As Malaysia’s automotive electronics manufacturing industry accelerates its transition toward automation, precision dispensing of thermal conductive materials for automotive sensors has become a critical process. Many factories that once relied on manual glue application now face challenges such as inconsistent glue volume, unstable bonding strength, and high labor costs.
To address these issues, a Malaysian automotive sensor manufacturer recently adopted the KSV3000 Auger Valve, an advanced, high-precision dispensing solution designed for heat-conductive glue applications. The system was integrated with a robotic arm, enabling smooth and automated operation throughout the production line.
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The KSV3000 series is an upgraded version engineered specifically for high-viscosity thermal interface materials (TIM) that contain particles or require controlled flow. Featuring a closed-loop servo motor and a high-speed tungsten steel screw, the system achieves precise volume control with repeatability up to 98% and a minimum output as low as 0.1μl.
For the Malaysian customer, this technology successfully met the need to transition from manual to automated dispensing, while ensuring accurate glue weight and consistency across every unit.
The KSV3000’s universal downflow channel interface also allows for fast switching between different glue types, giving manufacturers greater flexibility in multi-product production environments.
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After implementation, the Malaysian automotive parts factory reported:
The factory noted that the KSV3000 Auger Valve, combined with a robotic arm, provided consistent dispensing quality, meeting automotive standards for sensor thermal management and ensuring high reliability for end products.
With Malaysia’s automotive supply chain upgrading toward Industry 4.0, precision dispensing systems like the KSV3000 are empowering local manufacturers to achieve higher yield, lower cost, and stable production quality. As automation adoption grows, intelligent dispensing technology will continue to play a vital role in thermal management, bonding, and encapsulation processes across Malaysia’s advanced manufacturing industries.