In the fast-paced world of semiconductor manufacturing, precision adhesive processes are critical for long-term device reliability. One recurring challenge in advanced packaging is underfill overflow—a problem often seen when the gap height between the chip and substrate is higher than expected. As the underfill flows, excessive adhesive can spill beyond the intended area, leading to yield loss, contamination, and extra cleaning costs.

For manufacturers in Korea and Singapore, where semiconductor and advanced packaging industries are rapidly expanding, this issue is both costly and urgent. The solution requires not only accuracy in dispensing but also intelligent process control to adapt to variable gap heights.

 
The Challenge: Underfill in High-Gap Packages

Underfill is essential in flip-chip and advanced packaging to strengthen bonding and improve thermal cycling reliability. However, when the gap between the die and substrate is larger, conventional dispensing systems often struggle with precise flow control.

Typical issues include:

• Overflow at chip edges
• Voids or bubbles trapped due to inconsistent flow
• Longer curing times from uneven adhesive volume
• Higher defect rates and costly rework

These risks highlight the need for a system that combines high-speed jet dispensing with adaptive control, especially for high-gap underfill.

 
The GS600SUA: Controlling the Flow

The Mingseal GS600SUA Jet Dispensing System is engineered to address exactly these scenarios. Unlike contact systems, the GS600SUA uses non-contact jetting technology to deliver tiny, repeatable droplets at high frequency. This ensures precise volume control, even when gap heights are significantly larger.

 
Why It Matters for Korea and Singapore

Both regions play pivotal roles in global semiconductor manufacturing. As packaging advances into flip-chip, fan-out wafer-level packaging (FOWLP), and 2.5D/3D IC integration, reliable underfill dispensing becomes critical. Solutions like the GS600SUA give manufacturers a competitive edge by combining speed, precision, and adaptability.

 
Conclusion

Underfill overflow is more than a cosmetic issue—it directly impacts semiconductor yield, cost, and reliability. The Mingseal GS600SUA Jet Dispensing System provides a proven answer, delivering precise, high-speed, non-contact dispensing that adapts to high-gap structures without sacrificing throughput.

For manufacturers in Korea, Singapore, and beyond, the GS600SUA is not just a tool, but a strategic investment in overcoming one of packaging’s toughest challenges.