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Latest company Solutions about Case Study — VCM Assembly Spot Welding Machine Applied in Korea
2025-10-23

Case Study — VCM Assembly Spot Welding Machine Applied in Korea

In South Korea’s competitive camera module (VCM) manufacturing sector, precision and consistency are critical to maintaining product quality. A Korean optical components manufacturer recently adopted our Vibration Motors Desktop Spot Welding System for the enameled wire welding process in VCM (Voice ...
Latest company Solutions about High Efficiency Dual Valve Inline Dispensing Boosts Vietnam Notebook FPC Production
2025-10-20

High Efficiency Dual Valve Inline Dispensing Boosts Vietnam Notebook FPC Production

Vietnam has rapidly become a global center for notebook and mobile electronics manufacturing. As device designs continue to shrink, manufacturers rely on flexible printed circuits (FPCs) to support thinner structures and denser signal transmission. These FPC components require chip coating ...
Latest company Solutions about Korean Camera Manufacturers Benefit from Dual Station Inline Visual Dispensing for Dust Catching Glue
2025-10-16

Korean Camera Manufacturers Benefit from Dual Station Inline Visual Dispensing for Dust Catching Glue

South Korea continues to lead the global smartphone camera supply chain, focusing on higher-resolution sensors and enhanced optical performance. However, as components become thinner and more sensitive, manufacturers face increasing challenges in contamination control during assembly. In particular, ...
Latest company Solutions about Case Study: How a Fully Automatic Mounting & Dispensing Machine Improved Inductor Assembly Efficiency in Vietnam
2025-10-14

Case Study: How a Fully Automatic Mounting & Dispensing Machine Improved Inductor Assembly Efficiency in Vietnam

Vietnam’s consumer electronics industry has been expanding rapidly, driven by strong exports and growing local production capacity. However, many factories are still facing challenges in precision assembly — especially when bonding micro-components such as inductor modules, speaker diaphragms, and ...
Latest company Solutions about Four Precision Dispensing Systems Enable ±3% Glue Accuracy in Taiwan’s Advanced Packaging Lines
2025-10-25

Four Precision Dispensing Systems Enable ±3% Glue Accuracy in Taiwan’s Advanced Packaging Lines

As Taiwan continues to lead the global semiconductor industry, advanced packaging processes such as 2.5D, 3D IC, and fan-out wafer-level packaging (FOWLP) increasingly require ultra-precise glue control to ensure yield stability. To meet these demands, a semiconductor packaging manufacturer in ...
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