Seoul, South Korea — February 21, 2025 — SEMICON Korea 2025, organized by the global industry association SEMI, successfully concluded at the COEX Convention Center in Seoul. As one of the most influential semiconductor trade shows in Asia, the event brought together nearly 800 exhibitors and over 40,000 professionals from around the world to explore innovation in semiconductor materials, equipment, packaging, smart manufacturing, and automotive electronics.

Mingseal Technology, a leading provider of precision dispensing and semiconductor packaging solutions, made a strong appearance at Hall 3, Booth C642, showcasing its cutting-edge equipment and latest product innovations. The company’s presence drew attention from global clients, thanks to its strong R&D capabilities, application expertise, and one-stop manufacturing solutions.

Advanced Packaging Applications

Mingseal has long focused on advanced semiconductor packaging. Its solutions cover a wide range of processes and package types:

IC Packaging: wafer-level packaging (WLP), panel-level packaging (PLP), flip-chip BGA (FCBGA), chip-scale packaging (FCCSP), and system-in-package (SiP).
Key Processes: Underfill, Dam & Fill, Lid Attach, Solder Paste Painting, and Flux Spray.
Discrete Devices: Leadframe, substrate, and shell-type packages, supporting chip coating, potting, component reinforcement, and more.

By offering complete lifecycle services from process evaluation to equipment maintenance, Mingseal empowers customers to increase productivity and reduce costs.

Featured Products at SEMICON Korea 2025

FS200A Online Visual Dispensing System

This high-speed, multi-head, high-precision online dispenser is designed for demanding processes such as encapsulation, bonding, filling, and reinforcement. FS200A supports customized solutions for complex dispensing paths and volume control, helping customers improve manufacturing efficiency.

KPS4000 Piezo Jetting Valve

An advanced, non-contact jetting system, KPS4000 handles fluids across all viscosity levels. Its maintenance-friendly design eliminates seals and reduces consumables cost. With up to 0.01mm repeatability, it ensures reliable performance even after 20 million cycles, ideal for high-precision production lines.

KSP0450 & KDP0900 Eccentric Screw Valves

These precision volumetric dispensing valves provide stable output for single- and two-component adhesives, even with high viscosity materials. They support precise dosing, reduce glue waste, and help shorten production cycles.

Live Interaction and Global Engagement

Throughout the exhibition, Mingseal’s technical team welcomed international visitors, offering live demos and personalized consultations. Customers praised the intuitive operation, high stability, and performance of the equipment. Many expressed strong interest in future cooperation.

A Vision for the Future

With the mission of "Achieve More High-End Intelligent Manufacturing," Mingseal Technology remains committed to delivering intelligent, efficient, and reliable semiconductor dispensing solutions. Through continuous innovation, the company will keep supporting advanced packaging needs in AI, HPC, ADAS, and heterogeneous integration.