2.8KW Advanced Packaging Equipment Visual Dispensing Machine For Dam Fill SiP Packaging

Inline Visual Dispensing Machine for Dam & Fill and SiP Packaging

The FS600 Series Inline Visual Dispensing Machine is an intelligent, cost-efficient solution developed specifically for Dam & Fill processes and SiP (System in Package) semiconductor packaging. With an optimized price-performance ratio, this inline dispensing system delivers the high precision and stability that advanced microelectronics manufacturers demand—without the premium price tag of traditional cleanroom equipment.

Targeted at applications where dam structures (e.g., solder dam or epoxy dam) and fill encapsulation must be controlled to micro-level accuracy, the FS600 integrates dedicated process modules for inline inspection. During Dam creation, real-time cameras and sensors measure glue width and bead height to maintain perfectly formed barriers around sensitive dies and circuits. For Fill, the machine precisely controls filling volume to prevent voids and ensure reliable protection for high-density chip packaging.

Core Advantages

• High ROI for Advanced Dam & Fill Lines: Perfect for factories seeking high-end results without overpaying.
• Real-Time Dam & Fill Monitoring: Inline measurement modules verify Dam width and height during barrier creation. 
• Smart Closed-Loop Vision System: Dual cameras detect fiducial marks and edge deviations automatically, with real-time path correction for complex SiP layouts.
• Adaptable for Multiple Glue Types: Handles various adhesives under consistent thermal and flow conditions.

Typical Applications

✔ Dam & Fill encapsulation for SiP packaging
✔ Solder dam lines for die and wire protection
✔ Fill processes for void-free encapsulation of stacked chips
✔ BGA/CSP edge sealing
✔ Corner glue or underfill for advanced PCBA modules
✔ Inline process control with glue width/thickness measurement
✔ Smart factory traceability with MES docking

Technical Specifications

FAQ

Q1: Why is inline Dam width/thickness monitoring important?
A: Precise dam structures prevent overflow and protect delicate chip areas. The FS600’s real-time measurement module ensures each bead stays within tolerance, reducing rework.

Q2: How does Fill volume monitoring help yield?
A: By verifying fill amount inline, voids are prevented, guaranteeing stronger encapsulation—crucial for SiP reliability and thermal cycling performance.

Q3: Is the FS600 only for cleanroom lines?
A: No. While suitable for semi-clean or standard SMT environments, its mineral-cast frame ensures vibration damping and dust control, so you get near cleanroom results at a fraction of the cost.

Q4: Can I integrate this with my MES?
A: Absolutely. The FS600 Series comes MES-ready with SMEMA standard interfaces, easy inline linking, and real-time data logging for full traceability.

About Mingseal

Mingseal specializes in high-precision inline and desktop dispensing solutions for semiconductors, SiP, MEMS, SMT, and next-gen electronics. With thousands of installations worldwide, we help factories push the limits of process control, yield, and smart automation—while always delivering solid ROI and robust local support.

Contact us today to see how the FS600 Series can upgrade your Dam & Fill production line for less.