Revolutionizing Thermal Management in Semiconductor Packaging

Mingseal is proud to introduce the SS400 Lid Attachment System, designed specifically for FCBGA (Flip Chip Ball Grid Array) ring attachment applications. This innovative system supports a variety of thermal dissipation materials, including thermal grease, indium sheets, flux-free indium sheets, graphene, diamond, and composite diamond materials. The SS400 is engineered to enhance heat management and reliability in semiconductor packaging.

Versatile Application Capabilities

The SS400 is equipped to handle various processes, making it a versatile solution for diverse manufacturing needs. With the capability to support high heat dissipation processes, it matches a wide range of dispensing valves, including piezoelectric valves, screw valves, flux spray valves, and two-component metering valves. This flexibility allows manufacturers to adapt the system to their specific process requirements effortlessly.

Efficient Dual-Track System

Featuring a dual-track configuration and an independent dual-station module, the SS400 maximizes production efficiency by achieving high units per hour (UPH). Its ability to accommodate a maximum boat size of 340×340mm allows for efficient dispensing and mounting of larger components or lids, making it an ideal choice for the demands of modern semiconductor manufacturing.

Advanced Capabilities for Large-Size Components

The SS400 excels in meeting the needs of large-sized chip applications, supporting dual-track boats and enabling the mounting of rings or lids up to 150×150mm. This system is specifically designed to facilitate FCBGA assembly, allowing for a streamlined approach to joint processes, including Q-Panel bonding and 3T thermal compression capabilities.

Moreover, the SS400 supports TCB (Thermal Compression Bonding) mounting head configurations, allowing users to bond flux-free indium sheets directly through rapid heating and cooling processes—eliminating the need for prolonged thermal compression cycles. This enhances operational efficiency and reduces interfacial thermal resistance.

Flexible Operation and Modular Design

The SS400's modular design allows users to adjust and sequence workstations based on process needs, increasing adaptability in various manufacturing environments. Additionally, its motor-lifting flexible operation is compatible with glass substrate processes, making it easier to handle different materials and configurations.

Conclusion

The SS400 Lid Attachment System by Mingseal is a game-changing solution for manufacturers focused on FCBGA ring attachment and thermal management. By investing in this innovative technology, companies can significantly improve efficiency, reduce thermal resistance, and ensure high-quality packaging for advanced semiconductor applications.