipment

Robot Dispensing Machine

Micro Spot Welder

Dispensing Machine Spare Parts

Desktop Glue Dispensing Machine

Adhesive Dispensing Machine

Solder Paste Dispenser Machine

Dispensing Controller

Jetting Valve

Auger Valve

Hot Melt Dispenser Machine

Electronic Dispensing Machine

Advanced Packaging Equipment

Robot Dispensing Machine

Micro Spot Welder

Dispensing Machine Spare Parts

Solutions Details

Four Precision Dispensing Systems Enable ±3% Glue Accuracy in Taiwan’s Advanced Packaging Lines

Four Precision Dispensing Systems Enable ±3% Glue Accuracy in Taiwan’s Advanced Packaging Lines

Each of our dispensing units is equipped with closed-loop feedback, real-time temperature compensation, and AI-based flow algorithms. This configuration ensures ±3% glue volume accuracy, significantly reducing void defects and improving the consistency of underfill flow and curing.

This successful deployment demonstrates how our precision dispensing technology empowers Taiwan’s advanced packaging fabs to achieve higher efficiency, consistency, and global competitiveness.

Desktop Glue Dispensing Machine

Adhesive Dispensing Machine

Solder Paste Dispenser Machine​

Dispensing Controller

Jetting Valve​

Auger Valve

Hot Melt Dispenser Machine

Electronic Dispensing Machine

Advanced Packaging Equipment

Robot Dispensing Machine

Micro Spot Welder

Dispensing Machine Spare Parts

Desktop Glue Dispensing Machine

Adhesive Dispensing Machine

Solder Paste Dispenser Machine​

Dispensing Controller

Jetting Valve​

Auger Valve

Hot Melt Dispenser Machine

Electronic Dispensing Machine

Advanced Packaging Equipment

Robot Dispensing Machine

Micro Spot Welder

Dispensing Machine Spare Parts

Solutions Details

Four Precision Dispensing Systems Enable ±3% Glue Accuracy in Taiwan’s Advanced Packaging Lines

Four Precision Dispensing Systems Enable ±3% Glue Accuracy in Taiwan’s Advanced Packaging Lines

Each of our dispensing units is equipped with closed-loop feedback, real-time temperature compensation, and AI-based flow algorithms. This configuration ensures ±3% glue volume accuracy, significantly reducing void defects and improving the consistency of underfill flow and curing.

This successful deployment demonstrates how our precision dispensing technology empowers Taiwan’s advanced packaging fabs to achieve higher efficiency, consistency, and global competitiveness.

Solder Paste Dispenser Machine

Jetting Valve

Solder Paste Dispenser Machine

Jetting Valve