Good price  online

products details

Created with Pixso. Home Created with Pixso. Products Created with Pixso.
Advanced Packaging Equipment
Created with Pixso. Warped Chip Advanced Packaging Equipment Flux Jetting Dispenser For Flux Support

Warped Chip Advanced Packaging Equipment Flux Jetting Dispenser For Flux Support

Brand Name: Mingseal
Model Number: GS600SS
MOQ: 1
Price: $28000-$150000 / pcs
Delivery Time: 5-60 Days
Payment Terms: L/C,D/A,D/P,T/T,Western Union
Detail Information
Place of Origin:
China
Certification:
ISO CE
Max. Boat-length Supported:
6mm
Max. Dispensing Range:
325mm
Dimensions:
1401*1200*2112mm
Max. Carrier Plate Thickness:
3KG
Packaging Details:
Wooden Case
Highlight:

Warped Chip Advanced Packaging Equipment

,

Flux Support Advanced Packaging Equipment

,

2112mm Flux Jetting Dispenser

Product Description

Advanced Flux Jetting Dispenser for Warped Chip Flux Support

 

The GS600 series is a next-generation inline flux jetting system designed to solve one of the most demanding challenges in semiconductor assembly: flux application on highly warped chips mounted on substrates. 

When working with chips prone to significant warpage, maintaining consistent flux coverage is critical to avoid bonding failures and achieve defect-free soldering. The GS600 series meets this need with a combination of high-speed jetting, exceptional positional accuracy, and advanced process monitoring.

Whether used as a standalone station or integrated inline with SMT, DB, or advanced packaging lines, the GS600SS provides the performance and stability manufacturers need for warped chip soldering and underfill processes.

 


Core Advantages

 

  • Reliable flux jetting for warped chips: Maintains uniform application even on substrates with significant warpage.

  • No splatter, precise targeting: Jetting valve technology ensures clean flux lines and prevents contamination.

  • Inline glue weight monitoring: Automated weight checks with alarms safeguard quality and consistency.

  • Self-cleaning jetting head: Reduces downtime and maintains spray performance during extended operations.

  • Flexible integration: Compatible with various SMT and semiconductor packaging workflows.

 


Typical Applications


Flux jetting for highly warped chip solder support
Pre-soldering flux coating on uneven substrates
Supplemental flux application before chip bonding
Advanced semiconductor assembly where high-precision flux distribution is critical

 

 

Technical Specifications

 
Cleanliness Level Cleanliness of working area Class 100
Motion System Max. Dispensing Range (X*Y) 325*160mm
Repeatability (3sigma) X/Y ≤ ±3 μ m Z ≤ ±5 μm
Positioning Accuracy (3sigma) X/Y ≤ ±10 μ m Z ≤ ±15 μm
Max. Speed X/Y:1000mm/s Z: 500mm/s
Max. Acceleration X/Y:1g, Z:0.5g
Track System Track Form Single-track conveying, 3-segment lifting, mid-section operational-lifting mode
Track Parallelism <0.1mm (max-min width variation)
Height Adjustment Range 890-960mm
Width Adjustment Range 60-160mm
Max. Convey Speed 300mm/s
Max. Carrier Load 3kg
Lifting Method Track-lifting (fixture remains stationary)
Track Suction Capacity Cover ±2mm warping of substrates
Heated Bottom-plate Contact-type Heating (Room temperature -150℃), with Vacuum Suction
Max. Vacuum Suction Pressure -70KPa - -40KPa
General Condition Dimension (W*D*H) 1401*1200*2112mm
Environmental Temperature 23±5℃
Environmental Humidity 30-70%

 

 

Q&A

 

Q1: What makes the GS600 series better for indium sheet flux spraying?
A: Its atomization system ensures flux is applied evenly with a fine 5μm layer, eliminating splatter and maintaining surface cleanliness.

 

Q2: Can it handle continuous high-volume runs?
A: Yes! The automatic glue weight verification and nozzle self-cleaning ensure long, stable production without manual intervention.

 

Q3: Is it easy to integrate with other equipment?
A: Absolutely — the GS600SS supports SMEMA interfaces and works seamlessly with SMT, DB, and other semiconductor packaging lines.

 

Q4: What type of spray valve is recommended?
A: The system can be configured with high-precision spray valves like the KAS1000, designed for tight control and minimal overspray in critical flux applications.

 


About Mingseal


Mingseal is a trusted name in high-end dispensing solutions for semiconductor, MEMS, optical module, and advanced packaging industries. With years of specialized R&D and deep process experience, we help manufacturers worldwide achieve higher yields, tighter process control, and greater line efficiency with precision dispensing and spraying technologies.
Looking for a smarter way to handle your indium sheet flux spraying? Partner with Mingseal to secure your next-generation production edge.