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| Brand Name: | Mingseal |
| Model Number: | KDC2200 |
| MOQ: | 1set |
| Price: | $750-$10000 / pcs |
| Delivery Time: | 5-60days |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union |
The VCM SMT Glue Dispensing Controller is a production‑grade valve controller optimized for high‑speed electronics assembly. It supports VCM and common pulse‑driven valves, offers per‑channel pressure and pulse shaping, and includes recipe storage, digital I/O and serial communication for line integration. Engineered for compact SMT and TWS production cells, it balances precise dispense control with easy commissioning and traceability.
Problem: In SMT and small electronics assembly, inconsistent glue volume, stringing and misplaced beads cause component shift, cosmetic defects, and rework.
Cause: These issues arise from insufficient pressure resolution, slow valve timing, poor valve/driver matching, and lack of inline verification or recipe control.
Solution: The 0.7 MPa VCM controller provides fine pressure control and fast pulse timing to stabilize deposit volume, combined with recipe management and optional inline vision/flow feedback to detect and correct defects in real time.
High pressure range (up to 0.7 MPa) for stable micro‑dispense across various adhesives.
Fast valve drive and pulse shaping to minimize stringing.
Multi‑channel support for synchronized or staggered dispensing.
Recipe storage and MES/PLC interfaces for repeatable setups and batch traceability.
Compact, rack or panel mounting for flexible line layouts.
| Model | KDC2200 |
| Dispensing method | Pneumatic pulse type |
| Main function | Automatic back suction to prevent dripping, automatic residual alarm, glue amount compensation based on liquid level detection, etc. |
| Dispensing method | TIMED mode/LINKAGE mode |
| Working pressure input | 0.3-0.4MPa |
| Working pressure output | 0.03-0.5MPa |
| Dispensing time setting range | 0.001-999.9s |
| Vacuum suction pressure setting range | (-20-0)kPa |
| Storage channel | 100CH |
| Rated power and frequency | AC220V/50Hz |
| Rated power | 15W |
| Dimensions(W*D*H) | 260*252*100mm |
| Weight | 4.5kg |
| Communication interface | RS232/RS485 |
Recipe load: operator or MES uploads pressure/pulse profile for the product.
Controller action: the unit sets channel pressure and issues timed pulses to valve drivers per channel.
Dispense verification: optional vision or flow sensors measure deposit; controller or MES adjusts recipe parameters.
Logging: process parameters and batch data are recorded for traceability.
Required deposit size & tolerance: pick controller/valve/nozzle combination that achieves target µL tolerance — for micro‑dots, prioritize higher pressure resolution and fast response.
Valve compatibility: confirm the controller supports your valve type (VCM, piezo, solenoid) and driver electrical specs.
Channel & scalability: select appropriate channel count and expansion options for multi‑head setups.
Integration: verify protocol support for PLC/MES (Modbus/RS‑485, digital I/O).
Environmental needs: choose enclosure/IP or medical/cleanroom variants if required.
Q: Which valve types are supported?
A: VCM drivers are supported; the controller also works with most pulse‑driven valves (piezo/solenoid) — confirm voltage/current specs for specialized valves.
Q: How do I calculate dispense volume per pulse?
A: Use valve flow characteristics together with pressure and pulse width. Run a short gravimetric test under production conditions to calibrate and store the recipe.
Q: What reduces stringing most effectively?
A: Fast valve response, optimized pulse widths, correct glue temperature/viscosity, minimal nozzle‑to‑part gap, and inline vision feedback.
Q: Can the controller be integrated with my PLC or MES?
A: Yes — standard serial and digital I/O protocols are supported. Confirm required protocol (Modbus/RS‑485/TTL) during ordering.
About Mingseal
Founded in 2008, Changzhou Mingseal Robot Technology Co., Ltd. is a technology-driven manufacturer of high-end equipment, specializing in connection, assembly, inspection systems, and key components for advanced semiconductor packaging and precision electronics. Our solutions are widely adopted by leading customers in sectors such as semiconductor packaging, consumer electronics, and automotive electronics. With a strong presence across Asia and the Americas, we deliver reliable support and innovation globally.
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