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| Brand Name: | Mingseal |
| Model Number: | VS300D |
| MOQ: | 1 |
| Price: | $6000-$50000 / pcs |
| Delivery Time: | 5-60 Days |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union |
This high precision hot melt glue dispensing machine is engineered for camera module bonding and optical component sealing in smartphone production. Core features include temperature‑stable heated reservoir with agitator, fast‑response dispensing valve, precision XYZ motion, optional 2D/3D vision alignment and MES connectivity for recipe control and traceability.
Problem: Camera module assembly suffers from glue stringing, inconsistent bead width and misplacement causing cosmetic defects and rework.
Cause: Fluctuating melt temperature, slow valve response, suboptimal nozzle geometry and lack of inline verification cause volume and position variance.
Solution: Use a closed‑loop hot‑melt dispenser with constant‑temperature reservoir, rapid valve actuation, optimized nozzle shapes and vision feedback to stabilize viscosity, precisely meter glue and correct placement in real time. Validate recipes in pilot runs and save to MES for repeatable production.
| Cleanliness of Working Area | Class 100 (Class 1000 workshop) |
| Max. Fixture Weight | 10kg (with Product ) |
| Transmission System | Servo motor & Screw module |
| Repeatability | X/Y: ±0.015mm |
| Positioning Accuracy | X/Y: ±0.025mm |
| Max. Speed | X/Y:500mm/s Z:300mm/s |
| Max. Acceleration | X/Y:0.5g Z:0.3g |
| Visual Positioning Method | Mark/Product appearance features |
| Identify Accuracy | ±1pixel |
| Dimensions W*D*H | 860×630×690mm |
| Weight | 75KG |
| Power Supply | 220V AC 50Hz |
| Power | 500W |
| Air Inlet | 0.5Mpa,150L/min |
Material prep: load hot‑melt adhesive into heated reservoir; start agitator to maintain uniform melt.
Recipe & alignment: load dispensed recipe from MES or operator; vision alignment locates fiducials.
Dispense action: valve issues rapid pulses while motion stage follows programmed path to deposit bead/dot.
Verification & logging: vision/AOI inspects bead width/placement; process data logged for traceability.
Throughput vs precision: choose larger reservoir and higher heating power for continuous high throughput; choose piezo valve + vision for micro‑dot / minimal stringing.
Glue compatibility: confirm melt adhesive type (EVA, hot‑melt polymers) and viscosity‑temperature curve; use agitator and heated lines for filled adhesives.
Nozzle selection: select taper or slit nozzles per bead geometry; test on pilot to confirm bead profile.
Integration: confirm MES/PLC protocol and line I/O (SECS‑GEM/SMEMA if required).
Maintenance needs: evaluate nozzle changeover speed and clean‑out procedures for multi‑job lines.
Installation: secure machine on stable floor or cell, connect power, compressed air (if pneumatic assist), and grounding. Provide environmental control for consistent room temperature.
Commissioning: run glue temperature characterization and dispense matrix (nozzle × speed × pulse) to establish production recipes.
Routine maintenance: clean nozzles daily for high‑use lines, inspect heater and agitator monthly, replace valve cartridges per runtime. Keep spare nozzles and valve cartridges.
Safety: observe hot‑surface and high‑temperature handling procedures; provide safety interlocks for moving axes.
Q: Which hot melt adhesives are supported?
A: Compatible with common hot melt adhesives (EVA and similar); confirm viscosity‑temperature profile and run pilot tests for filled adhesives.
Q: How do you reduce glue stringing?
A: Combine piezoelectric valve, tuned pulse width, correct nozzle‑to‑part distance and inline vision feedback to minimize stringing.
Q: Can the system store multiple recipes and integrate with MES?
A: Yes—recipe storage and MES recipe push/pull are supported via standard industrial protocols.
The VS Series Desktop Dispensing Machine is your trusted solution for precision glue dispensing in smartphone camera modules and VCM manufacturing. Contact Mingseal today for detailed specifications, sample testing, or a tailored demo!
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