Introduction

Mingseal is proud to introduce the SS101 FoWLP Wafer-Level Packaging System, the first domestically engineered dispensing machine specifically designed for the mass production of Fan-Out Wafer-Level Packaging (FoWLP) underfill. This innovative system addresses critical challenges in the electronics manufacturing sector, paving the way for enhanced production efficiency, accuracy, and quality in the wafer-level packaging process.

Enhancing FoWLP Processes

The SS101 is tailored to support a wide range of application processes, including FoWLP underfill, coating, flux spray, and dam & fill. With compatibility for both 8-inch and 12-inch wafers, this cutting-edge system provides immense versatility to manufacturers in various industries, including SMT/PCBA electronics manufacturing, smartphone assembly, camera module sealing, and beyond.

Addressing Industry Pain Points

The electronics manufacturing sector has long faced numerous challenges, including unstable manual dispensing quality, inconsistent adhesive volumes, and high defect and rework rates. These problems lead to inefficient production lines and increased operational costs. The SS101 tackles these pain points effectively. With its advanced technology, the system ensures high accuracy in adhesive dispensing, reducing the dependency on skilled operators and minimizing variability between shifts and batches.

Additionally, the SS101 boasts an impressive anti-warping capability of ±3mm, which minimizes defects caused by panel distortions during the dispensing process. This characteristic is critical in maintaining the integrity of the wafers while ensuring optimal adhesive application.

Boosting Efficiency and Reducing Waste

One of the standout features of the SS101 is its ability to control micro-dots and fine lines, addressing common issues such as glue stringing, dripping, and air bubbles. This precision not only enhances product quality but also significantly reduces material waste and maintains a clean workstation, allowing for more efficient production.

Furthermore, the SS101 facilitates faster changeover times between products, helping manufacturers adapt to varying production requirements swiftly. With improved traceability and process parameter recording, manufacturers can ensure compliance with industry standards and streamline their operations.

Versatile Applications for Future Growth

The SS101's applicability spans several key sectors, including automotive electronics, medical device assembly, and industrial equipment sealing. As manufacturers continue to seek innovative solutions to enhance their assembly processes, the SS101 stands out as a pivotal asset for companies specializing in battery pack potting, LED lighting encapsulation, and optical component bonding.

Conclusion

Mingseal’s SS101 FoWLP Wafer-level Packaging System is a revolutionary tool designed to transform the underfill production landscape. By providing high precision, efficiency, and flexibility, the SS101 helps manufacturers overcome common challenges associated with traditional dispensing methods. As the first domestic dispensing machine tailored for FoWLP processes, Mingseal is committed to driving innovation and excellence in the electronics manufacturing industry, ensuring that manufacturers can meet the demands of an increasingly competitive market.