A Taiwanese advanced packaging company pursuing local supply-chain resilience needed a reliable panel-level dispensing solution for RDL-first FOPLP (Fan‑Out Panel Level Packaging) manufacturing. Their process mix included Underfill, coating and flux spray across panel formats up to 510 × 515 mm and 600 × 600 mm. Critical challenges were precise, repeatable underfill deposition across large panels, prevention of panel warp during thermal cycles, integration with automated material handling (PGV/AGV/OHT) and full-process traceability for high-yield production.
Mingseal delivered the SS300 as Taiwan’s first home‑grown panel-level dispensing system purpose-built for FOPLP. Engineered to meet demanding thermal, mechanical and process-control requirements of panel-level underfill and related steps, the SS300 combined production-grade throughput with industry standard automation interfaces.
Key system capabilities implemented
Panel compatibility and flexible handling: The SS300 supports both 510 × 515 mm and 600 × 600 mm formats, enabling the customer to run multiple product families without changeover. Automatic panel loading and unloading interfaces (PGV/AGV/OHT compatible) were configured to fit the customer’s factory OHT flow for unattended operation.
Four-valve independent dispensing: Four independently controlled dispensing valves allowed concurrent multi-zone processing on a single panel or simultaneous work on several smaller panel arrays. This increased throughput and provided process flexibility for mixed recipes (underfill, coating, flux spray) in the same line.
Precision underfill and coating: High-stability motion control and fine dispense metering ensured uniform bead geometry and predictable capillary flow for RDL-first underfill. Recipes for underfill, coating and flux spray were stored and recalled via the system’s recipe management to guarantee process repeatability and traceability.
Robust anti-warping mechanical design: A unique mechanical anti-warping system maintains panel planarity within ±10 mm during loading, preheating, operation heating and dispensing. Combined with closed-loop temperature control, this prevents nozzle crashes and mis-deposition caused by thermal bowing common to large, thin panels.
Full-process thermal management: The SS300 provides finely controlled preheat and operation heating zones. Automatic temperature correction across the process minimizes viscosity drift and improves underfill flow control—critical for complete void-free wetting in FOPLP architectures.
In-line video monitoring and AOI: Whole-process video monitoring records panel turnover, dispense head motion and dispense quality. Glue-shape AOI inspects bead width and continuity, enabling immediate corrective actions and simplified problem tracing for yield optimization.
Improved yield and reliability: Accurate underfill deposition and anti-warping control reduced voiding and nozzle crashes, increasing first-pass yield in FOPLP runs and lowering scrap and rework rates.
Higher throughput with flexible recipes: The four-valve architecture and automatic handling interfaces supported uninterrupted, high-mix production while maintaining consistent process parameters for underfill, coating and flux spray recipes.
Seamless factory integration and traceability: Standard semiconductor communication protocols and AGV/PGV/OHT interfaces allowed easy MES docking and enabled unattended operation with full trace logs for audits and quality control.
Localized support and faster ramp-up: As the first domestic system in Taiwan tailored to FOPLP, the SS300 offered faster validation, on-site tuning and supply-chain advantages compared with imported alternatives—accelerating production ramp and reducing lead times.
For Taiwanese manufacturers pursuing RDL-first FOPLP, the SS300 provides a production-ready, domestically produced panel-level dispensing platform. By combining large-panel compatibility, four-valve independent dispensing, robust anti-warping mechanics (±10 mm), precise thermal control and full-process AOI, the SS300 secures consistent underfill, coating and flux applications—supporting higher yield, reliable operation and streamlined factory integration. Contact Mingseal to schedule a site demo and process qualification for your FOPLP panel portfolio.
