Taiwan’s electronics industry, from semiconductors to optics and consumer devices, is increasingly relying on adhesives containing particles or high-viscosity materials, such as solder paste, thermal grease, and silica gel. Conventional pneumatic or jetting methods often face clogging, inconsistent flow, or stringing, leading manufacturers to seek more reliable solutions.
The KSV 1000 series is designed for precise dispensing of particle-filled adhesives, featuring interchangeable screws for different flow needs, quick-release cleaning, and closed-loop servo control with 98% repeatability. A negative pressure system ensures smooth flow down to 2000 cps viscosity, while forward/reverse screw rotation eliminates stringing.
For higher throughput, the KSV3000 series supports greater flow rates and uses wear-resistant materials to extend maintenance cycles, making it suitable for thermal and high-viscosity applications.
Taiwanese manufacturers prefer screw valves for several reasons:
Many of Taiwan’s design institutes, universities, and research centers are developing modular dispensing systems. These platforms combine:
Piezo jet valves for fine jetting,
Micro screw valves for particle-filled adhesives,
Pneumatic controllers for flow stabilization.
This modular approach gives manufacturers flexibility to handle both micro-scale semiconductor packaging and large-area coating processes with one integrated platform.
By adopting screw valves such as the KSV1000 and KSV3000, Taiwan’s electronics industry ensures precision, reliability, and adaptability in dispensing particle-filled adhesives. As modular dispensing platforms expand and new spray technologies enter the market, manufacturers and research partners are building a robust foundation for next-generation production in semiconductors, consumer electronics, and beyond.