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| Brand Name: | Mingseal |
| Model Number: | VS300D |
| MOQ: | 1 |
| Price: | $6000-$50000 / pcs |
| Delivery Time: | 5-60 Days |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union |
This desktop glue dispensing machine can be used for R&D, pilot production and small‑batch semiconductor underfill tasks. It integrates a precise dispensing pump, heated reservoir with agitator (optional), XYZ motion stage, recipe storage and optional vision alignment. The system supports fine dot and bead dispensing, multi‑pattern recipes, and MES/PLC connectivity for data traceability.
Problem: Inconsistent underfill volume or placement causes voids, poor adhesion and unreliable drop reliability in flip‑chip and package assemblies.
Cause: Manual dispensing, unstable material viscosity, and lack of recipe control introduce variability in bead shape and volume.
Solution: Use an automated desktop dispenser with temperature control, agitation, precise metering pump and recipe management to stabilize viscosity, control deposit volume and repeatably place underfill with minimal voids. Validate each recipe with pilot runs and AOI/decapsulation checks.
| Motion System | 4-axis (X/Y/Z + Rotation) |
| Transmission | Servo motor & screw module |
| Repeatability | X/Y: ±0.015mm |
| Positioning Accuracy | X/Y: ±0.025mm |
| Max Speed | X/Y: 500mm/s, Z: 300mm/s |
| Max Acceleration | X/Y: 0.5g, Z: 0.3g |
| Max Fixture Load | 10 kg |
| Visual Positioning | Mark / product feature recognition |
| Identify Accuracy | ±1 pixel |
| Power Supply | 220V AC, 50Hz, 500W |
| Air Inlet | 0.5 Mpa, 150L/min |
Material prep: load underfill into heated reservoir and start low‑speed agitation to stabilize viscosity.
Recipe selection: load or create dispense pattern (dot/bead paths, speed, volume, temperature).
Dispense cycle: motion stage indexes part, dispenser deposits underfill per recipe.
Verification & logging: optional vision/AOI inspects bead shape; process data and batch logs saved for traceability.
Throughput vs. precision: choose peristaltic/piston pump for low‑shear precision; pressure/time better for higher throughput.
Material handling: if underfill is highly filled or thixotropic, use heated reservoir + agitator and select pump compatible with fillers.
Alignment needs: add vision alignment when placement tolerance <0.05 mm.
Traceability: enable MES/Ethernet when batch logging and recipe push from factory systems are required.
Scale‑up: confirm dispense head and motion stroke meet future panel/wafer sizes for transfer to production equipment.
Installation: bench or small cell mounting; connect power, compressed air (if used) and network. Implement ESD precautions for semiconductor handling.
Commissioning: run sample matrix of material × temperature × nozzle to establish production recipes. Record AOI/decap metrics for acceptance.
Maintenance: clean dispense tips/nozzles after each lot; run reservoir purge and filter change per material vendor recommendations.
Q: Which underfill materials are supported?
A: Supports common epoxy underfills and filled formulations; confirm viscosity/temperature curve and run a sample validation for filled systems.
Q: Can the system integrate with my MES?
A: Yes—optional Ethernet/MES interfaces and RS‑485/Modbus are available; confirm protocol during procurement.
Q: How small a dot can the machine dispense?
A: Minimum volume typically ≥0.01 μL depending on nozzle and material—gravimetric calibration recommended per recipe.
Conclusion
Whether you are a semiconductor lab, a prototype packaging house, or a precision electronics maker looking for stable, flexible, and accurate underfill dispensing, the VS300 Series Desktop Visual Dispensing Machine delivers the advanced features you need—without the footprint or cost of large inline systems.
