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Fully Automatic Lid Attachment Dispensing Machine for FCBGA FCCSP Solutions

1.2 Semiconductor Dispensing Machine
July 14, 2025
Category Connection: Advanced Packaging Equipment
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Tags:
#auto Dispensing Machine #automatic glue dispenser #glue dispensing equipment
Brief: Discover the FCCSP FCBGA Advanced Packaging Machine Automatic Lid Attachment System, designed for high-performance processors and AI chips. This fully automated system ensures precision with automatic dispensing position compensation and intelligent error-proofing for zero defects. Perfect for TIM glue, AD glue, and custom lid mounting applications.
Related Product Features:
  • High-precision position compensation ensures accurate glue dispensing every cycle.
  • Integrated AOI and inspection modules monitor each stage for quality assurance.
  • Modular design supports multiple loading options like magazine, tray, and tape-on-reel.
  • Dual-valve dispensing for synchronized or asynchronous operation maximizes efficiency.
  • Suitable for FCBGA and FCCSP lid attachment processes.
  • Handles TIM glue and AD glue coating with unmatched process control.
  • Flexible configuration for different throughput and process needs.
  • Supports various lid feeding methods including magazine, tray, and belt-type.
Faqs:
  • What packaging types does the SS200 support?
    The SS200 is specifically designed for FCBGA and FCCSP lid attach processes but can be adapted for other similar advanced packaging applications.
  • How does the system ensure glue dispensing accuracy?
    It uses automatic dispensing position compensation and double-valve synchronization or asynchronization to deliver uniform glue lines every cycle.
  • Can the system handle different lid feeding methods?
    Yes -- magazine, tray, belt-type, tube, or custom feeding are all supported for maximum process flexibility.
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