Customer scenario

A Taiwanese advanced packaging company pursuing local supply-chain resilience needed a reliable panel-level dispensing solution for RDL-first FOPLP (Fan‑Out Panel Level Packaging) manufacturing. Their process mix included Underfill, coating and flux spray across panel formats up to 510 × 515 mm and 600 × 600 mm. Critical challenges were precise, repeatable underfill deposition across large panels, prevention of panel warp during thermal cycles, integration with automated material handling (PGV/AGV/OHT) and full-process traceability for high-yield production.

Mingseal SS300 solution — the first domestically produced FoPLP panel dispenser

Mingseal delivered the SS300 as Taiwan’s first home‑grown panel-level dispensing system purpose-built for FOPLP. Engineered to meet demanding thermal, mechanical and process-control requirements of panel-level underfill and related steps, the SS300 combined production-grade throughput with industry standard automation interfaces.

Key system capabilities implemented

• Panel compatibility and flexible handling: The SS300 supports both 510 × 515 mm and 600 × 600 mm formats, enabling the customer to run multiple product families without changeover. Automatic panel loading and unloading interfaces (PGV/AGV/OHT compatible) were configured to fit the customer’s factory OHT flow for unattended operation.

• Four-valve independent dispensing: Four independently controlled dispensing valves allowed concurrent multi-zone processing on a single panel or simultaneous work on several smaller panel arrays. This increased throughput and provided process flexibility for mixed recipes (underfill, coating, flux spray) in the same line.

• Precision underfill and coating: High-stability motion control and fine dispense metering ensured uniform bead geometry and predictable capillary flow for RDL-first underfill. Recipes for underfill, coating and flux spray were stored and recalled via the system’s recipe management to guarantee process repeatability and traceability.

• Robust anti-warping mechanical design: A unique mechanical anti-warping system maintains panel planarity within ±10 mm during loading, preheating, operation heating and dispensing. Combined with closed-loop temperature control, this prevents nozzle crashes and mis-deposition caused by thermal bowing common to large, thin panels.

• Full-process thermal management: The SS300 provides finely controlled preheat and operation heating zones. Automatic temperature correction across the process minimizes viscosity drift and improves underfill flow control—critical for complete void-free wetting in FOPLP architectures.

• In-line video monitoring and AOI: Whole-process video monitoring records panel turnover, dispense head motion and dispense quality. Glue-shape AOI inspects bead width and continuity, enabling immediate corrective actions and simplified problem tracing for yield optimization.

Production outcomes and value for the Taiwanese line

• Improved yield and reliability: Accurate underfill deposition and anti-warping control reduced voiding and nozzle crashes, increasing first-pass yield in FOPLP runs and lowering scrap and rework rates.

• Higher throughput with flexible recipes: The four-valve architecture and automatic handling interfaces supported uninterrupted, high-mix production while maintaining consistent process parameters for underfill, coating and flux spray recipes.

• Seamless factory integration and traceability: Standard semiconductor communication protocols and AGV/PGV/OHT interfaces allowed easy MES docking and enabled unattended operation with full trace logs for audits and quality control.

• Localized support and faster ramp-up: As the first domestic system in Taiwan tailored to FOPLP, the SS300 offered faster validation, on-site tuning and supply-chain advantages compared with imported alternatives—accelerating production ramp and reducing lead times.

Conclusion

For Taiwanese manufacturers pursuing RDL-first FOPLP, the SS300 provides a production-ready, domestically produced panel-level dispensing platform. By combining large-panel compatibility, four-valve independent dispensing, robust anti-warping mechanics (±10 mm), precise thermal control and full-process AOI, the SS300 secures consistent underfill, coating and flux applications—supporting higher yield, reliable operation and streamlined factory integration. Contact Mingseal to schedule a site demo and process qualification for your FOPLP panel portfolio.