One‑line summary

Meet Mingseal at SEMICON SEA 2026 (May 5–7, MITEC, Kuala Lumpur) to explore precision dispensing, high‑accuracy mounting, and ultra‑fine laser processing solutions that improve yield, reduce rework, and accelerate package qualification.

Product & Solutions Overview

Mingseal brings integrated equipment for advanced packaging: precision dispensing platforms, automated mounting systems, and an ultra‑precision laser line for hard‑brittle materials. Our portfolio addresses bottom‑fill, thermal interface mounting, and high‑precision machining needs for next‑generation semiconductor packaging.

Key Technologies on Display

Precision Dispensing

• SS300 Panel‑level Dispensing System: Built for RDL‑first FOPLP bottom‑fill. Integrates automatic loading, preheat, anti‑warp, dispensing and AOI. Supports PGV/AGV/OHT for unattended lines.
• SS101 Wafer‑level Dispensing System: Provides wafer automation, heating, dispense, and thermal management for CoWoS and FoWLP processes. AMHS compatible for 8/12‑inch scaling.
• GS600SUA Underfill Dispensing Machine: ±0.02 mm accuracy; mineral frame for high‑speed stability; dual rails and three‑stage heating with PDI and AOI; MES‑ready for mass production.

Precision Mounting

• SS400 Heat‑sink Mounting System: Supports TIM1/TIM2 materials (thermal grease, indium, graphite, diamond pads). Designed for large FCBGA and Q‑Panel assemblies.
• SS200 Lid Attach System: One‑stop automated lid attach with adhesive dispensing, lid placement, pre‑pressure cure and multi‑stage inspection. Modular, fault‑proof features for flexible line integration.

Ultra‑Precision Laser (MLS300)

• MLS300: Micromachining for ceramics, SiC and diamond—slotting, drilling and cutting with ±10 μm accuracy, heat‑affected zone ≤5 μm and minimum kerf 30 μm. Enables burr‑free, high‑quality processing for power and advanced packaging substrates.

Applications & Benefits

• Bottom fill for FCBGA, FCCSP and SiP: higher yield and reduced voids.
• TIM and lid attach for power/AI chips: improved thermal path and reliability.
• Machining for ceramics and SiC substrates: enables new materials in advanced packages.
• Benefits: higher throughput, consistent part quality, lower defect rates, and smooth MES integration.

Event Details

Date: May 5–7, 2026
Venue: Malaysia International Trade and Exhibition Centre (MITEC), Kuala Lumpur
Booth: 2216, Hall 8