MEMS Microphone Automatic Glue Dispensing Machine Glue Dispensing Systems 220V

MEMS Microphone Manufacturing Inline High-Precision Dispensing Solution

For today’s cutting-edge MEMS sensors and ASIC chip manufacturing, ultra-precise fluid dispensing is critical to ensure performance and long-term device reliability. The GS600M Series Inline Visual Dispensing Machine, developed by Mingseal, is purpose-built to meet these tight requirements in MEMS microphone and accelerometer manufacturing. 

The GS600M features a robust floor-standing, cabinet-style inline design that integrates high-accuracy workpiece positioning with advanced vision algorithms for mark and contour recognition. This ensures each glue line or solder dot is perfectly aligned every cycle. Supporting both single-valve precision dispensing for fine coating and double-valve operation for higher throughput tasks, this system can tackle complex workflows from cavity filling to micro-pitch solder dotting.

Key Advantages

• Unmatched Accuracy & Stability

  Achieve repeatable, high-precision dispensing down to ±10 μm with robust anti-vibration mineral casting that absorbs shocks from continuous high-speed motion.

• Flexible Single or Dual Valve Modules

  Switch easily between single-valve fine fluid control for thin coatings and dual-valve solder paste application for larger volumes and multiple dispensing tasks.

• Seamless Inline Integration

  A suspended or floor-standing loop loading & unloading system and double tracks option allow smooth product flow, meeting the high-throughput demands of modern MEMS lines.

• Smart Low-Level Alarms

  Real-time glue level monitoring reduces waste and guarantees uninterrupted production, boosting productivity and yield.

 
Typical Applications

✔ MEMS microphone / Barometer

Coating / Solder Paste Painting / Potting / Reinforced-Gluing
✔ MEMS Accelerometer
Coating / Solder Paste Painting / Potting / Reinforced-Gluing

Core Modules

Single-Valve Dispensing Module

Nib-contact dispensing to match precise dispensing of low-viscosity adhesive such as Coating and Fill

Double-Valve Solder Paste Printing / Dispensing Module

Synchronized control of double valves to achieve more efficient operation

Double valves can be fine-tuned according to the position of the material plate

Low-Level Alarm Module

Avoiding poor operation caused by lack of glue

Visual System

Positioning and detection functions

Inspection before operation to avoid detective incoming materials

Inspection after operation to prevent batch defects

Lateral-Pushing Module

Lateral angle correction of materials to ensure accurate positioning of materials

Pinch Roller Mechanism

Avoiding poor operation caused by warping of thin substrates during conveying

FAQ

Q1: What makes GS600M different from standard dispensers for MEMS and ASIC chip?
A: It combines single and dual valve modules, visual inspection, and real-time level alarms in one inline platform, maximizing flexibility while reducing footprint and total cost.

Q2: Can it handle high-volume chip lines?
A: Yes — the conveyor design, dual tracks, and loop-type loading keep multiple GS600M units connected in sequence without risking a full stop due to a single station issue.

Q3: Is glue level control automatic?
A: Yes, the low-level alarm module tracks fluid status live and alerts operators, minimizing defects due to material runout.

Q4: Does it support smart factory requirements?
A: Fully. Its process data, visual checks, and laser measurement all meet modern MES traceability and quality assurance needs.

About Mingseal

Mingseal is an innovative high-end dispensing and automation technology company with over 15 years of experience delivering smart fluid control solutions. Our inline and desktop dispensing systems help leading manufacturers worldwide achieve tighter tolerances, higher yields, and lower production costs. From MEMS and semiconductor packaging to mobile electronics, we provide solutions you can trust for tomorrow’s challenges.

Contact Mingseal today to see how the GS600M Series can optimize your MEMS or ASIC assembly with reliable inline performance, top-class precision, and full smart factory readiness.